ISSUE NO :
Rev : Preliminary
DATE OF ISSUE : 09/05/2011
SPECIFICATION
MODEL : SPHWHTHAD605S0T0WZ
HV-AC HIGH POWER LED
CUSTOMER :
DRAWN
CHECKED
APPROVED
SAMSUNG LED
DRAWN
CHECKED
APPROVED
SAMSUNG LED CO,.LTD.
314. MAETAN3-DONG, YEONGTONG-KU,
SUWON-SI,GYUNGKI-DO,KOREA,442-743
Http://www.samsungled.com
HV-AC LED
1 / 25
Contents
1. Product Outline
-------------------------
3
2. Absolute Maximum Rating
-------------------------
3
3. Characteristics
-------------------------
3
---------------
8
4. Typical Characteristic Graphs
5. Outline Drawing & Dimension
6. Solder Conditions
------------------ 11
------------------------------ 12
7. Reliability Test Items & Conditions
---------- 13
8. Circuit Design - Package and PCB
--------- 14
9. Taping Dimension
----------------------------------- 15
10. Label Structure
11. Lot Number
------------------------- 16
---------------------------------------- 16
12. Reel Packing Structure
--------------------------- 17
13. Aluminum Packing Bag
---------------------- 19
14. Precaution For Use
---------------------------------- 20
15. Hazard Substance Analysis
16.
Revision History
Http://www.samsungled.com
------------------------- 22
------------------------------------ 25
HV-AC LED
2 / 25
1. Product Outline
1) Features
ㆍ
ㆍ
ㆍ
ㆍ
Plastic Molded Lead Frame Type : 12.4㎜(L), 11.4㎜(W), 4.38㎜(T)
SMD Type : 1 Heat Pad and 4 Electrical Pad
Beam View Angle(△θ)＊ :136˚
High Power / Brightness Chip & Long Time Reliability
2) Applications
ㆍ Indoor & Outdoor lighting
ㆍ Direct AC power source plug-in (100~120Vac, 220~240Vac)
※ View Angle describes the spatial intensity distribution and is the difference between the angles
corresponding to 50% of the maximum intensity. (Full Width Half Maximum)
2. Absolute Maximum Rating
Parameter
Value
Unit
RMS current*
29**(240Vac) / 58**(120Vac)
mA
Power Dissipation***
4.5
W
LED Junction Temperature (TJ)
125
∼ 85
-40 ∼ 120
℃
℃
℃
± 3,000V HBM
-
Operating Temperature Range (TOPR)
-40
Storage Temperature (TSTG)
ESD Sensitivity
*RMS (Root mean square) current indicates AC operation at 50~60Hz
** Maximum current that can be fed into LEDs depends on their configuration. Refer to p.6 and p.13
*** Average power dissipation of LED connected to AC power source without any ballast components.
3. Characteristics
1) Electro-Optical properties (Ta = 25 ℃)
Parameter
Symbol
IF=22mA(rms) / 220~240Vac*
IF=44mA(rms) / 100~120Vac**
Max
Operation
Min.
Typ.
Max.
Typ.
Unit
Luminous Flux
ΦV
260
300
-
375
lm
CCT
CT
-
4000
-
4000
K
CRI
Ra
80
83
-
83
-
Power Dissipation***
P
4.5
W
Operating Frequency
fo
※ Tolerance :
3.3
Hz
50/60
±10%
*Max 29mA (RMS) current is allowed by 220~240Vac configuration. Refer to [Register Table] on p.6.
**Max 58mA (RMS) current is allowed by 100~120Vac configuration. Refer to [Register Table] on p.6.
***Average power dissipation of PKG connected to AC power source without any ballast components.
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HV-AC LED
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2) Chromaticity Coordinates (Ta = 25 ℃)
< CIE 1931 Chromaticity diagram >
ㆍ 4000K
TABLE
Rank
TB
TC
4000K
TD
TE
Http://www.samsungled.com
CIE X
CIE Y
0.3914
0.3922
0.3784
0.3841
0.3746
0.3688
0.3865
Rank
CIE X
CIE Y
0.4006
0.4044
0.3871
0.3959
0.3849
0.3880
0.3761
0.3979
0.3962
0.3784
0.3841
0.3806
0.3726
0.3720
0.3800
0.3687
0.3652
0.3687
0.3652
0.3670
0.3578
0.3746
0.3688
0.3784
0.3647
0.3979
0.3962
0.3925
0.3798
0.3914
0.3922
0.3806
0.3726
0.3865
0.3761
0.3784
0.3647
0.3925
0.3798
0.3898
0.3716
0.3871
0.3959
0.4813
0.4319
0.3736
0.3874
ANSI
0.4562
0.4260
0.3720
0.3800
C78.377
0.4373
0.3944
0.3849
0.3880
0.4593
0.4319
TF
TG
TH
HV-AC LED
4 / 25
3) Luminous Flux (Ta = 25 ℃) (Unit, lm)
3.3W* Operation
22mA(rms) / 220Vac
44mA(rms) / 110Vac
Parameter Symbol
Rank
Luminous
Flux
※ Tolerance :
ΦV
4.5W** Operation
29mA(rms) / 220Vac
58mA(rms) / 110Vac
Min. Typ. Max.
Min.
Typ.
Max.
W1
260
-
280
290
-
320
X1
280
-
300
320
-
350
01
300
-
320
350
-
370
11
320
-
-
370
-
-
WZ
CCT
4000K
±10%
* Reference binning is done @ IF=22mA(rms), 3.3W.
** Luminous flux at 4.5W operation is provided by statistical correlation with luminous flux at 3.3W operation.
4) VF Bin (Ta = 25 ℃)
Symbol
Vf*
※ Tolerance :
Condition
IF = 22mA(rms)
Rank
S0
Min.
Typ.
Max.
F1
185
-
195
F3
195
-
200
F5
200
-
208
Unit
Vac
(rms)
±5V
* The LED is directly connected to a test source without any additional components, when measured.
The test source imposes sinusoidal current waves at 60Hz (22mA rms) across the LED, and Vf is
measured in RMS.
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HV-AC LED
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5) Resistor Table
Vin
(RMS)
Vf Bin
Target PKG Power Dissipation*
3.3W @ 44mA
Ω
300 Ω
270 Ω
560 Ω
510 Ω
460 Ω
800 Ω
750 Ω
700 Ω
F1
100Vac
330
F3
F5
F1
110Vac
F3
F5
F1
120Vac
F3
F5
Vin
(RMS)
Vf Bin
3.3W @ 22mA
F3
F5
F1
230Vac
F3
F5
F1
240Vac
F3
F5
Ω
230 Ω
220 Ω
430 Ω
410 Ω
390 Ω
620 Ω
620 Ω
620 Ω
240
4.5W @ 58mA
Ω
190 Ω
180 Ω
360 Ω
360 Ω
360 Ω
560 Ω
545 Ω
530 Ω
200
Target PKG Power Dissipation*
F1
220Vac
4.0W @ 53mA
※ LED Power dissipation tolerance : ±7%
Ω
2.1 KΩ
2.0 KΩ
2.62 KΩ
2.56 KΩ
2.5 KΩ
3.1 KΩ
3.0 KΩ
2.9 KΩ
2.2 K
4.0W @ 26.5mA
Ω
1.65 KΩ
1.6 KΩ
2.1 KΩ
2.05 KΩ
2.0 KΩ
2.5 KΩ
2.5 KΩ
2.5 KΩ
1.7 K
4.5W @ 29mA
Ω
1.46 KΩ
1.43 KΩ
1.9 KΩ
1.85 KΩ
1.8 KΩ
2.2 KΩ
2.2 KΩ
1.2 KΩ
1.5 K
* Proper selection of resistor values should be made for LEDs to be driven at the power
consumption level specified above with acceptable tolerance. The table summarizes recommended
resistor values for the mains voltages by country, and the LED's Vf bin.
HV-AC LED can be wired in two types of configuration : one is serial connection to be applicable
to the mains of 220~240Vac, and the other is parallel connection to the mains of 100~120Vac.
Each configuration is implemented by foot print pattern, on which the LED is mounted. For the
recommended foot print design, see "8.circuit design section" on p.13.
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4. Typical Characteristic Graphs
1) AC voltage operating characteristic
Ballast
Resistor
Total Power Consumption = Power_LED + Power_Resistor
Power_LED = Total Power - I2R
. < Power consumption vs. Operating current >
7
]6
W
[r
e5
wo
P4
no 3
tip
2
m
us
no 1
C0
Power_total
Power_LED
Power_Resistor
0
10
20
30
Operating Current [mA rms]
40
< LED Input Power vs. Generated Heat >
. 4.0
3.5
]
W
[t 3.0
ae 2.5
H2.0
de
ta 1.5
re
ne 1.0
G0.5
0.0
0
2
Input Power [W]
4
6
※ Total Thermal dissipation = LED + Resistor
Thermal dissipation of the LED is the vertical axis of the above graph.
Thermal dissipation of the resistor is Current2 X Resistance.
Proper resistor value and type must be selected depending on the operating condition.
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2) IV characteristic (operating in AC voltage, Ta = 25 ℃)
.
70
200
. 180
]s 160
140
m
r
A 120
m
[ 100
t
ne 80
rru 60
C 40
20
0
Without Resistor
With Resistor' (220Vac)
With Resistor' (230Vac)
60
]s
50
rm
A40
m
[ 30
tn
er
ru 20
C
10
0
0
0
1
02
1
04
1
00
06
08
1
1
2
Voltage [V rms]
02
2
04
2
Without Resistor
With Resistor''' (100Vac)
With Resistor'' (110Vac)
With Resistor' (120Vac)
04
05
06
07
08
09
00 01
1 1
Voltage [V rms]
02
1
03
1
04
1
05
1
3) Optical characteristic (operating in AC voltage, Ta = 25 ℃)
. 1.6
. 1.4
yc 1.2
ac
iff 1.0
E
su 0.8
on
i 0.6
m
uL
eiv 0.4
ta 0.2
le
R 0.0
xu 1.4
lF 1.2
su
on 1.0
i 0.8
m
uL
eiv 0.6
ta 0.4
le
R0.2
0.0
0
10
20
30
Operating Current [mA rms]
40
0
10
20
30
Operating Current [mA rms]
40
4) Thermal characteristic (operating in AC voltage, Ta = 25 ℃)
1.2
.
su 1.0
on
i 0.8
m
uL
de 0.6
liza
0.4
rm
oN
0.2
0.0
Temperature
0
20
40
60
80
Temp [℃]
100
120
measurement
point
※Temperature is measured on bottom surface of metal PCB with ballast resistors mounted.
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5) Typical Spatial Distribution
6) Spectrum Distribution
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5. Outline Drawing and Pad Configuration
Unit :
㎜
Tolerance : ±0.1
Pad
①
②
③
④
⑤
Function
Bipolarity
Bipolarity
Thermal
(Electrically Isolated)
Bipolarity
Bipolarity
Pick and Place
1. Do not place pressure on the encapsulating resin
It is recommended to use a pick&place nozzle with inside diameter at 9.2mm
2. The maximum compressing force is 20N on the polymer
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HV-AC LED
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6. Solder Conditions
1) Reflow Conditions (Pb-Free)
Reflow Frequency : 2 time max.
300
℃, Max. 10 sec
Time above 220 ℃ : Max. 60 sec
Peak Temp. : 260± 5
] 0
250
Temperature[
℃200
Preheating : 150~ 180
℃
Max. 60 sec
150
Max. Temp. gradient in cooling : - 5
100
℃/sec
60~ 120 sec
50
0
0
50
100
150
Time[ sec]
200
250
300
2) For Manual Soldering
Not more than 5 seconds @Max. 300 ℃, under soldering iron.
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7. Reliability Test Items and Conditions
1) Test Items
Test Items
Items
Test
Hours/ Cyc
les
Test Conditions
Room Temperature
life test
High Temperature
humidity life test
25℃,
IF = Max AC 25mA(rms)
85℃, 85% RH,
High Temperature life
test
Low Temperature life
test
High Temperature
Storage
Low Temperature
Storage
85℃,
- 40℃,
Thermal Shock
1,000 h
IF = Max AC 25mA(rms)
1,000 h
IF = Max AC 25mA(rms)
1,000 h
IF = Max AC25mA(rms)
1,000 h
120℃
1,000 h
- 40℃
1,000 h
200
cycles
100
cycles
- 40 / 120℃, each 30 min
Temperature humidity - 40 / 85℃, each 20 min, 100 min transfer
Cycle On/ Off test
Power On/ off each 5 min, AC 20 ㎃
Reflow (Pb- Free)
Peak 260± 5℃ for 10 sec
3 times
R1 : 10 ㏁ , R2 : 1.5 ㏀ , C : 100 ㎊
ESD(HBM)
Surge
5 times
(± 2 ㎸)
2 ㎸
Line to Line
2) Criteria for Failure
Item
Symbol
Test Condition
Forward Voltage
VF
Luminous Flux
ΦV
※ U.S.L : Upper Standard Level,
Http://www.samsungled.com
Limit
Min
Max
IF = 22 ㎃(rms)
-
U.S.L.* 1.2
IF = 22 ㎃(rms)
L.S.L.* 0.7
-
L.S.L : Lower Standard Level
HV-AC LED
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8. Circuit Design - Package and PCB
As illustrated below, two different configurations are possible depending on electric
mains to which the LED to be connected.
Schematic Circuit Connection (Example)
PCB Pattern Circuit (Example)
To improve protection against surge, two pairs of identical resistors connected in
parallel are symmetrically added to the LED so that total equivalent resistance, the
sum of R1 and R2, is equal to the selected value in p.6.
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HV-AC LED
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9. Taping Dimension
Polarity
Start
End
More than 100
㎜
Unloaded tape
㎜
Mounted with
More than (100~200)
LED
Unloaded tape
(200~400)
Leading part more than
㎜
Symbol
A
B
C
W1
W2
Dimension(㎜)
330 ± 1
80 ± 1
25 ± 0.5
13 ± 0.3
29.5 ± 1
(1) Quantity : 800 Pcs / 13" Reel.
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches is less than ±0.2 ㎜
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when
the cover tape is turned off from the carrier tape at 10 ℃ angle to be the
carrier tape.
(4) Packaging : P/N, Manufacturing data Code No. and quantity to be indicated
on a damp proof Package
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HV-AC LED
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10. Label Structure
SPHWHTHAD603
S0V0VZ
S0V0VZ XXXX
IIIIIIIIIIIIIIIIIIIIIIIIIIII
●◎◇◆□■△△△ / I▲▲▲ /
XXXXpcs
IIIIIIIIIIIIIIIIIIIIIIIII
Rank Code
/S0/ : VF Rank (refer to page 5)
/V0/ : Chromaticity Coordinate Rank, CIE (refer to page 4)
/VZ/ : Luminous Flux (refer to page 5)
11. Lot Number
The Lot number is composed of the following characters
●◎◇◆□■△△△ / I▲▲▲ / 800PCS
● : Production Site (S:SAMSUNG LED, G:Gosin China)
◎ : L (LED)
◇ : Product State (A:Normality, B:Bulk, C:First Production, R:Reproduction, S:Sample)
◆ : Year (S:2008, T:2009, U:2010...)
□ : Month (1 ~ 9, A, B)
■ : Day (1 ~ 9, A, B ~ V)
△ : SAMSUNG LED Product Number (1 ~ 999)
▲ : Reel Number (1 ~ 999)
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12. Reel Packing Structure
1) Reel
S0V0VZ
SPHWHTHAD603
S0R0MZ XXXX
IIIIIIIIIIIIIIIIIIIIIIIIIIII
●◎◇◆□■△△△ / I▲▲▲ /
XXXXpcs
IIIIIIIIIIIIIIIIIIIIIIIII
2) Aluminum Bag
Humidity Indicator Card
↓
Silica gel
S0V0VZ
SPHWHTHAD603
S0R0MZ XXXX
IIIIIIIIIIIIIIIIIIIIIIIIIIII
●◎◇◆□■△△△ / I▲▲▲ /
XXXXpcs
IIIIIIIIIIIIIIIIIIIIIIIII
↓
3) Inner Box
Material : Paper(SW3B(B))
㎜
SIZE( )
TYPE
13inch
L
W
H
335
45
335
S0V0VZ
SPHWHTHAD603
S0R0MZ XXXX
H
IIIIIIIIIIIIIIIIIIIIIIIIIIII
●◎◇◆□■△△△ / I▲▲▲ /
IIIIIIIIIIIIIIIIIIIIIIIII
XXXXpcs
HP LED
W
L
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16 / 25
4) Carton Box
↓
Material : Paper(SW3B(B))
㎜
SIZE( )
TYPE
13inch
L
W
H
350
350
350
S0V0VZ
SPHWHTHAD603
S0R0MZ XXXX
IIIIIIIIIIIIIIIIIIIIIIIIIIII
●◎◇◆□■△△△ / I▲▲▲ /
H
XXXXpcs
IIIIIIIIIIIIIIIIIIIIIIIII
HP LED
W
L
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13. Aluminum Packing Bag
Silica gel & Humidity Indicator Card in Aluminum Packing Bag
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14. Precaution for Use
1) For over-current-proof function, customers are recommended to apply
resistors to prevent sudden change of the current caused by slight shift of
the voltage.
2) This device should not be used in any type of fluid such as water, oil,
organic solvent, etc. When washing is required, IPA is recommended to use.
3) When the LEDs illuminate, operating current should be decided after
considering the ambient maximum temperature.
4) LEDs must be stored in a clean environment. If the LEDs are to be stored
for 3 months or more after being shipped from SAMSUNG LED, they should
be packed by a sealed container with nitrogen gas injected. (Shelf life of
sealed bags : 12 months, temp. 0~40℃, 20~70%RH)
5) After storage bag is open, device subjected to soldering, solder reflow, or
other high temperature processes must be:
a. Mounted within 168 hours (7days) at an assembly line with a condition
of no more than 30℃/60%RH,
b. Stored at 60% at
23±5℃.
8) Devices must be baked for 24hours at 65±5℃, if baking is required.
9) The LEDs are sensitive to the static electricity and surge. It is
recommended to use a wrist band or anti-electrostatic glove when handling
the LEDs.
If voltage exceeding the absolute maximum rating is applied to LEDs, it may
cause damage or even destruction to LED devices.
Damaged LEDs may show some unusual characteristics such as increase in
leak current, lowered turn-on voltage, or abnormal lighting of LEDs at low
current.
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10) When handling LED with tweezers, the LED Should only be held by the
polymer body, not by the encapsulant or LENS.
11) The use of appropriate nozzle for the LED recommended. For the
recommended nozzle size, refer to the figure at the below.
Inner diameter of nozzle ≥ Φ9.2mm
12) Do not stack assembled PCBs together. Since silicone is a soft material,
abrasion between two PCB assembled with silicone encapsulated LED might
cause catastrophic failure of the LEDs due to damage to encapsulant and
wire and LED detachment.
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15. Hazard Substance Analysis
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Revision History
(Model : HV-AC LED SPHWHTHAD603)
Date
Revision History
2011.09.05
Preliminary
Http://www.samsungled.com
Author
Drawn
Approved
I.S. Park
I.H. Choi
HV-AC LED
24 / 25
