RN104PJ220CS

July 2012 THICK-FILM CHIP RESISTOR We, Samsung, declare that our component Chip Resistor is produced in accordance with EU RoHS directive. 1. RoHS Compliance and restriction of Br The following restricted materials are not used in packaging materials as well as products in compliance with the law and restriction. - Cd, Pb, Hg, Cr+6, As, Br and the compounds, PCB, asbestos - Bromic materials : PBBs, PBBOs, PBDO, PBDE, PBB 2. No use of materials breaking Ozone layer The following ODS materials are not used in our fabrication process. - ODS material : Freon, Haron, 1-1-1 TCE, CCl4, HCFC If you want more detailed Information,Please Visit Samsung Electro-mechanics Website [http://www.sem.samsung.com, http://www.semlcr.com] CONTENTS Operation Notes 4 Operation Notes Example of Land Pattern Design 5 Example of land Pattern Design Recommended Soldering Conditions 6 Recommended Soldering Conditions General Structure 7 General Structure General 8 General Precision 10 Precision Jumper 12 Jumper Low ohms(RC Series) 14 Low ohms (RC Series) Low ohms(RUT Series) 16 Low ohms (RUT Series) Ultra Low Ohms(RU Series) 18 Ultra Low Ohms (RU Series) Ultra Low Ohms(RUW Series) 20 Ultra Low Ohms (RUW Series) Ultra Low Ohms(RUK Series) 22 Ultra Low Ohms (RUK Series) Arrays(CONVEX Type) 24 Arrays (CONVEX Type) Arrays(CONCAVE Type) 26 Arrays (CONCAVE Type) Arrays(FLAT Type) 28 Arrays (FLAT Type) Arrays for Memory Modules 30 Arrays for Memory Modules Attenuator 32 Attenuator Characteristics Performance 34 Characteristics Performance Packaging 36 Packaging Standard Resistance Value 38 Standard Resistance Value Operation Notes Applications •Chip resistors are designed for general electronic devices such as home appliances, computer, mobile communications, digital circuit, etc. If you require our products with high reliability-performing at more than 125℃ or below -55℃- for medical equipments, aircrafts, high speed machines, military usage, and items that can affect human life or if you need to use in specific conditions (corrosive gas atmosphere like H2S etc.), please contact us beforehand. •Normal operation temperature ranges (℃): -55℃~+155℃ •Others (rectangular, array_Flat type, trimmable) : -55℃~+125℃ •Although resistor body is coated, sharp excessive impact should be avoided to prevent damages and adverse effects on characteristics (resistor value, open circuited, T.C.R.). Mounting Please give more attention not to press the chip owing to the nozzle's improper height when it is mounted on PCB. (Excessive pressure may cause exterior damage, change in resistance, circuit open, etc.) Safety precautions •These products are designed and produced for applying to the ordinary electronic equipments. (AV equipment, OA equipment,Telecommunication equipment, etc) •Consult with our sales department before applying in the devices that require extremely high reliability such as medical equipments, transport equipments, aircrafts/spacecrafts, nuclear power controllers, fuel controllers, car equipments including car accessories and other safety devices. •Following special environments, and such environmental conditions may affect the performance of the product. Please verify the performance and reliability thoroughly prior to use. a) Using in various type of Liquid including water, oil, organic solvent and other chemicals. b) Using in the places where the products are exposed to direct sunlight, sea wind, corrosive gases (including Cl2, H2S, NH3, SO2, NO2), static electricity, electromagnetic waves and dusty air. c) Using close to heat generating components or other flammable items. d) Using in the places that is sealed or coated with resins or other coating materials after soldering. e) Using in places subject to dew condensation. •These products are not radiation resistant. •The company is not responsible for any problems resulting from using of the products under the conditions not recommended herein. •The company should notify any safety issues of the products to the customer. And the safety of the products should be monitored by the customer periodically. Storage To maintain proper quality of chip components, the following precautions are required for storage environment, method and period. •Storage Environment - Make sure that the ambient temperature is within 5℃~40℃ and the ambient humidity is within 20~70%RH. - Chip components may be deformed, if the temperature of packaged components exceeds 40℃. - Do not store where the soldering properties can be deteriorated by harmful gas such as sulphurous gas, chlorine gas, etc. - Bulk packed chip components should be used as soon as the seal is opened, thus preventing the solderability from deteriorating. - The remaining unused chips should be put in the original bag and sealed again or store in a desiccator containing a desiccating agent. •Storage Time Period Stored chip components should be used within 6 months after receiving the components. If 6 months or more have elapsed, please check the solderability before actually using. Cleaning After Soldering Cleaning, soldering flux & Ionic cleaning liquid should be avoided on product. If any possibility on product, please take a test before usage. Caution for Chip Resistor Seperation from PCB. Chip resistor installation on PCB is a similar phenomenon on to a chocolate chip on top of a cake. PCB has enough flexibility on outer force but Chip resistor can be defected without any bending. (By chip resistor use of Ceramic, solder, metal) Therefore, when separating a Chip resistor from a PCB, beware of any crack on the chip. Others •Manual work Whenever separating chip resistor from PCB, do not re-use the chip resistor for circuit safety. Electrical specification of chip resistors can be changed by soldering iron after separation. Re-use of separated chip resistor should be prohibited. •Do not use more than rated voltage. (Please check the contents of each product) Example of Land Pattern Design Example of Land Pattern Design When designing P.C.B, the shape and size of the solder lands must allow for the proper amount of solder under the resistor. The amount of solder at the end terminations has a direct effect on the probability that the chip will crack. The greater amount of solder, the amount of stress on the chip, and the more likely that it will break. Use the following illustrations as guidelines for proper ‘solder lands design’. Operation Notes For Chip Type Example of land Pattern Design Recommended Soldering Conditions : Land Pattern C General Structure : Chip Resistor General B A A Precision •Reflow soldering (UNIT: mm) •Reflow soldering(RU,RUW,RUK) (UNIT: mm) •Flow soldering (UNIT: mm) C Type A B 2A+B C Type A B 2A+B C 0.54 0.18 1005 0.8 0.5 2.1 0.5 1005 0.7 0.5 1.9 0.5 0.28 1.02 0.29 1608 0.8 0.5 2.1 0.8 1608 0.9 0.8 2.6 0.8 0.6 0.5 1.7 0.5 2012 0.9 0.8 2.6 1.2 2012 1.0 1.4 3.4 1.3 0.8 0.8 2.4 0.8 3216 1.7 1.2 4.6 1.4 3216 1.4 1.8 4.6 1.6 2012 0.9 1.4 3.2 1.2 3225 1.7 1.2 4.6 2.6 3225 1.4 1.8 4.6 2.6 3216 1.3 1.8 4.4 1.5 5025 2.15 1.8 6.1 2.6 5025 1.5 3.3 6.3 2.5 3225 1.3 1.8 4.4 2.4 6432 2.3 3.0 7.6 3.3 6432 1.5 4.6 7.6 3.2 5025 1.4 3.3 6.1 2.4 6432 1.4 4.6 7.4 3.0 Type A B 2A+B 0402 0.17 0.20 0603 0.37 1005 1608 Jumper Low ohms (RC Series) Low ohms (RUT Series) Ultra Low Ohms (RU Series) Ultra Low Ohms (RUW Series) Ultra Low Ohms (RUK Series) For Array Type •Convex type Arrays (CONVEX Type) •Concave type P2 P1 P E E Arrays (CONCAVE Type) D Arrays (FLAT Type) : Land Pattern D : Chip Resistor Arrays for Memory Modules B A A C B C (UNIT: mm) (UNIT: mm) Type A B C D E P1 P2 Type A B C D E P 062P 0.20 0.20 0.30 0.30 0.30 0.6 - 102P 0.3 0.3 0.2 0.5 0.4 0.5 0.5 104P 0.3 0.3 0.2 0.5 0.4 0.5 064P 0.20 0.20 0.20 0.30 0.30 0.5 10AT 0.4 0.4 0.25 0.5 0.5 0.65 102P 0.4 0.4 0.25 0.5 0.5 0.65 104P 0.7 0.3 0.2 0.5 0.5 0.55 0.5 164P 0.7 0.5 0.3 0.9 0.8 0.9 0.8 - Attenuator Characteristics Performance Packaging Standard Resistance Value •This is the recommended land pattern for designing PCB. This pattern does not guarantee any characteristic of other product. The specifications and designs contained herein may be subject to change without notice. Please contact our sales representatives or product engineers before order. 4 5 Recommended Soldering Conditions Abstract •There are 3 soldering methods. - Flow(wave) soldering. - Reflow soldering. (Reflow soldering is broadly divided into the total heating method and local heating method.) - Iron soldering. Wave Soldering Single Wave Double Waves Total Heating Infrared Ray Convection/Infrared Hot Air Hot Plate Local Heating Laser Optical Beam Air Heater Reflow Soldering Soldering Methods Iron Soldering Since Chip resistors come into direct contact with melted solder during soldering, it is exposed to potential mechanical stress caused by the sudden temperature change. The chip resistors may also be subject to silver migration, and to contamination by the flux. Because of these factors, soldering technique is critical. Flow(wave) Soldering •Features PCB solder Primary wave Secondary wave There are two types of soldering methods in flow(wave) soldering. One is single wave soldering, the other is a double waves soldering. However, double waves soldering is mainly used. This method is designed so that the continuous and multiple dipping processes by waves of solder having completely different primary and secondary characteristics and waveforms. With the primary wave, a comparatively strong jet flow is used to remove the flux gas and to solder. With the secondary wave, it is used to remove excessive solder. With the primary wave, the solder flows into a very small gap between components and air bubbles remaining on the soldered joint are removed. With the secondary wave, the peel back is used to prevent bridging. •Preheating If a chip component is heated suddenly during soldering, it may be cracked by the thermal shock caused by the temperature difference Soldering between the surface and the inside of the chip. To prevent this, Temp.(℃) a full preheating is necessary. In case of wave soldering, the temperature difference between solder and surface of the component is kept within 150℃. Also when cooling is done by dipping into solvent, care should be taken to keep the temperature Pre-heating difference within 150℃. 245±10℃ 5 sec. max. Pre-heating Gradual Cooling in the air △T (Ⅰ)1206(3216) and below :150℃ max. Temp.(℃) •Standard Soldering Condition Soldering must be carried out without exceeding the approved soldering temperature and time shown within the shaded area of the right graph. An excessively long soldering time or high soldering temperature results in leaching of the outer terminations. When a PCB is warped, mechanical stress applied to the chip will be increased and might be a cause of chip crack, especially if there is big amount of solder on the chip. So, care should be taken not to use excessive amount of solder on the PCB. For the flow(wave) soldering, the solder amount can be controlled by land size. Time(sec.) 120 sec. min. < Flow Soldering> General Structure Reflow Soldering •Pre-heating and cooling In the reflow soldering method, a full pre-heating at the proper temperature is necessary to dry and activate solder paste. Tomb-stoning can be reduced by preheating at 150~180℃ for more than 1 minute. Also when cooling is done by dipping into solvent, care should be taken to keep the temperature difference within 150℃. •Standard Reflow Soldering Condition Soldering must be carried out without exceeding the approved soldering temperature and time shown within the shaded area of the right graph. This prevents the terminations from leaching and characteristics from deteriorating. When soldering is repeated, the allowed time is the accumulated time. 245±10℃ 10 sec. max. Pre-heating Soldering Temp.(℃) Gradual Cooling in the air 217℃ Operation Notes Example of land Pattern Design 200℃ 150℃ Recommended Soldering Conditions General Structure Time(sec.) < Reflow Soldering> •Standard solder amount When a PCB is warped, mechanical stress applied to the chip should be reduced, and for doing so, care should be taken not to use excessive amount of solder on the PCB. In case of the reflow method, the thickness of the coated solder paste is controlled to prevent excessive solder. The thickness of solder paste should be 100~300㎛. General •Tombstoning and Prevention When reflow soldering, or especially vapor phase soldering (VPS), small chip components of less than RC3216 type may break away from solder and stand on end. This is commonly known as tombstoning or the Manhattan phenomenon. Jumper - Preventing tombstoning Keep land size as small as possible. Keep the pre-heating conditions properly ( Pre-heating temperature : 150 ~ 180°, Pre-heating time : more than 1 min.) Keep the solder paste quantity not too much and uniform for every lands. Keep the position of chips properly. At around the soldering temperature, keep minimize the difference of the temperature between the electrodes of a chip. Precision Low ohms (RC Series) Low ohms (RUT Series) Ultra Low Ohms (RU Series) Ultra Low Ohms (RUW Series) Iron Soldering When using a soldering iron or any other soldering operation, the permissible temperature and time should not be exceeded that in the reflow soldering. In other to prevent the external terminations from leaching and characteristics from deteriorating, the tip of the soldering iron should not touch the chip component (ceramic element, resin case, etc.). Soldering with a soldering iron and correcting with a soldering iron can be performed right the following conditions. Ultra Low Ohms (RUK Series) Arrays (CONVEX Type) Arrays (CONCAVE Type) Item Condition Temperature at tip Soldering iron output End of soldering iron Note 350℃ Max. 20-Watt Max. Ø3mm Max. Do not directly touch the chip by the tip of the iron. Arrays (FLAT Type) Arrays for Memory Modules General Structure of the Chip Resistor Attenuator Name Main Substance Ceramic Substrate Inner Electrode Resistor Glass Coat Protective Coat Terminal Coat Ni Plate Sn Plate Al2 O 3 Ag / Cu Ag-Pd / Cu-Ni Bi2O3, SiO2 Polymer / Glass Ni-Cr Alloy /Ag Ni Sn No. The specifications and designs contained herein may be subject to change without notice. Please contact our sales representatives or product engineers before order. Characteristics Performance Packaging Standard Resistance Value 6 7 General Feature •Very small, thin, and light weight. •Both flow and reflow soldering are applicable. •Owing to the reduced lead inductance, the high frequency characteristic is excellent. •Suitable size and packaging for surface mount assembly. The product of lead-free terminal is RoHS compliant. PbO(lead oxide) is included in the glass of our product which is prescribed on RoHS appendix as an exception. Application •General purpose •Home Appliances (DVD, Digital TV, Digital Camera, Audio, Tunner) •For Computers & Communications (Notebook, Memory Module, Mobile, Network Equipment, etc) Structure and Dimensions 103 l1 W H I2 L (UNIT: mm) Type Inch Power(W) L W H I1 I2 Average Weight RC0402 RC0603 RC1005 RC1608 RC2012 RC3216 RC3225 RC5025 RC6432 01005 0201 0402 0603 0805 1206 1210 2010 2512 1/32 1/20 1/16 1/10 1/8 1/4 1/3 2/3 1 0.40±0.02 0.60±0.03 1.00±0.05 1.60±0.10 2.00±0.20 3.20±0.20 3.20±0.20 5.00±0.20 6.30±0.20 0.20±0.02 0.30±0.03 0.50±0.05 0.80±0.10 1.25±0.15 1.60±0.15 2.55±0.20 2.50±0.20 3.20±0.20 0.13±0.02 0.23±0.03 0.35±0.05 0.45±0.10 0.50±0.10 0.55±0.10 0.55±0.10 0.55±0.10 0.55±0.10 0.10±0.03 0.10±0.05 0.20±0.10 0.30±0.20 0.40±0.20 0.45±0.20 0.45±0.20 0.60±0.20 0.60±0.20 0.10±0.03 0.15±0.05 0.25±0.10 0.35±0.10 0.35±0.20 0.40±0.20 0.40±0.20 0.60±0.20 0.60±0.20 0.04㎎ 0.15㎎ 0.6㎎ 2.1㎎ 4.9㎎ 9.5㎎ 16㎎ 26㎎ 41㎎ Parts Numbering System •The part number system shall be in the following format RC Code Designation 2012 Dimension & Size Code RC: Chip Resistor 0402: 0.4×0.2(㎜) - 01005(inch) 0603: 0.6×0.3(㎜) - 0201(inch) 1005: 1.0×0.5(㎜) - 0402(inch) 1608: 1.6×0.8(㎜) - 0603(inch) 2012: 2.0×1.2(㎜) - 0805(inch) 3216: 3.2×1.6(㎜) - 1206(inch) 3225: 3.2×2.5(㎜) - 1210(inch) 5025: 5.0×2.5(㎜) - 2010(inch) 6432: 6.4×3.2(㎜) - 2512(inch) J Tolerance 100 Resistance Value F : ±1% G : ±2% J : ±5% K : ±10% 3 or 4 digits coding system (IEC coding system) 3digits (E-24 series) 4digits (E-96 series) CS Packaging Code GS: Bulk Packaging CS: Tape Packaging 7" ES: Tape Packaging 10" AS: Tape Packaging 13" Specification Power Rating (W) Type Working Overload Voltage Voltage (MAX) (MAX) RC 0402 1/32 15(V) 30(V) RC0603 RC1005 RC1608 RC2012 RC3216 RC3225 RC5025 RC6432 1/20 1/16 1/10 1/8 1/4 1/3 2/3 1 25(V) 50(V) 50(V) 100(V) 150(V) 300(V) 200(V) Resistance Range (Ω) TCR (ppm/℃) 1~99Ω: ±300 100~1 : ±250 Rated Working Temperature Rated Ambient Temperature 1Ω~1 1~9.9Ω:+300,-200 10Ω~1 :±100 (0603: ±250) 1.1 ~10 :±300 -55℃~+125℃ Operation Notes Example of land Pattern Design Recommended Soldering Conditions 70℃ 1Ω~10 -55℃~+155℃ General Structure 400(V) General √ •Rated voltage (V) = Rated power(W)×Normal resistance value (R) Rated voltage should be lower than (MAX) working voltage. Precision Power Derating Curve Jumper The rated power is the maximum continuous loading power at 70℃ ambient temperature. For ambient temperature above 70℃, the loading power follows the below power derating curve. (The load current shall be derated according to derating curve in case of the 'Jumper') Percentage of the rated dissipation(%) Percentage of the rated dissipation(%) Low ohms (RUT Series) 100 100 80 60 Operation area 40 20 0 Low ohms (RC Series) -55 70 -40 0 40 Marking Ultra Low Ohms (RUW Series) Operation area 40 Ultra Low Ohms (RUK Series) 20 0 155 70 -55 -30 0 30 60 90 120 150 Ambient Temperature(℃) •4 digits indication (E-96 series) - Left 2 digits represent significant figures. - Last 1 digit represents exponential number of 10. - Example: 103 Left 2 digits: 10 Last 1 digit: 3 103 = 10×10 3Ω = 10000Ω=10kΩ - Left 3 digits represent significant figures. - Last 1 digit represents exponential number of 10. - Example: 1002 Left 3 digits: 100 Last 1 digit: 2 1002 = 100×10 2Ω = 10000Ω=10kΩ 1002 •0603, 1005 type: No marking. •0603, 1005, 1608 type: No marking. E-96 E-24 E-96 100 102 105 107 110 113 115 118 121 124 127 130 133 137 140 143 147 150 154 158 162 165 169 174 10 178 182 187 191 196 200 205 210 215 221 226 232 237 243 249 255 261 267 274 280 287 294 301 309 11 12 13 15 16 The specifications and designs contained herein may be subject to change without notice. Please contact our sales representatives or product engineers before order. E-24 18 20 22 24 27 30 E-96 316 324 332 340 348 357 365 374 383 392 402 412 422 432 442 453 464 475 487 499 511 523 536 549 E-24 33 36 39 43 47 51 Arrays (CONVEX Type) Arrays (CONCAVE Type) IEC Code System (E-96, E-24) •3 digits indication (E-24 series) 103 60 125 80 120 Ambient Temperature(℃) Ultra Low Ohms (RU Series) 80 E-96 E-24 562 576 590 604 619 634 649 665 681 698 715 732 750 768 787 806 825 845 866 887 909 931 953 976 56 Arrays (FLAT Type) Arrays for Memory Modules 62 Attenuator 68 75 Characteristics Performance Packaging 82 Standard Resistance Value 91 8 9 Precision Feature •Low tolerance (±0.5%) •Both flow and reflow soldering are applicable. •Suitable size and packaging for surface mount assembly. •Owing to the reduced lead inductance, the high frequency characteristic is excellent. The product of lead-free terminal is RoHS compliant. PbO(lead oxide) is included in the glass of our product which is prescribed on RoHS appendix as an exception. Application •Circuit for high precision resistance and reliability. •For signal control part •For tunning circuit. Structure and Dimensions 1002 l1 W H I2 L (UNIT: mm) Type Inch Power(W) L W H I1 I2 Average Weight RC1005 RC1608 RC2012 RC3216 RC3225 RC5025 RC6432 0402 0603 0805 1206 1210 2010 2512 1/16 1/10 1/8 1/4 1/3 2/3 1 1.00±0.05 1.60±0.10 2.00±0.20 3.20±0.20 3.20±0.20 5.00±0.20 6.30±0.20 0.50±0.05 0.80±0.10 1.25±0.15 1.60±0.15 2.55±0.20 2.50±0.20 3.20±0.20 0.35±0.05 0.45±0.10 0.50±0.10 0.55±0.10 0.55±0.10 0.55±0.10 0.55±0.10 0.20±0.10 0.30±0.20 0.40±0.20 0.45±0.20 0.45±0.20 0.60±0.20 0.60±0.20 0.25±0.10 0.35±0.10 0.35±0.20 0.40±0.20 0.40±0.20 0.60±0.20 0.60±0.20 0.6㎎ 2.1㎎ 4.9㎎ 9.5㎎ 16㎎ 26㎎ 41㎎ Parts Numbering System •The part number system shall be in the following format RC Code Designation 1005 Dimension & Size Code RC: Chip Resistor 1005: 1.0×0.5(㎜) - 0402(inch) 1608: 1.6×0.8(㎜) - 0603(inch) 2012: 2.0×1.2(㎜) - 0805(inch) 3216: 3.2×1.6(㎜) - 1206(inch) 3225: 3.2×2.5(㎜) - 1210(inch) 5025: 5.0×2.5(㎜) - 2010(inch) 6432: 6.4×3.2(㎜) - 2512(inch) D Tolerance 1002 Resistance Value CS Packaging Code D : ±0.5% 3 or 4 digits coding system (IEC coding system) 3digits (E-24 series) 4digits (E-96 , E-192 series) GS: Bulk Packaging CS: Tape Packaging 7" ES: Tape Packaging 10" AS: Tape Packaging 13" Specification Working Overload Voltage Voltage (MAX) (MAX) Power Rating (W) Type RC1005 RC1608 RC2012 RC3216 RC3225 RC5025 RC6432 1/16 1/10 1/8 1/4 1/3 2/3 1 50(V) 100(V) 150(V) 300(V) 200(V) 400(V) Rated Working Temperature Rated Ambient Temperature Resistance Range (Ω) TCR (ppm/℃) Operation Notes Example of land Pattern Design 1~9.9Ω:±300 10Ω~1 :±100 1.1 ~10 :±300 70℃ 1Ω~10 -55℃~+155℃ Recommended Soldering Conditions General Structure √ •Rated voltage (V) = Rated power(W)×Normal resistance value (R) Rated voltage should be lower than (MAX) working voltage. General Marking Power Derating Curve The rated power is the maximum continuous loading power at 70℃ ambient temperature. For ambient temperature above 70℃, the loading power follows the below power derating curve. Percentage of the rated dissipation(%) 100 80 60 Operation area 40 •3 digits indication (E-24 series) •4 digits indication (E-96 , E-192 series) - Left 2 digits represent significant figures. - Last 1 digit represents exponential number of 10. - Example: 103 Left 2 digits: 10 Last 1 digit: 3 103 = 10×10 3Ω = 10000Ω=10kΩ - Left 3 digits represent significant figures. - Last 1 digit represents exponential number of 10. - Example: 1002 Left 3 digits: 100 Last 1 digit: 2 1002 = 100×10 2Ω = 10000Ω=10kΩ 103 20 0 Precision -55 70 -30 0 30 60 155 90 120 150 Ambient Temperature(℃) Low ohms (RC Series) Low ohms (RUT Series) Ultra Low Ohms (RU Series) Ultra Low Ohms (RUW Series) 1002 •1005 type: No marking. Jumper Ultra Low Ohms (RUK Series) •1005, 1608 type: No marking. Arrays (CONVEX Type) Significant Figure of Resistance Value Arrays (CONCAVE Type) E192 E96 E24 E192 E96 E24 E192 E96 E24 E192 E96 E24 E192 E96 E24 E192 E96 E24 E192 E96 E24 E192 E96 E24 100 101 102 104 105 106 107 109 110 111 113 114 115 117 118 120 121 123 124 126 127 129 130 132 100 10 102 105 107 110 11 113 115 118 12 121 124 127 130 13 133 135 137 138 140 142 143 145 147 149 150 152 154 156 158 160 162 164 165 167 169 172 174 176 133 137 140 143 147 150 15 154 158 16 162 165 169 174 178 180 182 184 187 189 191 193 196 198 200 203 205 208 210 213 215 218 221 223 226 229 232 234 178 18 182 187 191 196 200 20 205 210 215 221 226 232 22 237 240 243 246 249 252 255 258 261 264 267 271 274 277 280 284 287 291 294 298 301 305 309 312 237 24 243 249 255 261 267 27 274 280 287 294 301 309 30 316 320 324 328 332 336 340 344 348 352 357 361 365 370 374 379 383 388 392 397 402 407 412 417 316 324 332 33 340 348 357 36 365 374 383 392 402 412 39 422 427 432 437 442 448 453 459 464 470 475 481 487 493 499 505 511 517 523 530 536 542 549 556 The specifications and designs contained herein may be subject to change without notice. Please contact our sales representatives or product engineers before order. 422 432 43 442 453 464 47 475 487 499 511 523 536 549 51 562 569 576 583 590 597 604 612 619 626 634 642 649 657 665 673 681 690 698 706 715 723 732 741 562 56 576 590 604 619 62 634 649 665 681 698 715 732 68 750 759 768 777 787 796 806 816 825 835 845 856 866 876 887 898 909 920 931 942 953 965 976 988 750 75 Arrays (FLAT Type) 768 Arrays for Memory Modules 787 806 825 82 845 Characteristics Performance 866 887 909 931 Attenuator Packaging 91 Standard Resistance Value 953 976 10 11 Jumper Feature •Very small, thin, and light weight. •Both flow and reflow soldering are applicable. •Owing to the reduced lead inductance, the high frequency characteristic is excellent. •Suitable size and packaging for surface mount assembly. The product of lead-free terminal is RoHS compliant. PbO(lead oxide) is included in the glass of our product which is prescribed on RoHS appendix as an exception. Application •General purpose •Home Appliances (DVD, Digital TV, Digital Camera, Audio, Tunner) •For Computers & Communications (Notebook, Memory Module, Mobile, Network Equipment, etc) Structure and Dimensions 000 000 W A1 l1 A2 L L P T I2 T W I2 (UNIT: mm) Type Inch Power(W) L W T RC0402 RC0603 RC1005 RC1608 RC2012 RC3216 RC3225 RC5025 RC6432 RP102P RP104P RP164P 01005 0201 0402 0603 0805 1206 1210 2010 2512 0404 0804 1206 1/32 1/20 1/16 1/10 1/8 1/4 1/3 2/3 1 1/16 1/16 1/16 0.40±0.02 0.60±0.03 1.00±0.05 1.60±0.10 2.00±0.20 3.20±0.20 3.20±0.20 5.00±0.20 6.30±0.20 1.00±0.10 2.00±0.10 3.20±0.10 0.20±0.02 0.30±0.03 0.50±0.05 0.80±0.10 1.25±0.15 1.60±0.15 2.55±0.20 2.50±0.20 3.20±0.20 1.00±0.10 1.00±0.10 1.60±0.10 0.13±0.02 0.23±0.03 0.35±0.05 0.45±0.10 0.50±0.10 0.55±0.10 0.55±0.10 0.55±0.10 0.55±0.10 0.35±0.10 0.35±0.10 0.50±0.10 A1 A2 0.33±0.10 0.33±0.10 0.40±0.15 0.30±0.15 0.60±0.15 0.40±0.15 I1 0.10±0.03 0.10±0.05 0.20±0.10 0.30±0.20 0.40±0.20 0.45±0.20 0.45±0.20 0.60±0.20 0.60±0.20 0.20±0.10 0.15±0.10 0.30±0.15 I2 P 0.10±0.03 0.15±0.05 0.25±0.10 0.35±0.10 0.35±0.20 0.40±0.20 0.40±0.20 0.60±0.20 0.60±0.20 0.25±0.10 0.65±0.10 0.25±0.10 0.50±0.15 0.30±0.15 0.80±0.15 Average Weight 0.04㎎ 0.15㎎ 0.6㎎ 2.1㎎ 4.9㎎ 9.5㎎ 16㎎ 26㎎ 41㎎ 1.1㎎ 2.2㎎ 8.9㎎ Parts Numbering System •The part number system shall be in the following format RC Code Designation 2012 Dimension & Size Code RC: Chip Resistor RP : Array 0402: 0.4×0.2(㎜) - 01005(inch) 0603: 0.6×0.3(㎜) - 0201(inch) 1005: 1.0×0.5(㎜) - 0402(inch) 1608: 1.6×0.8(㎜) - 0603(inch) 2012: 2.0×1.2(㎜) - 0805(inch) 3216: 3.2×1.6(㎜) - 1206(inch) 3225: 3.2×2.5(㎜) - 1210(inch) 5025: 5.0×2.5(㎜) - 2010(inch) 6432: 6.4×3.2(㎜) - 2512(inch) 102P: 1.0×1.0(㎜) - 0404(inch) 104P: 2.0×1.0(㎜) - 0804(inch) 164P: 3.2×1.6(㎜) - 1206(inch) J Tolerance CS Packaging Code 000 Resistance Value Operation Notes Example of land Pattern Design GS: Bulk Packaging CS: Tape Packaging 7" ES: Tape Packaging 10" AS: Tape Packaging 13" Jumer: 000 J : Max 50 Ω Recommended Soldering Conditions General Structure General Precision Jumper Resistors Current Rating Resistance Type RC0402 RC0603 RC1005 RC1608 RC2012 RC3216 RC3225 RC5025 RC6432 RP102P RP104P RP164P Rated Ambient Temperature 0.5 (A) Jumper Rated Working Temperature Marking -55℃ ~ +125℃ Low ohms (RC Series) X 1.0 (A) Low ohms (RUT Series) 50 Ωmax 2.0 (A) Ultra Low Ohms (RU Series) O 70℃ -55℃ ~ +155℃ 1 ~ 1M Ultra Low Ohms (RUW Series) X O 1.0 (A) Ultra Low Ohms (RUK Series) Arrays (CONVEX Type) Power Derating Curve Arrays (CONCAVE Type) The rated power is the maximum continuous loading power at 70℃ ambient temperature. For ambient temperature above 70℃, the loading power follows the below power derating curve. (The load current shall be derated according to derating curve in case of the 'Jumper') 100 Percentage of the rated dissipation(%) Percentage of the rated dissipation(%) 100 80 60 Operation area 40 20 0 Arrays (FLAT Type) -55 70 -40 0 40 80 Attenuator 60 Operation area 40 Characteristics Performance 20 125 80 120 Ambient Temperature(℃) Arrays for Memory Modules 0 70 -55 -30 The specifications and designs contained herein may be subject to change without notice. Please contact our sales representatives or product engineers before order. 0 30 60 155 90 120 150 Ambient Temperature(℃) Packaging Standard Resistance Value 12 13 Low Ohms(RC Series) Feature •Under 1 ohms, precision resistance. •Both flow and reflow soldering are applicable. •The product of lead-free terminal is RoHS compliant. 100% Lead-free Products (PbO is not used) Application •Current detect. •Safe circuit through protecting over-current flow. •Power supplying part, DC power charger, adapter. •Mobile Phone, HDD, DSC, LCD. Structure and Dimensions R100 l1 W H I2 L (UNIT: mm) Average Weight Type Inch Power(W) L W H I1 I2 RC1005 RC1608 RC2012 RC3216 RC3225 RC5025 RC6432 0402 0603 0805 1206 1210 2010 2512 1/16 1/10 1/8 1/ 4 1/3 2/3 1 1.00±0.05 1.60±0.10 2.00±0.20 3.20±0.20 3.20±0.20 5.00±0.20 6.30±0.20 0.50±0.05 0.80±0.10 1.25±0.15 1.60±0.15 2.55±0.20 2.50±0.20 3.20±0.20 0.35±0.05 0.45±0.10 0.50±0.10 0.55±0.10 0.55±0.10 0.55±0.10 0.55±0.10 0.20±0.10 0.30±0.20 0.40±0.20 0.45±0.20 0.45±0.20 0.60±0.20 0.60±0.20 0.25±0.10 0.35±0.10 0.35±0.20 0.40±0.20 0.40±0.20 0.60±0.20 0.60±0.20 0.6㎎ 2.1㎎ 4.9㎎ 9.5㎎ 16㎎ 26㎎ 41㎎ Parts Numbering System •The part number system shall be in the following format RC Code Designation 6432 Dimension & Size Code J Tolerance R680 Resistance Value CS Packaging Code RC: Chip Resistor 1005: 1.0×0.5(㎜) - 0402(inch) 1608: 1.6×0.8(㎜) - 0603(inch) 2012: 2.0×1.2(㎜) - 0805(inch) 3216: 3.2×1.6(㎜) - 1206(inch) 3225: 3.2×2.5(㎜) - 1210(inch) 5025: 5.0×2.5(㎜) - 2010(inch) 6432: 6.4×3.2(㎜) - 2512(inch) F: ±1% G: ±2% J: ±5% 3 or 4 digits coding system (E-24 series) GS: Bulk Packaging CS: Tape Packaging 7" ES: Tape Packaging 10" AS: Tape Packaging 13" Specification Power Rating (W) Type RC1005 RC1608 RC2012 RC3216 RC3225 RC5025 RC6432 1/16 1/10 1/8 1/4 1/3 2/3 1 Working Voltage (V, MAX) TCR (ppm/℃) √(P×R) 0.1Ω≤R≤0.2Ω :+700,- 600 R > 0.2Ω:±250 Resistance Range (Ω) Rated Rated Working Ambient Temperature Temperature Example of land Pattern Design 0.1~0.98 70℃ -55~+155℃ Recommended Soldering Conditions General Structure √ •Rated voltage (V) = Rated power(W)×Normal resistance value (R) Rated voltage should be lower than (MAX) working voltage. Power Derating Curve Percentage of the rated dissipation(%) 100 60 Operation area 40 20 70 0 30 60 155 90 120 Precision E-24 series Jumper 3 digits indication - R means decimal point. - Other digits represent significant value. - Example: R22 Left 1 digit: R Last 2 digits: 22 R22 = 0.22Ω 80 -55 -30 General Marking The rated power is the maximum continuous loading power at 70℃ ambient temperature. For ambient temperature above 70℃, the loading power follows the below power derating curve. 0 Operation Notes R22 4 digits indication - R means decimal point. - Other digits represent significant value. -Example: R075 Left 1 digit: R Last 3 digits:075 R075 = 0.075Ω R075 150 Ambient Temperature(℃) Low ohms (RC Series) Low ohms (RUT Series) Ultra Low Ohms (RU Series) Ultra Low Ohms (RUW Series) Ultra Low Ohms (RUK Series) Arrays (CONVEX Type) Arrays (CONCAVE Type) Resistance Value Table •E-24 series Code R-value Code R-value R10 0.10Ω R33 0.33Ω R11 0.11Ω R36 0.36Ω R12 0.12Ω R39 0.39Ω R13 0.13Ω R43 0.43Ω R15 0.15Ω R47 0.47Ω R16 0.16Ω R51 0.51Ω R18 0.18Ω R56 0.56Ω R20 0.20Ω R62 0.62Ω R22 0.22Ω R68 0.68Ω R24 0.24Ω R75 0.75Ω R27 0.27Ω R82 0.82Ω R30 0.30Ω R91 0.91Ω The specifications and designs contained herein may be subject to change without notice. Please contact our sales representatives or product engineers before order. Arrays (FLAT Type) Arrays for Memory Modules Attenuator Characteristics Performance Packaging Standard Resistance Value 14 15 Low Ohms(RUT Series) Feature •Under 1 ohms, precision resistance. •Both flow and reflow soldering are applicable. •Ag metal is not used for termination electrode. (Good Sulfide -Resistant) •The product of lead-free terminal is RoHS compliant. 100% Lead-free Products (PbO is not used) Application •Current detect. •Safe circuit through protecting over-current flow. •Power supplying part, DC power charger, adapter. •Mobile Phone, HDD, DSC, LCD. Structure and Dimensions R100 l1 W H I2 L (UNIT: mm) Type Inch RUT1005 0402 RUT1608 0603 RUT2012 0805 Power(W) 1/10 L W H I1 I2 Average Weight 1.00±0.05 0.50±0.05 0.35±0.05 0.20±0.10 0.25±0.10 0.6㎎ 1/8 1.60±0.10 0.80±0.10 0.45±0.10 0.30±0.20 0.35±0.10 2.1㎎ 1/4 (0.25) 2.00±0.20 1.25±0.15 0.50±0.10 0.40±0.20 0.35±0.20 4.9㎎ 1/3 1.60±0.15 0.55±0.10 0.45±0.20 0.40±0.20 9.5㎎ (0.1) (0.125) RUT3216 1206 (0.33) 3.20±0.20 RUT3225 1210 (0.50) 1/2 3.20±0.20 2.55±0.20 0.55±0.10 0.45±0.20 0.40±0.20 16㎎ RUT5025 2010 (0.66) 2/3 5.00±0.20 2.50±0.20 0.55±0.10 0.60±0.20 0.60±0.20 26㎎ RUT6432 2512 (1.0) 1 6.30±0.20 3.20±0.20 0.55±0.10 0.60±0.20 0.60±0.20 41㎎ Parts Numbering System •The part number system shall be in the following format RUT Code Designation 2012 Dimension & Size Code J Tolerance RUT: Current Sensing Resistor Top Mounting (Face-up) 1005: 1.0×0.5(㎜) - 0402(inch) 1608: 1.6×0.8(㎜) - 0603(inch) 2012: 2.0×1.2(㎜) - 0805(inch) 3216: 3.2×1.6(㎜) - 1206(inch) 3225: 3.2×2.5(㎜) - 1210(inch) 5025: 5.0×2.5(㎜) - 2010(inch) 6432: 6.4×3.2(㎜) - 2512(inch) F: ±1% G: ±2% J: ±5% R680 Resistance Value CS Packaging Code 3 or 4 digits coding system GS: Bulk Packaging CS: Tape Packaging 7" ES : Tape Packaging 10" AS: Tape Packaging 13" (IEC conding system) 3digits(E-24 series) 4digits(E-96 series) Specification Type Power Rating (W) RUT1005 1/10 Working Voltage (V, MAX) Rated Rated Working Ambient Temperature Temperature Resistance Range (Ω) TCR (ppm/℃) Operation Notes (0.1) Example of land Pattern Design 1/8 RUT1608 (0.125) RUT2012 (0.25) RUT3216 (0.33) RUT3225 (0.50) RUT5025 (0.66) RUT6432 (1.0) 1/4 √(P×R) 1/3 0.1~0.98 ±150 70℃ -55~+155℃ Recommended Soldering Conditions 1/2 General Structure 2/3 1 General √ •Rated voltage (V) = Rated power(W)×Normal resistance value (R) Rated voltage should be lower than (MAX) working voltage. Power Derating Curve The rated power is the maximum continuous loading power at 70℃ ambient temperature. For ambient temperature above 70℃, the loading power follows the below power derating curve. Percentage of the rated dissipation(%) 100 80 60 Operation area 40 20 0 -55 -30 70 0 30 155 60 Precision Marking 90 120 Jumper E-24 series 4 digits indication Low ohms (RC Series) - R means decimal point. - Other digits represent significant value. - Example: R22 Left 1 digit: R Last 2 digits: 22 R22 = 0.22Ω - R means decimal point. - Other digits represent significant value. -Example: R075 Left 1 digit: R Last 3 digits:075 R075 = 0.075Ω Low ohms (RUT Series) R22 R075 3 digits indication 150 Arrays (CONVEX Type) Resistance Value Table Arrays (CONCAVE Type) Tol Value Tol Value Tol Value Tol Value Tol Value Tol (%) Code (Ω) (%) Code (Ω) (%) Code (Ω) (%) Code (Ω) (%) Code (Ω) (%) ±1, ±5 ±1 ±1 ±1 ±1, ±5 ±1 ±1 ±1 ±1, ±5 ±1 ±1 ±1 ±1, ±5 ±1 ±1 ±1 ±1 ±1 ±1, ±5 R154 R158 R160 R162 R165 R169 R174 R178 R180 R182 R187 R191 R196 R200 R205 R210 R215 R220 R221 0.154 0.158 0.16 0.162 0.165 0.169 0.174 0.178 0.180 0.182 0.187 0.191 0.196 0.200 0.205 0.21 0.215 0.22 0.221 ±1 ±1 ±1, ±5 ±1 ±1 ±1 ±1 ±1 ±1, ±5 ±1 ±1 ±1 ±1 ±1, ±5 ±1 ±1 ±1 ±1, ±5 ±1 Ultra Low Ohms (RUW Series) Ultra Low Ohms (RUK Series) Ambient Temperature(℃) Code Value (Ω) R100 0.1 R102 0.102 R105 0.105 R107 0.107 R110 0.11 R113 0.113 R115 0.115 R118 0.118 R120 0.12 R121 0.121 R124 0.124 R127 0.127 R130 0.13 R133 0.133 R137 0.137 R140 0.14 R143 0.143 R147 0.147 R150 0.15 Ultra Low Ohms (RU Series) R226 R232 R237 R240 R243 R249 R255 R261 R267 R270 R274 R280 R287 R294 R300 R301 R309 R316 R24 0.226 ±1 R330 0.33 ±1, ±5 0.232 ±1 R332 0.332 ±1 0.237 ±1 R340 0.34 ±1 0.24 ±1, ±5 R348 0.348 ±1 0.243 ±1 R357 0.357 ±1 0.249 ±1 R360 0.36 ±1, ±5 0.255 ±1 R365 0.365 ±1 0.261 ±1 R374 0.374 ±1 0.267 ±1 R383 0.383 ±1 0.27 ±1, ±5 R390 0.39 ±1, ±5 0.274 ±1 R392 0.392 ±1 0.28 ±1 R402 0.402 ±1 0.287 ±1 R412 0.412 ±1 0.294 ±1 R422 0.422 ±1 0.3 ±1, ±5 R430 0.43 ±1, ±5 0.301 ±1 R432 0.432 ±1 0.309 ±1 R442 0.442 ±1 0.316 ±1 R453 0.453 ±1 0.324 ±1 R464 0.464 ±1 R470 R475 R487 R499 R510 R511 R523 R536 R549 R560 R562 R576 R590 R604 R619 R620 R634 R649 R665 0.47 0.475 0.487 0.499 0.51 0.511 0.523 0.536 0.549 0.56 0.562 0.576 0.59 0.604 0.619 0.62 0.634 0.649 0.665 ±1, ±5 ±1 ±1 ±1 ±1, ±5 ±1 ±1 ±1 ±1 ±1, ±5 ±1 ±1 ±1 ±1 ±1 ±1, ±5 ±1 ±1 ±1 R680 R681 R698 R715 R732 R750 R768 R787 R806 R820 R825 R845 R866 R887 R909 R910 R931 R953 R976 0.68 0.681 0.698 0.715 0.732 0.75 0.768 0.787 0.806 0.82 0.825 0.845 0.866 0.887 0.909 0.91 0.931 0.953 0.976 ±1, ±5 ±1 ±1 ±1 ±1 ±1, ±5 ±1 ±1 ±1 ±1, ±5 ±1 ±1 ±1 ±1 ±1 ±1, ±5 ±1 ±1 ±1 Arrays (FLAT Type) Arrays for Memory Modules Attenuator Characteristics Performance Packaging Standard Resistance Value 16 The specifications and designs contained herein may be subject to change without notice. Please contact our sales representatives or product engineers before order. 17 Ultra Low Ohms(RU Series) Feature •Ultra Low Ohms Resistor, high precision reliability •Suitable for reflow and soldering. •Reverse Type. •Ag metal is not used for termination electrode. (Good Sulfide -Resistant) •100% Lead-free Products (PbO is not used) •RoHS Compliant. Application •Current Sensings. •Safe circuit through protecting over current flow. •Power supplying part, DC power charger, adapter. •Mobile Phone, Mobile PC, Note PC, HDD, DSC, LCD Structure and Dimensions R010 l1 W L H I2 (UNIT: mm) Average Weight Type Inch Power(W) L W H I1 I2 RU1005 0402 (0.125) 1/8 1.00±0.05 0.50±0.05 0.35±0.05 0.25±0.15 0.25±0.15 0.6㎎ RU1608 0603 (0.25) 1/4 1.60±0.10 0.80±0.10 0.45±0.10 0.30±0.20 2.2㎎ RU2012 0805 (0.33) 1/3 2.00±0.20 1.25±0.15 0.55±0.10 0.40±0.20 RU3216 1206 1/ 2 (0.5) 3.20±0.20 1.60±0.15 0.60±0.10 0.45±0.20 RU3225 1210 2/ 3 3.20±0.20 2.55±0.20 0.55±0.10 0.45±0.20 RU5025 2010 3/ 4 5.00±0.20 2.50±0.20 0.60±0.10 0.80±0.20 RU6432 2512 1 6.30±0.20 3.20±0.20 0.60±0.10 1.00±0.20 R 〈0.03Ω:0.50±0.20 R≥0.03Ω:0.35±0.20 R 〈0.03Ω:0.65±0.20 R≥0.03Ω:0.40±0.20 R 〈0.03Ω:0.90±0.20 R≥0.03Ω:0.60±0.20 R 〈0.03Ω:1.2±0.20 R≥0.03Ω:0.75±0.20 R 〈0.03Ω:1.5±0.20 R≥0.03Ω:0.90±0.20 R 〈0.03Ω:1.90±0.20 R≥0.03Ω:1.10±0.25 (0.66) (0.75) (1.0) 4.7㎎ 9.4㎎ 9.5㎎ 27㎎ 42㎎ Parts Numbering System •The part number system shall be in the following format RU Code Designation 2012 Dimension & Size Code F Tolerance R051 Resistance Value CS Packaging Code RU : Current sensing resistor 1005: 1.0×0.5(㎜) - 0402(inch) 1608: 1.6×0.8(㎜) - 0603(inch) 2012: 2.0×1.2(㎜) - 0805(inch) 3216: 3.2×1.6(㎜) - 1206(inch) 3225: 3.2×2.5(㎜) - 1210(inch) 5025: 5.0×2.5(㎜) - 2010(inch) 6432: 6.4×3.2(㎜) - 2512(inch) F: ±1% G: ±2% J: ±5% 3 or 4 digits coding system (E-24 series) CS: Tape Packaging 7" ES : Tape Packaging 10" AS: Tape Packaging 13" Specification Type Power Rating (W) RU1005 1/8 (0.125) RU1608 1/4 (0.25) RU2012 1/3 (0.33) RU3216 1/2 (0.5) RU3225 2/3 (0.66) RU5025 3/4 (0.75) RU6432 1 (1) Working Voltage (V, MAX) Tolerance (%) Resistance Range (Ω) T.C.R (ppm/℃) 25m~100m R〈47m:±500 R≥47m:±150 Rated Rated Working Ambient Temperature Temperature Example of land Pattern Design R≤25m:±600 R〈33m:±400 R≥33m:±150 F:±1 J:±5 √(P×R) Recommended Soldering Conditions 70℃ 10m~100m R≤25m:±500 R〈33m:±350 R≥33m:±150 -55℃~+155℃ General Structure General Precision Jumper •Working voltage = Rated voltage(Vr)=(P×R) (P:Rated Power, R:Norminal Resistance) Please contact our sales representatives or product engineers for lower T.C.R or higher rated power products. Power Derating Curve Marking The rated power is the maximum continuous loading power at 70℃ ambient temperature. For ambient temperature above 70℃, the loading power follows the below power derating curve. 4 digits indication (E-24 series) - R means decimal point. - Other digits represent significant value. - Example: R010 Left 1 digit: R Last 3 digits:010 R010 = 0.010Ω = 10mΩ 100 Percentage of the rated dissipation(%) Operation Notes 80 60 Operation area Low ohms (RC Series) Low ohms (RUT Series) Ultra Low Ohms (RU Series) Ultra Low Ohms (RUW Series) Ultra Low Ohms (RUK Series) Arrays (CONVEX Type) 40 R010 20 0 -55 70 -30 0 30 60 155 90 120 Arrays (CONCAVE Type) Arrays (FLAT Type) 150 Ambient Temperature(℃) Arrays for Memory Modules Performance Characteristics Attenuator Item Requirement dR% Test Method Resistance within specified tolerance T.C.R within specified T.C.R 20℃/-55℃ & 20℃/+125℃ Overload(Short time) ±(1.0%+0.0005Ω) Rated Voltage×2.5 for 5sec. at 25℃. Kelvin Probing Method. Characteristics Performance Packaging Rated Voltage×2.5 Overload(Intermittent) ±(3.0%+0.0005Ω) Resistance to solder Heat ±(1.0%+0.0005Ω) 260℃±5℃, 10±1sec Moisture Resistance ±(3.0%+0.0005Ω) 40℃, 95%RH, 1,000hr, 1.5hr On/0.5hr off cycle Endurance at 70℃ ±(3.0%+0.0005Ω) 70℃, 1,000hr, 1.5hr On/0.5hr off cycle Bending strength ±(1.0%+0.0005Ω) 60mm/min speed, Press until 3mm, keep 5sec 1sec on, 25sec off 10,000cycies. Standard Resistance Value 18 The specifications and designs contained herein may be subject to change without notice. Please contact our sales representatives or product engineers before order. 19 Ultra Low Ohms(RUW Series) Feature •Ultra Low Ohms Resistor, high precision reliability •Suitable for reflow and soldering. •Very stable Temperature coefficient characteristics. •Reverse Type. •Ag metal is not used for termination electrode (Good Sulfide -Resistant) •100% Lead-free Products (PbO is not used) •RoHS Compliant. Application •Current Sensings. •Safe circuit through protecting over current flow. •Power supplying part, DC power charger, adapter. •Mobile Phone, Mobile PC, Note PC, HDD, DSC, LCD Structure and Dimensions R010 l1 W L H I2 (UNIT: mm) Power(W) Type Inch RUW1608 0603 RUW2012 0805 1/3 (0.33) 1/2 (0.5) RUW3216 1206 1 (1) L W H I1 1.60±0.10 0.80±0.10 0.45±0.10 0.30±0.20 2.00±0.20 1.25±0.15 0.55±0.10 0.40±0.20 3.20±0.20 1.60±0.15 0.60±0.10 0.45±0.20 Average Weight I2 R 〈0.03Ω:0.50±0.20 R≥0.03Ω:0.35±0.20 R 〈0.03Ω:0.65±0.20 R≥0.03Ω:0.40±0.20 R 〈0.03Ω:0.90±0.20 R≥0.03Ω:0.60±0.20 2.2㎎ 4.7㎎ 9.4㎎ Parts Numbering System •The part number system shall be in the following format RUK Code Designation RUW : Current Sensing Resistor High Power 2012 Dimension & Size Code F Tolerance R010 Resistance Value 1608: 1.6×0.8(㎜) - 0603(inch) 2012: 2.0×1.2(㎜) - 0805(inch) 3216: 3.2×1.6(㎜) - 1206(inch) F: ±1% G: ±2% J: ±5% 3 or 4 digits coding system (IEC conding system) 3digits(E-24 series) 4digits(E-96 series) CS Packaging Code GS: Bulk Packaging CS: Tape Packaging 7" ES: Tape Packaging 10" AS: Tape Packaging 13" Specification Working Voltage Tolerance (%) (Vr) Power Rating (W) Type RUW1608 1/3 (0.33) RUW2012 1/2 (0.5) RUW3216 1 (1) Resistance Range (Ω) Rated Working Temperature R≤25m:±600 R〈33m:±400 R≥33m:±150 F:±1 J:±5 F:±1 J:±5 √(P×R) Rated Ambient Temperature T.C.R (ppm/℃) 10m~100m Example of land Pattern Design R〈25m:±600 R〈33m:±400 R≥33m:±150 70℃ R〈25m:±500 R〈33m:±350 R≥33m:±150 F:±1 J:±5 Operation Notes -55℃~+155℃ Recommended Soldering Conditions General Structure General •Working voltage = Rated voltage(Vr)=(P×R) (P:Rated Power, R:Norminal Resistance) Please contact our sales representatives or product engineers for lower T.C.R or higher rated power products. Precision Power Derating Curve Marking The rated power is the maximum continuous loading power at 70℃ ambient temperature. For ambient temperature above 70℃, the loading power follows the below power derating curve. 4 digits indication (E-24 series) - R means decimal point. - Other digits represent significant value. - Example: R010 Left 1 digit: R Last 3 digits:010 R010 = 0.010Ω = 10mΩ Percentage of the rated dissipation(%) 100 80 60 Operation area Jumper Low ohms (RC Series) Low ohms (RUT Series) Ultra Low Ohms (RU Series) Ultra Low Ohms (RUW Series) 40 R010 20 0 -55 70 -30 0 30 60 155 90 120 Ultra Low Ohms (RUK Series) Arrays (CONVEX Type) 150 Ambient Temperature(℃) Arrays (CONCAVE Type) Performance Characteristics Arrays (FLAT Type) Item Requirement dR% Test Method Resistance within specified tolerance T.C.R within specified T.C.R 20℃/-55℃ & 20℃/+125℃ Overload(Short time) ±(1.0%+0.0005Ω) Rated Voltage×2.5 for 5sec. Overload(Intermittent) ±(3.0%+0.0005Ω) Resistance to solder Heat ±(1.0%+0.0005Ω) 260℃±5℃, 10±1sec Moisture Resistance ±(3.0%+0.0005Ω) 40℃, 95%RH, 1,000hr, 1.5hr On/0.5hr off cycle Endurance at 70℃ ±(3.0%+0.0005Ω) 70℃, 1,000hr, 1.5hr On/0.5hr off cycle Bending strength ±(1.0%+0.0005Ω) 60mm/min speed, Press until 3mm, keep 5sec at 25℃. Kelvin Probing Method. Rated Voltage×2.5 1sec on, 25sec off 10,000cycies. The specifications and designs contained herein may be subject to change without notice. Please contact our sales representatives or product engineers before order. Arrays for Memory Modules Attenuator Characteristics Performance Packaging Standard Resistance Value 20 21 Ultra Low Ohms(RUK Series) Feature •Ultra Low Ohms Resistor, high precision reliability •Suitable for reflow and soldering. •Very stable Temperature coefficient characteristics. •Reverse Type. •Ag metal is not used for termination electrode. (Good Sulfide -Resistant) •100% Lead-free Products (PbO is not used) •RoHS Compliant. Application •Current Sensings. •Safe circuit through protecting over current flow. •Power supplying part, DC power charger, adapter. •Mobile Phone, Mobile PC, Note PC, HDD, DSC, LCD Structure and Dimensions R010 l1 W L H I2 (UNIT: mm) Type Inch Power(W) L W H I1 I2 Average Weight RUK1608 0603 (0.33) 1/3 1.60±0.10 0.80±0.10 0.45±0.10 0.35±0.20 0.50±0.20 2.2㎎ RUK2012 0805 (0.50) 2.00±0.10 1.25±0.10 0.55±0.10 0.40±0.20 0.65±0.20 4.7㎎ RUK3216 1206 (1.0) 3.20±0.25 1.60±0.15 0.45±0.20 0.90±0.20 9.4㎎ RUK3225 1210 (1.0) 1 3.20±0.20 2.55±0.20 0.60+0.10 0.45±0.20 0.80±0.20 9.5㎎ RUK5025 2010 (1.0) 1 5.00±0.20 2.50±0.20 0.65+0.10 0.80±0.20 1.10±0.20 27㎎ RUK6432 2512 (1.0) 1 6.30±0.20 3.20±0.20 0.65+0.10 1.0±0.20 1.90±0.20 42㎎ 1/2 1 R≤0.015Ω:0.70±0.10 R > 0.015Ω:0.60±0.10 Parts Numbering System •The part number system shall be in the following format RUK Code Designation 1608 Dimension & Size Code F Tolerance R010 Resistance Value CS Packaging Code RUK : Current Sensing Resistor Low TCR 1608: 1.6×0.8(㎜) - 0603(inch) 2012: 2.0×1.2(㎜) - 0805(inch) 3216: 3.2×1.6(㎜) - 1206(inch) 3225: 3.2×2.5(㎜) - 1210(inch) 5025: 5.0×2.5(㎜) - 2010(inch) 6432: 6.4×3.2(㎜) - 2512(inch) F: ±1% G: ±2% J: ±5% 3 or 4 digits coding system (IEC conding system) 3digits(E-24 series) 4digits(E-96 series) GS: Bulk Packaging CS: Tape Packaging 7" ES : Tape Packaging 10" AS: Tape Packaging 13" Specification Working Voltage (Vr) Power Rating (W) Type RUK1608 1/3 (0.33) RUK2012 1/2 (0.50) RUK3216 1 (1.0) RUK3225 1 (1.0) RUK5025 1 (1.0) RUK6432 1 (1.0) Resistance Range (Ω) Tolerance (%) Rated Ambient Temperature T.C.R (ppm/℃) Operation Notes Example of land Pattern Design F:±1 J:±5 √(P×R) 10m~30m ±100 70℃ -55℃~+155℃ Recommended Soldering Conditions General Structure General •Working voltage = Rated voltage(Vr)=(P×R) (P:Rated Power, R:Norminal Resistance) Please contact our sales representatives or product engineers for lower T.C.R or higher rated power products. Power Derating Curve Marking The rated power is the maximum continuous loading power at 70℃ ambient temperature. For ambient temperature above 70℃, the loading power follows the below power derating curve. 4 digits indication (E-24 series) - R means decimal point. - Other digits represent significant value. - Example: R010 Left 1 digit: R Last 3 digits:010 R010 = 0.010Ω = 10mΩ 100 Percentage of the rated dissipation(%) Rated Working Temperature 80 60 Operation area Precision Jumper Low ohms (RC Series) Low ohms (RUT Series) Ultra Low Ohms (RU Series) Ultra Low Ohms (RUW Series) 40 R010 20 0 -55 70 -30 0 30 60 Arrays (CONVEX Type) 155 90 120 Ultra Low Ohms (RUK Series) 150 Ambient Temperature(℃) Arrays (CONCAVE Type) Arrays (FLAT Type) Performance Characteristics Item Requirement dR% Test Method Resistance within specified tolerance T.C.R within specified T.C.R 20℃/-55℃ & 20℃/+125℃ Overload(Short time) ±(1.0%+0.0005Ω) Rated Voltage×2.5 for 5sec. Overload(Intermittent) ±(3.0%+0.0005Ω) Resistance to solder Heat ±(1.0%+0.0005Ω) 260℃±5℃, 10±1sec Moisture Resistance ±(3.0%+0.0005Ω) 40℃, 95%RH, 1,000hr, 1.5hr On/0.5hr off cycle Endurance at 70℃ ±(3.0%+0.0005Ω) 70℃, 1,000hr, 1.5hr On/0.5hr off cycle Bending strength ±(1.0%+0.0005Ω) 60mm/min speed, Press until 3mm, keep 5sec Arrays for Memory Modules at 25℃. Kelvin Probing Method. Rated Voltage×2.5 Attenuator Characteristics Performance 1sec on, 25sec off 10,000cycies. The specifications and designs contained herein may be subject to change without notice. Please contact our sales representatives or product engineers before order. Packaging Standard Resistance Value 22 23 Arrays(Convex Type) Feature •Reducing SMD surface area (40% reduced). •Reducing SMD costs (75% reduced). •Both flow and reflow soldering are applicable. •Convex & concave type. The product of lead-free terminal is RoHS compliant. PhO(lead oxide) is included in the glass of our product which is prescribed on RoHS appendix as an exception. Application •For semiconductor devices. •For computers, digital circuits. Structure and Dimensions •2 Array •4 Array A A T T D 123 W W B B P L P L G G (UNIT: mm) Type L W T A D B G P Average Weight RP102P RP104P RP164P 1.00±0.10 2.00±0.10 3.20±0.10 1.00±0.10 1.00±0.10 1.60±0.10 0.35±0.10 0.35±0.10 0.50±0.10 0.33±0.05 0.30±0.15 0.40±0.15 0.40±0.15 0.60±0.15 0.20±0.10 0.15±0.10 0.30±0.15 0.25±0.10 0.25±0.15 0.30±0.15 0.65±0.10 0.50±0.15 0.80±0.15 1.1㎎ 2.2㎎ 8.9㎎ Parts Numbering System •The part number system shall be in the following format RP 10 4P J 100 Code Designation Dimension Resistors Tolerance Resistance Value RP: Convex type array 10: 1005 2P: 2 Pieces 4P: 4 Pieces J: ±5% ※Jumper:’ J’ 3 digit coding system (IEC coding system) E-24 series FS Packaging Code CS : Tape Packaging 7" ES : Tape Packaging 10" AS : Tape Packaging 13" Specification Type Power Rating (W) 102P 104P 164P 1/16 •Rated voltage (V) = √ Working Overload Voltage Voltage (MAX) (MAX) 25(V) 25(V) 50(V) 50(V) 50(V) 100(V) TCR (ppm/℃) Resistance Range (Ω) ±200 1Ω~1MΩ Rated power(W)×Normal resistance value (R) Rated voltage should be lower than (MAX) working voltage. Rated Rated Working Ambient Temperature Temperature 70℃ -55℃~+155℃ Power Derating Curve The rated power is the maximum continuous loading power at 70℃ ambient temperature. For ambient temperature above 70℃, the loading power follows the below power derating curve. (The load current shall be derated according to Derating curve in case of the 'Jumper') Operation Notes Percentage of the rated dissipation(%) 100 Example of land Pattern Design 80 Recommended Soldering Conditions 60 Operation area 40 General Structure 20 0 70 -55 -30 0 30 General 155 60 90 120 Ambient Temperature(℃) 150 Precision Jumper Jumper Resistors Type Resistance Current Rating Rated Ambient Temperature Rated Working Temperature Low ohms (RC Series) 102P 104P 164P 50mΩMax. 1.0(A) 70℃ -55℃~+155℃ Low ohms (RUT Series) Ultra Low Ohms (RU Series) Marking Ultra Low Ohms (RUW Series) •3 digits indication(E-24 series) - Left 2 digits represent significant figures. - Last 1 digit represents exponential number of 10. - Example: 103 Left 2 digits: 10 Last 1 digit: 3 103 = 10×10 3 =10000Ω=10kΩ Ultra Low Ohms (RUK Series) 103 ※Jumper chip is printed as “000”. Arrays (CONVEX Type) Arrays (CONCAVE Type) •RP102P, RN102P, RN104P type : No marking. Arrays (FLAT Type) Land Pattern Arrays for Memory Modules P E Attenuator : Land Pattern D Characteristics Performance : Chip Resistor A B C Packaging Type A B C D E P1 10AT 0.4 0.4 0.25 0.5 0.5 0.65 102P 0.4 0.4 0.25 0.5 0.5 0.65 104P 164P 0.7 0.7 0.3 0.5 0.2 0.3 0.5 0.9 0.5 0.8 0.55 0.9 The specifications and designs contained herein may be subject to change without notice. Please contact our sales representatives or product engineers before order. P2 - Standard Resistance Value 0.5 0.8 24 25 Arrays(Concave Type) Feature •Reducing SMD surface area (40% reduced). •Reducing SMD costs (75% reduced). •Both flow and reflow soldering are applicable. •Convex & concave type. The product of lead-free terminal is RoHS compliant. PhO(lead oxide) is included in the glass of our product which is prescribed on RoHS appendix as an exception. Application •For semiconductor devices. •For computers, digital circuits. Structure and Dimensions •2 Array •4 Array T A T A B B (Top side) W W P P L L (Bottom side) G G (UNIT: mm) Type L W T A B G P Average Weight RN102P RN104P 1.00±0.10 2.00±0.10 1.00±0.10 1.00±0.10 0.35±0.10 0.40±0.10 0.30±0.10 0.30±0.10 0.15±0.10 0.15±0.10 0.25±0.15 0.25±0.15 0.5±0.10 0.5±0.10 1.2㎎ 2.8㎎ Parts Numbering System •The part number system shall be in the following format RN 10 4P J 100 Code Designation Dimension Resistors Tolerance Resistance Value RN: Concave type array 10: 1005 2P: 2 Pieces 4P: 4 Pieces F: ±1% J: ±5% ※Jumper:’ J’ 3 digit coding system (IEC coding system) E-24 series CS Packaging Code CS : Tape Packaging 7" ES : Tape Packaging 10" AS : Tape Packaging 13" Specification Power Rating (W) Type 102P 104P Working Overload Voltage Voltage (MAX) (MAX) 25(V) 25(V) 1/16 •Rated voltage (V) = 50(V) 50(V) Rated Rated Working Ambient Temperature Temperature Resistance Range (Ω) TCR (ppm/℃) 1~9.9Ω: ±300 10Ω~1MΩ: ±200 1Ω~1MΩ 70℃ Operation Notes -55℃~+155℃ Example of land Pattern Design √ Rated power(W)×Normal resistance value (R) Rated voltage should be lower than (MAX) working voltage. Recommended Soldering Conditions General Structure Power Derating Curve The rated power is the maximum continuous loading power at 70℃ ambient temperature. For ambient temperature above 70℃, the loading power follows the below power derating curve. (The load current shall be derated according to Derating curve in case of the 'Jumper') General Precision Percentage of the rated dissipation(%) 100 80 Jumper 60 Low ohms (RC Series) Operation area 40 Low ohms (RUT Series) 20 0 70 -55 -30 0 30 Ultra Low Ohms (RU Series) 155 60 90 120 150 Ambient Temperature(℃) Ultra Low Ohms (RUW Series) Ultra Low Ohms (RUK Series) Jumper Resistors Type Resistance Current Rating Rated Ambient Temperature Rated Working Temperature Arrays (CONVEX Type) 102P 104P 50mΩMax. 1.0(A) 70℃ -55℃~+155℃ Arrays (CONCAVE Type) Arrays (FLAT Type) Land Pattern Arrays for Memory Modules P Attenuator E : Land Pattern D Characteristics Performance : Chip Resistor Packaging B A C Type A B C D E P 102P 0.3 0.3 0.2 0.5 0.4 0.5 104P 0.3 0.3 0.2 0.5 0.4 0.5 The specifications and designs contained herein may be subject to change without notice. Please contact our sales representatives or product engineers before order. Standard Resistance Value 26 27 Arrays(Flat Type) Feature •Reducing SMD surface area (40% reduced). •Reducing SMD costs (75% reduced). •Both flow and reflow soldering are applicable. •Convex & concave type. The product of lead-free terminal is RoHS compliant. PhO(lead oxide) is included in the glass of our product which is prescribed on RoHS appendix as an exception. Application •For semiconductor devices. •For computers, digital circuits. Structure and Dimensions •2 Array •4 Array A B B T P L A T P L G G W W (UNIT: mm) Type L W T A B G P Average Weight RF062P RF064P 0.80±0.05 1.40±0.05 0.60±0.05 0.60±0.05 0.23±0.10 0.23±0.10 0.20±0.10 0.20±0.10 0.10±0.10 0.10±0.10 0.20±0.10 0.20±0.10 0.50±0.05 0.40±0.05 0.3㎎ 0.5㎎ Parts Numbering System •The part number system shall be in the following format RF 06 4P J R68 Code Designation Dimension Resistors Tolerance Resistance Value RF: Flat type array 06: 0603 2P: 2 Pieces 4P: 4 Pieces J: ±5% ※Jumper:’ J’ 3 digit coding system (IEC coding system) E-24 series CS Packaging Code CS : Tape Packaging 7" ES : Tape Packaging 10" AS : Tape Packaging 13" Specification Power Rating (W) Type 062P 064P Working Overload Voltage Voltage (MAX) (MAX) 1/32 •Rated voltage (V) = 12.5(V) 70℃ 10Ω~1MΩ ±250 25(V) Rated Rated Working Ambient Temperature Temperature Resistance Range (Ω) TCR (ppm/℃) Operation Notes -55℃~+125℃ Example of land Pattern Design √ Rated power(W)×Normal resistance value (R) Rated voltage should be lower than (MAX) working voltage. Recommended Soldering Conditions Power Derating Curve General Structure The rated power is the maximum continuous loading power at 70℃ ambient temperature. For ambient temperature above 70℃, the loading power follows the below power derating curve. (The load current shall be derated according to Derating curve in case of the 'Jumper') General Percentage of the rated dissipation(%) 100 Precision 80 Jumper 60 40 Low ohms (RC Series) 20 Low ohms (RUT Series) Operation area 0 70 -55 -40 0 40 125 Ultra Low Ohms (RU Series) 80 120 Ambient Temperature(℃) Ultra Low Ohms (RUW Series) Jumper Resistors Type Resistance Current Rating Rated Ambient Temperature 062P 064P 50mΩMax. 0.5(A) 70℃ Rated Working Temperature -55℃~+125℃ Ultra Low Ohms (RUK Series) Arrays (CONVEX Type) Arrays (CONCAVE Type) Land Pattern Arrays (FLAT Type) A A : Land Pattern B B Arrays for Memory Modules : Chip Resistor A C D A C C D C Characteristics Performance TYPE (Inch) Dimension A B Reflow Soldering 2A + B C D RF062P 0.3 0.3 0.9 0.2 0.3 RF064P 0.3 0.3 0.9 0.2 0.2 The specifications and designs contained herein may be subject to change without notice. Please contact our sales representatives or product engineers before order. Attenuator Packaging Standard Resistance Value 28 29 Arrays for Memory Modules Feature •Reducing SMD surface area (40% reduced). •Reducing SMD costs (75% reduced). •Applicable both flow and reflow soldering. •Reverse & Short free Reverse Concave Type. The product of lead-free terminal is RoHS compliant. PhO(lead oxide) is included in the glass of our product which is prescribed on RoHS appendix as an exception. Application •For semiconductor devices. •For computers, digital circuits. Structure and Dimensions (1) REVERSE CONCAVE TYPE B G 150 W P A T L (UNIT: mm) Type L W T A B G P Average Weight RM102P RM104P 1.00±0.10 2.00±0.10 1.00±0.10 1.00±0.10 0.35±0.10 0.45±0.10 0.30±0.10 0.30±0.10 0.15±0.10 0.15±0.10 0.25±0.15 0.25±0.15 0.50±0.10 0.50±0.10 1.2㎎ 2.8㎎ (2) SHORT-FREE REVERSE CONCAVE TYPE G 150 W H P T A A T L (UNIT: mm) Type L W T A G P H Average Weight RK102P RK104P 1.00±0.10 2.00±0.10 1.00±0.10 1.00±0.10 0.35±0.10 0.45±0.10 0.30±0.10 0.30±0.10 0.25±0.15 0.25±0.15 0.50±0.10 0.50±0.10 0.17min 0.23min 1.2㎎ 2.8㎎ Parts Numbering System •The part number system shall be in the following format RM 10 4P J 100 Code Designation Dimension Resistors Tolerance Resistance Value RM : Reverse Concave Array RK : Short-free Reverse Concave Array 10: 1005 2P: 2 Pieces 4P: 4 Pieces F: ±1% J: ±5% ※Jumper:’ J’ 3 digit coding system (IEC coding system) E-24 series CS Packaging Code CS : Tape Packaging 7" ES : Tape Packaging 10" AS : Tape Packaging 13" Operation Notes Example of land Pattern Design Recommended Soldering Conditions Specification Power Rating (W) Type 102P 104P Working Overload Voltage Voltage (MAX) (MAX) 1/16 25(V) Resistance Range (Ω) TCR (ppm/℃) 1~9.9Ω: ±300 10Ω~1MΩ: ±200 50(V) Rated Rated Working Ambient Temperature Temperature 1Ω~1MΩ 70℃ General Structure General -55℃~+125℃ Precision √Rated power(W)×Normal resistance value (R) Rated voltage should be lower than (MAX) working voltage. •Rated voltage (V) = Jumper Power Derating Curve Low ohms (RC Series) The rated power is the maximum continuous loading power at 70℃ ambient temperature. For ambient temperature above 70℃, the loading power follows the below power derating curve. (The load current shall be derated according to Derating curve in case of the 'Jumper') Low ohms (RUT Series) Percentage of the rated dissipation(%) 100 Ultra Low Ohms (RU Series) 80 Ultra Low Ohms (RUW Series) 60 Operation area 40 Ultra Low Ohms (RUK Series) 20 Arrays (CONVEX Type) 0 70 -55 -40 0 40 125 Arrays (CONCAVE Type) 80 120 Ambient Temperature(℃) Jumper Resistors Arrays (FLAT Type) Type Resistance Current Rating Rated Ambient Temperature Rated Working Temperature 102P 104P 50mΩMax. 1.0(A) 70℃ -55℃~+125℃ Attenuator Marking Characteristics Performance •3 digits indication(E-24 series) - Left 2 digits represent significant figures. - Last 1 digit represents exponential number of 10. - Example: 150 Left 2 digits: 15 Last 1 digit: 0 150 = 15×10 0=15Ω Arrays for Memory Modules Packaging 150 ※Jumper chip is printed as “000”. Standard Resistance Value •RM102P, RK102P Type : No marking. The specifications and designs contained herein may be subject to change without notice. Please contact our sales representatives or product engineers before order. 30 31 Attenuator Feature •The RP10AT is small-size chip Attenuator, suitable for high density surface mounting. •Unbalanced πtype attenuator circuit in one chip(1.0 mm x 1.0 mm) •Mounting occupation area reduction : about 50 % reduction •Mounting cost reduction : Mounting times 3 times →1 time •Attenuation : 0 dB to 10 dB Application •Attenuation / level control / impedance matching of high frequency signals of communication equipment; cellular phones(GSM, CDMA, etc.), PHS, PDA, for example. Structure and Dimensions • Structure •Dimensions Coating A T Substrate W Resistor B P L Electrode C (UNIT: mm) Type Power(W) L W T A B C P Average Weight RP10AT 0.04W / package 1.00±0.10 1.00±0.10 0.35±0.10 0.33±0.05 0.20±0.10 0.25±0.10 0.65±0.10 1.1㎎ Parts Numbering System •The part number system shall be in the following format RP Code Designation 10AT L Dimensions & Circuit Configuration Attenuation Value Tolerance RP:Convex type 10 :1.0x1.0(mm)-0404(inch) AT:Unbalanced π-type Attenuator L : ± 0.3 dB H : ± 0.5 dB A 03 Characteristic Impedance Attenuation Value A : 50 ohm 3 dB EX) 0 →0dB CS Packing Type CS :Tape Packaging 7" Specification Item Specifications Attenuation Value Operation Notes 0 dB~15dB 0 dB~5 dB : ± 0.3 dB 6 dB~15dB : ± 0.5 dB 50Ω 0.04W / package DC to 3 GHz 1.3 max 4 terminals Attenuation Value Tolerance Characteristic Impendance Power Rating Frequency Range VSWR (Voltage Standing Wave Ratio) Number of terminals Category Temperature Range (Operating Temperature Range) Example of land Pattern Design Recommended Soldering Conditions General Structure -55 ℃ to +125 ℃ General Precision Power Derating Curve Jumper The rated power is the maximum continuous loading power at 70℃ ambient temperature. For ambient temperature above 70℃, the loading power follows the below power derating curve. Percentage of the rated dissipation(%) Rated load percent (%) 100 Low ohms (RC Series) Low ohms (RUT Series) 80 Ultra Low Ohms (RU Series) 60 40 Ultra Low Ohms (RUW Series) 20 Ultra Low Ohms (RUK Series) Operation area 0 70 -55 -40 0 40 125 80 120 Ambient Temperature(℃) Arrays (CONVEX Type) Arrays (CONCAVE Type) Equivalent Circuit Configuration Arrays (FLAT Type) Arrays for Memory Modules R2 Attenuator R1 R3 Characteristics Performance Packaging Standard Resistance Value The specifications and designs contained herein may be subject to change without notice. Please contact our sales representatives or product engineers before order. 32 33 Characteristics Performance Electrical Characteristic Requirements Specification Jumper Resistor Item Direct Current Resistance Temperature Characteristic Short-time Overload Intermittent Overload Within the regulated resistance tolerance. 50mΩMax. J-Grade 1Ω≤R 〈10Ω:+300/-200ppm/℃ 10Ω≤R≤1MΩ:±100ppm/℃(0603±250ppm) 1MΩ〈R≤10MΩ:±300ppm/℃ F-Grade 1Ω≤R≤10MΩ:±100ppm/℃(0603±250ppm) ΔR Less than ±(1%+0.1Ω) of the initial value. JIS C 5201-1 4.13 Apply 2.5 times rated voltage for 5 sec. Wait 60 minutes at room temperature. Measure the resistance value. Test board: Max Surge Current 50mΩMax. JIS C 5201-1 4.13 2.5 times of rated voltage . 1 second ON, 25 second OFF. 10,000 cycles. Test board: Max Surge Current Visual No evidence of mechanical damage. Dielectric Withstanding Voltage Insulation Resistance Jumper JIS C 5201-1 4.5 Voltage apply Within 5 sec. Test temp: 20℃, 65RH Test board: JIS C 5201-1 4.8 Test Temperature(℃) 20℃ → -55℃ / 20℃ → 125℃ T.C.R(ppm / ℃)=(R-R20) / R20×1/(T-T20)×106 ※T=test Temperature, T20 =20℃ R=Resistance at T, R20 =Resistane at T20 Test board: 50mΩMax. Visual No evidence of mechanical damage. ΔR Less than ±(3%+0.1Ω) of the initial value. Test Methods Resistor JIS C 5201-1 4.7 Apply Voltage for 1 minute 0402.0603:50V 1005, 1608: 100V Other: 500V No evidence of mechanical damage. Over 1,000MΩ Cu Cu Cu P2 Substrate V Mechanical Characteristic Requirements Specification Jumper Resistor Item Solderability Bending Test ΔR Coverage: ≥95% each termination. No crack of termination parts and ceramic exposure of surface by melting. Less than±(1.0%+0.05Ω)of the initialvalue. 50mΩMax. Visual No evidence of mechanical damage. Adhesive strength of termination No mechanical damage or sign of disconnection Resistance ΔR Less than±(1%+0.05Ω)of the initial value. to Soldering Visual No evidence of mechanical damage. Heat 50mΩMax. ΔR Less than±(1%+0.05Ω)of the initial value. AntiVibration Test Visual No evidence of mechanical damage. 50mΩMax. Test Methods Resistor Jumper IEC60068-2-58 Rosin Flux: Rosin 25%, Methanol 75% Solder Temp.: 245+5/-0℃ Dipping time: 2±0.5 sec.(Both side dipping) JIS C 5201-1 4.33 After soldering resistor on the PCB, 3mm of bending shall be applied for 10 sec. Test board: 20 R230 3mm 90mm JIS C 5201-1(4.16) - Test strengh : 5N (500g . f), 0603 : 2N - Test time : Applying pressure for 10 seconds 500 g.f JIS C 5201-1 4.18 - Flow soldering :260±5℃,10 sec .max.(both side dipping) - Reflow soldering :260±5℃, 10 sec. max. over 230℃, 30~40 sec. JIS C 5201-1 4.22 2 hours each in X, Y and Z axis(total 6 hours) 10 to 55Hz sweep in 1 minute at 1.5mm amplitude. Environmental Characteristic Item Requirements Specification Jumper Resistor Test Methods Resistor Jumper JIS C 5201-1 4.19 ΔR Less than ±(1%+0.1Ω) of the initial value. 50mΩMax. Perform 100 cycles as follows. Temperature Test Condition: -55℃/ 30min ↔ 125℃/ 30min Cycle sweep time: 5 min Visual No evidence of mechanical damage. Test board: JIS C 5201-1 4.25 ΔR Less than ±(3%+0.1Ω) of the initial value. 50mΩMax. Test Voltage: rated voltage Test temp.: 70±2℃ Load Life Time: 1,000+48 hours(90 min; ON, 30 min; OFF) Visual No evidence of mechanical damage. Test board: JIS C 5201-1 4.23 ΔR Less than ±(3%+0.1Ω) of the initial value. 50mΩMax. Dwell in -55℃ chamber without loading for 1,000+48 hours. Low Temp. Stabilize for 60 minutes at room temperature. Exposure Measure value. Visual No evidence of mechanical damage. Test board: JIS C 5201-1 4.23 or 155℃±2℃chamber without High Temp. ΔR Less than ±(3%+0.1Ω) of the initial value. 50mΩMax. Dwell in 125℃±2℃ loading for 1,000+48 hours. Stabilize for 60 minutes at room Exposure temperature. Visual No evidence of mechanical damage. Measure value. Test board: ΔR Less than ±(3%+0.1Ω) of the initial value. 50mΩMax. JIS C 5201-1 4.14 Test Voltage: rated voltage Test temp.: 40±2℃ Moisture +48 Time: 1,000 hours(90 min; ON, 30 min; OFF) Resistance Visual No evidence of mechanical damage. Humidity: 90~95% RH Stabilize for 1 hrs & Measure. Test board: ※These characteristics apply to 1Ω~10MΩ. In case of other resistance range, please contact us. ※The next is specification in our company for flow soldering and test boards. Operation Notes Example of land Pattern Design Recommended Soldering Conditions General Structure General Precision Jumper Low ohms (RC Series) Low ohms (RUT Series) Ultra Low Ohms (RU Series) Ultra Low Ohms (RUW Series) Flow soldering Conditions Item Specification Dipping Ultra Low Ohms (RUK Series) Flux ROSIN 25%, IPA 75% Solder Sn-3.0Ag-0.5Cu Time: 5~10 sec. Time: 10 sec max. Temp.: 260±5℃. Arrays (CONVEX Type) Arrays (CONCAVE Type) Arrays (FLAT Type) Arrays for Memory Modules Attenuator Characteristics Performance Packaging Standard Resistance Value The specifications and designs contained herein may be subject to change without notice. Please contact our sales representatives or product engineers before order. 34 35 Packaging Taping Type •Reel dimensions Symbol Tape Width 8mm 12mm 8mm 12mm 8mm 12mm 7" Reel 10" Reel E C 13" Reel C B D Symbol t A 10" Reel W A B C Ø180+0/-3 Ø180+0/-3 Ø258+0/-3 Ø258+0/-3 Ø330±2.0 Ø330±2.0 Ø60±1.0 Ø60±1.0 Ø80±1.0 Ø80±1.0 Ø100±1.0 Ø80±1.0 Ø13±0.3 Ø13±0.3 Ø13±0.3 Ø13±0.3 Ø13±0.3 Ø13±0.3 Tape Width 8mm 12mm 8mm 12mm 8mm 12mm 7" Reel 13" Reel Unit: mm D E 4±0.2 4±0.2 4±0.2 4±0.2 4±0.2 4±0.2 W 2.0±0.5 2.0±0.5 2.0±0.5 2.0±0.5 2.0±0.5 2.0±0.5 9±0.5 13±0.5 9±0.5 13±0.5 9±0.5 13±0.5 t 1.2±0.2 1.2±0.2 1.8±0.2 1.8±0.2 2.2±0.2 2.2±0.2 •Tape dimensions Type (UNIT: mm) Pitch Width Dimensions 4.0±0.1 Press Pocket or Punched Paper 1.5 +- 0.1 0 1.75±0.1 1.0 2mm 3.5±0.05 8.0±0.1 B T 1608 2012 3216 3225 RP164 A 1.10±0.20 1.65±0.20 2.00±0.20 2.90±0.20 2.00±0.20 B T 1.90±0.20 0.8 Max 2.40±0.20 3.60±0.20 1.1 Max 3.60±0.20 3.60±0.20 5025 6432 B T A 2.80±0.20 5.30±0.20 1.1 Max 3.50±0.20 6.75±0.20 RN102 RP104 RN104 - 0603: Press pocket. 8mm 4.0±0.1 1.5 +- 0.1 0 1.75±0.1 1.0 Punched Paper 3.5±0.05 8.0±0.1 B T 0.3±0.02 2±0.05 4 4.0±0.1 A Φ1.5 +0.1 - 0 1.75 5.5±0.05 2.0±0.05 4mm B 12±0.2 12mm B Embossed Tape B 0.45±0.03 0.68±0.05 1.20±0.10 0.90±0.10 1.60±0.10 1.17±0.10 1.20±0.10 1.20±0.10 2.20±0.10 2.20±0.10 RP10AT A 2.0±0.05 A 0.24±0.03 0.38±0.05 0.70±0.10 0.70±0.10 0.70±0.10 1.17±0.10 1.20±0.10 1.20±0.10 1.20±0.10 1.20±0.10 0402 0603 1005 RF062P RF064P RP102 T Φ1.5 4 A T 0.5 Max 0.5 Max 0.6 Max 0.35 Max 0.35 Max 0.6 Max 0.6 Max 0.6 Max 0.6 Max 0.8 Max Packaging Table Taping Packaging TYPE (mm) TYPE (inch) Code Reels Carrier Tape Quantity Weight(g) 0402 01005 CS 7” Pressed Paper CS DP AS FP CS DS ES AS CS ES AS CS ES AS CS ES AS CS ES AS CS CS AS CS CS 7” 7” 13” 13” 7” 7” 10” 13” 7” 10” 13” 7” 10” 13” 7” 10” 13” 7” 10” 13” 7” 7” 13” 7” Pressed Paper 20,000 15,000 143 126 154 573 474 92 152 331 539 125 324 561 149 360 658 157 382 695 183 463 674 202 267 1,041 126 126 CS AS CS AS CS AS CS AS 7” 13” 7” 13” 7” 13” 7” 13” 20,000 60,000 50,000 10,000 20,000 30,000 40,000 5,000 10,000 20,000 5,000 10,000 20,000 5,000 10,000 20,000 5,000 10,000 20,000 4,000 4,000 15,000 20,000 20,000 10,000 40,000 10,000 40,000 5,000 20,000 10,000 40,000 0603 1005 1608 2012 0201 0402 0603 0805 3216 1206 3225 1210 5025 2010 6432 2512 062P 064P 0201×2R 0201×4R 102P 0402×2R 104P 0402×4R 164P 0603×4R 10AT (1010) 0404 Punched PE Pressed Paper Punched PE Punched paper Embossed PE 7” Punched paper Punched paper •General type, Precision, Low ohms, High ohms. •Packaging style can be modified when you want. 100 485 136 610 157 695 100 485 Operation Notes Example of land Pattern Design Recommended Soldering Conditions General Structure General Precision Jumper Low ohms (RC Series) Low ohms (RUT Series) Ultra Low Ohms (RU Series) Ultra Low Ohms (RUW Series) Ultra Low Ohms (RUK Series) Arrays (CONVEX Type) Arrays (CONCAVE Type) Arrays (FLAT Type) Arrays for Memory Modules Attenuator Characteristics Performance Packaging Standard Resistance Value The specifications and designs contained herein may be subject to change without notice. Please contact our sales representatives or product engineers before order. 36 37 Standard Resistance Value Tolerance Code Table Tolerance Code D Digit Number IEC-Code System Specification F 4 digit E-192 ±0.5% E-96 ±1% G J K 3 digit M E-48 ±2% E-24 ±5% E-12 ±10% E-6 ±20% Significant Figure of Resistance Value E-192 E-96 E-48 E-24 E-192 E-96 E-48 100 101 102 104 105 106 107 109 110 111 113 114 115 117 118 120 121 123 124 126 127 129 130 132 133 135 137 138 140 142 143 145 147 149 150 152 154 156 158 160 162 164 165 167 169 172 174 176 100 100 10 178 180 182 184 187 189 191 193 196 198 200 203 205 208 210 213 215 218 221 223 226 229 232 234 237 240 243 246 249 252 255 258 261 264 267 271 274 277 280 284 287 291 294 298 301 305 309 312 178 178 102 105 105 107 110 110 11 113 115 115 118 12 121 121 124 127 127 130 133 13 133 137 140 140 143 147 147 150 154 15 154 158 16 162 162 165 169 169 174 E-24 18 182 187 187 191 196 196 200 205 20 205 210 215 215 221 226 22 226 232 237 237 24 243 249 249 255 261 261 267 27 274 274 280 287 287 294 301 309 301 30 E-192 E-96 E-48 316 320 324 328 332 336 340 344 348 352 357 361 365 370 374 379 383 388 392 397 402 407 412 417 422 427 432 437 442 448 453 459 464 470 475 481 487 493 499 505 511 517 523 530 536 542 549 556 316 316 E-24 324 332 332 33 340 348 348 357 36 365 365 374 383 383 392 402 39 402 412 422 422 432 442 43 442 453 464 464 47 475 487 487 499 511 511 51 523 536 536 549 E-192 E-96 E-48 E-24 562 569 576 583 590 597 604 612 619 626 634 642 649 657 665 673 681 690 698 706 715 723 732 741 750 759 768 777 787 796 806 816 825 835 845 856 866 876 887 898 909 920 931 942 953 965 976 988 562 562 56 576 590 590 604 619 619 62 634 649 649 665 681 681 698 715 715 732 750 750 787 787 806 825 825 105Ω 110Ω 82 845 866 866 887 909 909 91 931 953 953 976 E-6 series ±20% 80Ω 75 768 •Example E-12 series ±10% E-24 series ±5% E-96 series ±1% 101Ω 90Ω 95Ω 99Ω 100Ω 68 120Ω ISO/TS 16949 ISO 14001 OHSAS 18001 QC080000 Operation Notes Example of land Pattern Design Recommended Soldering Conditions General Structure General Precision Quality System Certification List Jumper Table 1:Certification list of Samsung Factory Certification ISO / TS 16949 ISO 14001 OHSAS 18001 Low ohms (RC Series) Section High Tech(China) Authority BSI Number TS 91430-008 Date 2011 - 11 - 29 Validity 2014 - 11 - 28 Authority BSI Number EMS 585307 Date 2012 - 04 - 17 Validity 2015 - 04 - 16 Authority BSI Number OHS 585308 Date 2012 - 04 - 17 Validity 2015 - 04 - 16 Authority UL Number PRC-HSPM-1766 Date 2010 - 07 - 27 Characteristics Performance Validity 2013 - 07 - 26 Packaging QC080000 Low ohms (RUT Series) Ultra Low Ohms (RU Series) Ultra Low Ohms (RUW Series) Ultra Low Ohms (RUK Series) Arrays (CONVEX Type) Arrays (CONCAVE Type) Arrays (FLAT Type) Arrays for Memory Modules Attenuator Standard Resistance Value 38 39 Passive components sales offices ● Head office Philippines Plant (Philippines) Block No.5, Calamba Premiere International Park, Batino, Calamba, Laguna, Manila, Philippines 4027 Te l:+63 - 49- 545- 0422 E-mail:donna@samsung.com 206, Cheomdansaneop Road, Yeongtong-gu, Suwon-city, Gyeonggi province, Korea, 443- 743 Europe Te l:+82- 31- 210 - 6328 E-mail:james.pyun@samsung.com America Te l:+82- 31- 210 - 6803 E-mail:wesley.roh@samsung.com Asia Te l:+82 - 31- 210 - 6791 E-mail:peter_kim@samsung.com Domestic Te l:+82- 31- 210 - 5074 E-mail:boungho.lee@samsung.com ● Manufacturing sites Suwon Plant (Korea) 206, Cheomdansaneop Road, Yeongtong-gu, Suwon-city, Gyeonggi province, Korea, 443- 743 Te l:+82- 31- 210-5074 E-mail:boungho.lee@samsung.com Busan Plant (Korea) 1623 - 2, Songjeong- dong, Gangseo- gu, Busan, Korea, 618 - 270 Te l:+82- 51- 970 - 7671 E-mail:kyc.kweon@samsung.com Tianjin Plant (China) 27, Heiniucheng- Road, Hexi District, Tianjin, 300210 China Te l:+86 - 22 - 2397- 9000(310) E-mail:moohantop.Park@samsung.com High Tech (China) Xiqing Dist. Micro-Electronics Industrial Park, Jingang Highway, Tianjin, China 300485 Tel:+ 022- 23979000- 313 E-mail: enhao.song@samsung.com Binhai Plant(China) 80, XiaQing Road, West area of BinHai development zone, TianJin, 300458, China Te l:+86- 22- 6686- 3333(1300) E-mail:sk1000.kim@samsung.com ● Asia sales offices ● Irvine Office 3333 Michelson Drive, Suite 500, Irvine, CA 92612, USA Tel: 1-949-797-8016 E-mail: andrew.skelly@samsung.com ● Shenzhen Office 46 F, New World Center, Yitian Road, Futian District, Shenzhen, 518026 China Te l:86 - 755 - 8608- 5571 E-mail:jackson.xian@samsung.com Shanghai Office Rm. 1211, Shanghai International Trade Center, No. 2201 Yan an(W) Rd., Shanghai, 200335 China Te l:86 - 21- 6270 - 4168(274) E-mail:dennis.cha@samsung.com HongKong Office 8/F.,Central Plaza, 18 Harbour Road, Wanchai, Hongkong, China Te l:852-28626344 E-mail:vivianchan@samsung.com Qingdao Office Rm 1201. Growne Plaza Qingdao 76, Xiang Gang Zhong Rd, Qingdao, 266071 China Te l:86 - 532 - 85779102 E-mail:zhengguo.cui@samsung.com Taiwan Office 9F - 1, Np. 399 Ruey Kuang Rd., Neihu District, Taipei City, Taiwan, 114 Te l:886 - 2 - 2656 - 8356 E-mail:kevin0130.wang@samsung.com Singapore Office 3 Church Street Samsung Hub, #23-02 Singapore 049483 Te l:65-6833 - 3228 E-mail:winson.yeong@samsung.com America sales office Europe sales offices Frankfurt Office Samsung Haus, Am Kronberger Hang 6, D-65824 Schwalbach/Ts. Germany Te l:49 - 6196 - 66 - 7255 E-mail:frank.goebel@samsung.com Hungary Office H-2310, Leshegy utca 2-4, Szigetszentmiklos, Pest megye, Hungary Te l:36 - 24 - 551- 148 E-mail:jun21c.lee@samsung.com ● Domestic Distributors Korchip Corporation 817-38, Anyang 2- dong, Manan- gu, Anyang-city, Gyeonggi province, Korea, 430-812 Te l:+82 - 31- 361- 8100 E-mail:itasap@korchip.com SAMT Daekyung Bldg., 983-10, Daechi-dong, Gangnam-gu, Seoul, Korea Te l:+82- 2- 3458- 9000 E-mail:info@isamt.com CHUNGMAC 301 Gwonseon Medivill, 544-14 Gokbanjeong-dong, Gwonseon-gu, Suwon-si, Gyeonggi-do Korea Te l:+82- 31- 234- 2367~8 E-mail:webmaster@chungmac.co.kr YOUNGDUK Gasan-Dong 632, Seobusaetgil, Geumcheon-Gu, Seoul, Korea Te l:+82- 2- 2107- 7860 E-mail:siyang1109@gmail.com Bangkok Office 23rd Floor, Lake Rajada Office Complex 193/89 Rachadapisek Road, Khet Klongtoey, Bangkok 10110, Thailand Te l:66 - 2- 661- 8004~5 E-mail:yangshin.yi@samsung.com All information indicated in this catalog is as of July 2012 * The specifications and designs contained herein may be subject to change without notice.