Product Family Data Sheet
Rev. 3.5 2018. 09. 21
High Power LED Series
Chip Scale Package
LH181B
Use of Samsung’s Chip Scale Package technology
provide high performance and energy conserving
Features & Benefits
Utilizes Samsung TF chip technology
Suitable for use in indoor and outdoor lighting
Operates at a maximum current of up to 1.4 A
Compact footprint (2.36 x 2.36 mm)
Applications
Indoor Lighting: Spotlight, Downlight, MR, PAR
Outdoor Lighting:
Street Light, Tunnel Light, Security Light, Parking Lot Light
Industrial Lighting: High Bay Light, Low Bay Light
Consumer Lighting: Torch Light
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2
Table of Contents
1.
Characteristics
-----------------------
3
2.
Product Code Information
-----------------------
6
3.
Typical Characteristics Graphs
-----------------------
11
4.
Outline Drawing & Dimension
-----------------------
13
5.
Reliability Test Items & Conditions
-----------------------
14
6.
Soldering Conditions
-----------------------
15
7.
Tape & Reel
-----------------------
16
8.
Label Structure
-----------------------
18
9.
Packing Structure
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19
Precautions in Handling & Use
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21
10.
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1. Characteristics
a) Absolute Maximum Rating
Item
Symbol
Rating
Unit
Condition
Ambient / Operating Temperature
Ta
-40 ~ +100
ºC
Note 1)
Storage Temperature
Tstg
-40 ~ +125
ºC
-
LED Junction Temperature
Tj
135
ºC
-
Forward Current
IF
1400
mA
Note 1)
Peak Pulse Forward Current
IFP
2000
mA
Duty 1/10 pulse width 10ms
Assembly Process Temperature
-
260
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