SPHWW1HDNA27YHW21G

Product Family Data Sheet Rev. 1.1 2016.04.15 High Voltage LED Series Chip on Board LC013B Gen.2 High efficacy COB LED package, well-suited for use in spotlight applications Features & Benefits • Chip on Board (COB) solution makes it easy to design in • Simple assembly reduces manufacturing cost • Low thermal resistance • InGaN/GaN MQW LED with long time reliability • Completed 6,000 hours of LM-80 Testing • ENEC certified: Integral LED Module Applications • Spotlight / Downlight • LED Retrofit Bulbs • Outdoor Illumination 1# 2 Table of Contents 1. Characteristics ----------------------- 3 2. Product Code Information ----------------------- 6 3. Typical Characteristics Graphs ----------------------- 13 4. Outline Drawing & Dimension ----------------------- 18 5. Reliability Test Items & Conditions ----------------------- 19 6. Label Structure ----------------------- 20 7. Packing Structure ----------------------- 22 8. Precautions in Handling & Use ----------------------- 25 3 1. Characteristics a) Absolute Maximum Rating Item Symbol Rating Unit Condition Ambient / Operating Temperature Ta -40 ~ +105 ºC - Storage Temperature Tstg -40 ~ +120 ºC - LED Junction Temperature Tj 150 ºC - Case Temperature Tc 105 ºC *Note Forward Current IF 660 mA - Power Dissipation PD 24.4 W - ESD (HBM) - ±2 kV - ESD (MM) - ±0.5 kV - b) Electro-optical Characteristics (IF = 360 mA, Tc = 25 ºC) Item Unit Rank Min. Typ. Max. Forward Voltage (VF) V YH 32.5 35.5 38.5 3 70 - - 5 80 - - 7 90 - - 8 95 Color Rendering Index (Ra) - Thermal Resistance (junction to chip point) ºC/W - 1.6 - Beam Angle º - 115 - Nominal Power W Eye Protection 12.8 Risk 1 - - Notes: 1) The COB is tested in pulsed condition at rated test current (10 ms pulse width) and rated temperature (Tj = Tc = Ta = 25 °C) 2) Samsung maintains measurement tolerance of: forward voltage = ±5 %, CRI = ±1 3) Max Tc=105 designed within the range. ℃ (atismfor rent) ax ENEC cur condition. Refer to the derating curve, ‘3. Typical Characteristics Graph’ 4 c) Luminous Flux Characteristics CRI (Ra) Min. Nominal CCT (K) 3000 70 4000 5000 (IF = 360 mA) Flux Rank Flux Bin 1) Sorting @ Tc = 25 °C (lm) 2) Calculated Flux @ Tc = 85 °C (lm) Min. Max. Min. Max. 11 1633 1856 1470 1670 12 1856 2078 1670 1871 11 1715 1948 1543 1754 12 1948 2182 1754 1964 11 1731 1967 1558 1770 12 1967 2203 1770 1983 17 1700 1800 1547 1638 18 1800 1900 1638 1729 18 1800 1900 1638 1729 19 1900 2000 1729 1820 17 1750 1850 1593 1684 18 1850 1950 1684 1775 18 1850 1950 1684 1775 19 1950 2050 1775 1866 18 1840 1950 1674 1775 19 1950 2060 1775 1875 19 1950 2060 1775 1875 18 1760 1870 1602 1702 19 1870 1980 1702 1802 19 1870 1980 1702 1802 20 1980 2090 1802 1902 17 1680 1800 1529 1638 18 1800 1920 1638 1747 18 1800 1920 1638 1747 19 1920 2040 1747 1856 17 1680 1800 1529 1638 18 1800 1920 1638 1747 18 1800 1920 1638 1747 19 1920 2040 1747 1856 1F 1F 1F 1D 2700 1E 1D 3000 1E 1D 3500 1E 80 1D 4000 1E 1D 5000 1E 1D 5700 1E 5 c) Luminous Flux Characteristics CRI (Ra) Min. (IF = 360 mA) Nominal CCT (K) Flux Rank 2700 1G 3000 Flux Bin 1) Sorting @ Tc = 25 °C (lm) 2) Calculated Flux @ Tc = 85 °C (lm) Min. Max. Min. Max. 14 1405 1520 1279 1383 15 1520 1670 1383 1520 14 1440 1560 1310 1420 15 1560 1710 1420 1556 14 1475 1595 1342 1451 15 1595 1745 1451 1588 14 1520 1645 1383 1497 15 16454 1795 1497 1633 11 1160 1289 1056 1173 12 1289 1418 1173 1291 11 1196 1329 1089 1209 12 1329 1462 1209 1330 11 1232 1369 1121 1246 12 1369 1506 1246 1370 1G 90 3500 4000 2700 95 3000 3500 1G 1G 1E 1E 1E Notes: 1) The COB is tested in pulsed condition at rated test current (10 ms pulse width) and rated temperature (Tj = Tc = Ta = 25 °C) 2) Calculated flux values are for reference only 3) Samsung maintains measurement tolerance of: luminous flux = ±7 %, CRI = ±1 6 2. Product Code Information 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 S P H C W 1 H D N A 2 5 Y H R T 1 F Digit 1 2 3 4 5 PKG Information Code Samsung Package High Power SPH Specification WW Warm White (T/U/V/W Ranks) CW Cool White Color 6 Product Version 1 Form Factor HD 9 Lens Type N No lens 10 Internal Code A LC013 11 Chip Type 2 7 8 12 13 COB 3 Min. 70 5 Min. 80 7 Min. 90 8 Min 95 CRI & Sorting Temperature 14 15 Forward Voltage (V) 25 °C YH 32.5~38.5 W 2700 K WA,WB (MacAdam Ellipse) V 3000 K VA, VB (MacAdam Ellipse) U 3500 K UA, UB (MacAdam Ellipse) T 4000 K TA, TB R 5000 K RA Q 5700 K 2 MacAdam 2-step 3 MacAdam 3-step T ANSI bin CCT (K) 16 MacAdam / ANSI (Q/R Ranks) Bin Code: 1D 18 (ANSI bin) (MacAdam Ellipse) TW, TX, TY, TZ (ANSI bin) (MacAdam Ellipse) RW, RX, RY, RZ (ANSI bin) QW, QX, QY, QZ (ANSI bin) 17, 18, 19 (80 CR)I 1E 17 VW, VX, VY, VZ 18, 19, 20 (80 CRI) Bin Code: Luminous Flux 1F 11, 12 (70 CRI) 1G 14, 15 (80 CRI) 11, 12 (95 CRI) 7 a) Binning Structure CRI (Ra) Min. 70 (IF = 360 mA, Tc = 25 ºC) Nominal CCT (K) Product Code VF Rank Color Rank Chrom. Bin Flux Rank 3000 SPHWW1HDNA23YHVT1F YH VT VW, VX VY, VZ 1F 4000 5000 SPHWW1HDNA23YHTT1F SPHCW1HDNA23YHRT1F SPHWW1HDNA25YHW21D SPHWW1HDNA25YHW31D YH YH YH YH TT RT W2 W3 TW, TX TY, TZ 1F RW, RX RY, RZ 1F WB WA, WB 1D 1D 2700 SPHWW1HDNA25YHW21E SPHWW1HDNA25YHW31E SPHWW1HDNA25YHV21D SPHWW1HDNA25YHV31D YH YH YH YH W2 W3 V2 V3 WB WA, WB VB VA, VB 1E 1E 1D 1D 3000 SPHWW1HDNA25YHV21E SPHWW1HDNA25YHV31E SPHWW1HDNA25YHU21D 3500 80 SPHWW1HDNA25YHU31D YH YH YH YH V2 V3 U2 U3 VB VA, VB UB UA, UB 1E 1E 1D 1D Flux Bin Flux Range (Φv, lm) 11 1633 ~ 1856 12 1856 ~ 2078 11 1715 ~ 1948 12 1948 ~ 2182 11 1731 ~ 1967 12 1967 ~ 2203 17 1700 ~ 1800 18 1800 ~ 1900 17 1700 ~ 1800 18 1800 ~ 1900 18 1800 ~ 1900 19 1900 ~ 2000 18 1800 ~ 1900 19 1900 ~ 2000 17 1750 ~ 1850 18 1850 ~ 1950 17 1750 ~ 1850 18 1850 ~ 1950 18 1850 ~ 1950 19 1950 ~ 2050 18 1850 ~ 1950 19 1950 ~ 2050 18 1840 ~ 1950 19 1950 ~ 2060 18 1840 ~ 1950 19 1950 ~ 2060 SPHWW1HDNA25YHU21E YH U2 UB 1E 19 1950 ~ 2060 SPHWW1HDNA25YHU31E YH U3 UA, UB 1E 19 1950 ~ 2060 18 1760 ~ 1870 19 1870 ~ 1980 18 1760 ~ 1870 19 1870 ~ 1980 19 1870 ~ 1980 20 1980 ~ 2090 19 1870 ~ 1980 20 1980 ~ 2090 17 1680 ~ 1800 18 1800 ~ 1920 17 1680 ~ 1800 18 1800 ~ 1920 18 1800 ~ 1920 19 1920 ~ 2040 18 1800 ~ 1920 19 1920 ~ 2040 17 1680 ~ 1800 18 1800 ~ 1920 18 1800 ~ 1920 19 1920 ~ 2040 SPHWW1HDNA25YHT21D SPHWW1HDNA25YHT31D YH YH T2 T3 TB TA, TB 1D 1D 4000 SPHWW1HDNA25YHT21E SPHWW1HDNA25YHT31E SPHCW1HDNA25YHR31D SPHCW1HDNA25YHRT1D YH YH YH YH T2 T3 R3 RT TB TA, TB RA RW, RX, RY, RZ 1E 1E 1D 1D 5000 SPHCW1HDNA25YHR31E SPHCW1HDNA25YHRT1E SPHCW1HDNA25YHQT1D YH YH YH R3 RT QT RA RW, RX, RY, RZ 1E 1E QW, QX, QY, QZ 1D QW, QX, QY, QZ 1E 5700 SPHCW1HDNA25YHQT1E YH QT 8 a) Binning Structure CRI (Ra) Min. Nominal CCT (K) (IF = 360 mA, Tc = 25 ºC) Product Code VF Rank Color Rank Chrom. Bin Flux Rank SPHWW1HDNA27YHW31G YH W3 WB 1G Flux Bin Flux Range (Φv, lm) 14 1405 ~ 1520 15 1520 ~ 1670 14 1405 ~ 1520 15 1520 ~ 1670 14 1440 ~ 1560 15 1560 ~ 1710 14 1440 ~ 1560 15 1560 ~ 1710 14 1475 ~ 1595 15 1595 ~ 1745 14 1475 ~ 1595 15 1595 ~ 1745 14 1520 ~ 1645 15 1645 ~ 1795 14 1520 ~ 1645 15 1645 ~ 1795 11 1160 ~ 1289 12 1289 ~ 1418 11 1160 ~ 1289 12 1289 ~ 1418 11 1169 ~ 1329 12 1329 ~ 1462 11 1169 ~ 1329 12 1329 ~ 1462 11 1232 ~ 1369 12 1369 ~ 1506 11 1232 ~ 1369 12 1369 ~ 1506 2700 SPHWW1HDNA27YHW21G SPHWW1HDNA27YHV21G YH YH W2 V2 WA, WB VB 1G 1G 3000 SPHWW1HDNA27YHV31G YH V3 VA, VB 1G 90 SPHWW1HDNA27YHU21G YH U2 UB 1G 3500 SPHWW1HDNA27YHU31G SPHWW1HDNA27YHT21G YH YH U3 T2 UA, UB TB 1G 1G 4000 SPHWW1HDNA27YHT31G SPHWW1HDNA28YHW21E YH YH T3 W2 TA, TB WB 1G 1E 2700 SPHWW1HDNA28YHW31E SPHWW1HDNA28YHV21E 95 YH YH W3 V2 WA,WB VB 1E 1E 3000 SPHWW1HDNA28YHV31E SPHWW1HDNA28YHU21E YH YH V3 U2 VA,VB UB 1E 1E 3500 SPHWW1HDNA28YHU31E YH U3 UA,UB 1E 9 b) Chromaticity Region & Coordinates Region CIE x CIE y Region (IF = 360 mA, Ta = 25 ºC) CIE x CIE y Region CIE x V rank (3000 K) 0.4223 0.399 0.4345 0.4033 0.4431 0.4213 VW CIE y Region CIE x CIE y 0.3871 0.3959 0.4006 0.4044 0.3952 0.388 T rank (4000 K) 0.4345 0.4033 0.4468 0.4077 0.4562 0.4260 VY 0.3736 0.3874 0.3871 0.3959 0.3828 0.3803 TW TY 0.4299 0.4165 0.4431 0.4213 0.3703 0.3726 0.3828 0.3803 0.4223 0.399 0.4260 0.3854 0.3703 0.3726 0.3828 0.3803 0.4147 0.3814 0.4373 0.3893 0.3828 0.3803 0.3952 0.388 VX VZ TX TZ 0.4260 0.3854 0.4468 0.4077 0.3784 0.3647 0.3898 0.3716 0.4345 0.4033 0.4345 0.4033 0.367 0.3578 0.3784 0.3647 0.3290 0.3538 0.3376 0.3616 0.3371 0.3490 R rank (5000 K) 0.3376 0.3616 0.3463 0.3687 0.3451 0.3554 0.3371 0.3371 0.3451 0.3554 0.3440 0.3428 0.3366 0.3369 Q rank (5700 K) 0.3463 0.3687 0.3551 0.3760 0.3533 0.3620 0.3490 0.3451 0.3554 0.3215 0.3350 0.3290 0.3417 0.3490 0.3451 0.3554 0.3215 0.3350 0.3290 0.3417 0.3533 0.3620 0.3290 0.3417 0.3371 0.3490 0.3515 0.3487 0.3290 0.3300 0.3366 0.3369 0.3440 0.3428 0.3222 0.3243 0.3290 0.3300 RW RY RX 0.3207 0.3462 0.3290 0.3538 0.3290 0.3417 QW RZ QY QX QZ 10 b) Chromaticity Region & Coordinates (IF = 360 mA, Ta = 25 ºC) θ CIE x,y MacAdam Ellipse (WA, WB) MacAdam Ellipse (VA, VB) θ a b Step CIE x CIE y θ a b 0.4101 53.70 0.0054 0.0028 2-step 0.4338 0.403 53.22 0.0056 0.0027 0.4101 53.70 0.0081 0.0042 3-step 0.4338 0.4030 53.22 0.0083 0.0041 Step CIE x CIE y 2-step 0.4578 3-step 0.4578 MacAdam Ellipse (UA, UB) MacAdam Ellipse (TA, TB) Step CIE x CIE y θ a b Step CIE x CIE y θ a b 2-step 0.4073 0.3917 54.00 0.0062 0.0028 2-step 0.3818 0.3797 53.72 0.0063 0.0027 3-step 0.4073 0.3917 54.00 0.0093 0.0041 3-step 0.3818 0.3797 53.72 0.0094 0.0040 MacAdam Ellipse (RA) Step CIE x CIE y θ a b 3-step 0.3447 0.3553 59.62 0.0082 0.0035 Note: Samsung maintains measurement tolerance of: Cx, Cy = ±0.005 11 3. Typical Characteristics Graphs a) Spectrum Distribution (IF = 360 mA, Tc = 25 ºC) CCT: 2700 K (80 CRI) CCT: 3000 K (80 CRI) CCT: 3500 K (80 CRI) CCT: 4000 K (80 CRI) CCT: 5000 K (80 CRI) CCT: 5700 K (80 CRI) 12 CCT: 2700 K (90 CRI) CCT: 3000 K (90 CRI) CCT: 3500 K (90 CRI) CCT: 4000 K (90 CRI) b) Forward Current Characteristics 80 CRI (Tc = 25 ºC) 13 90 CRI c) Temperature Characteristics 80 CRI 90 CRI (IF = 360 mA) 14 d) Color Shift Characteristics 80 CRI 90 CRI e) Derating Curve Tc = 25 ºC IF = 360 mA 15 f) Beam Angle Characteristics 80 CRI (IF = 360 mA, Tc = 25 ºC) 90 CRI 16 4. Outline Drawing & Dimension 1. Unit: mm 2. Tolerance: ± 0.15 mm Tc point Note 1. Unit: mm 2. Tolerance: ± 0.2 mm Note: Item Dimension Tolerance Unit Length 17.0 ±0.15 mm Width 17.0 ±0.15 mm Height 1.50 ±0.20 mm Light Emitting Surface (LES) Diameter 11 ±0.15 mm Denoted product information above is only an example ( 13W8027 : 13W, CRI80+, 2700K ) 17 5. Reliability Test Items & Conditions a) Test Items Test Item Test Condition Test Hour / Cycle Room Temperature Life Test 25 ºC, IF = max 1000 h High Temperature Humidity Life Test 85 ºC, 85 % RH, DC Derating, IF = max 1000 h High Temperature Life Test 105 ºC, DC Derating, IF = max 1000 h Low Temperature Life Test -40 ºC, DC 660 mA 1000 h High Temperature Storage 120 ºC 1000 h Low Temperature Storage -40 ºC 1000 h Thermal Shock -45 ºC / 15 min ↔ 125 ºC / 15 min temperature change in 5 min 200 cycles Temperature Cycle On/Off Test -40 ºC / 85 ºC each 20 min, 100 min transfer power on/off each 5 min, DC 360 mA 100 cycles Temperature Humidity Storage Test -10 ºC ↔ 25 ºC, 95 % RH ↔ 85 ºC, 95 % RH (24 h / cycle) 100 cycles R1: 10 MΩ R2: 1.5 kΩ C: 100 pF V: ±2 kV ESD (HBM) 5 times R1: 10 MΩ R2: 0 kΩ ESD (MM) 5 times C: 200 pF V: ±0.5 kV Vibration Test 20 ~ 80 Hz (displacement: 0.06 inch, max. 20 g) 80 ~ 2 kHz (max. 20 g) min. frequency ↔ max. frequency 4 min transfer 4 times Mechanical Shock Test 1500 g, 0.5 ms each of the 6 surfaces (3 axis x 2 sides) 5 times Salt Spray Test 35 ºC, 5 % salt water 8 h spray, 16 h dwell 2 cycles b) Criteria for Judging the Damage Item Symbol Test Condition (Tc = 25 ºC) Forward Voltage VF Luminous Flux Φv Limit Min. Max. IF = 360 mA L.S.L. * 0.9 U.S.L. * 1.1 IF = 360 mA L.S.L * 0.7 U.S.L * 1.3 18 6. Label Structure a) Label Structure Aluminum Bag & Inner Box Note: Outer Box Denoted rank code and product code above is only an example (see description on page 6) Rank Code: ⓐⓑ: Forward Voltage rank (refer to page 7-10) ⓒⓓ: Chromaticity bin ⓔⓕ: Luminous Flux bin (refer to page 11-12) (refer to page 7-10) 19 b) Lot Number The lot number is composed of the following characters: ●◎◇◆□■△△△ / 1▲▲▲ / xxx PCS ● : Production site ◎ : L (LED) ◇ : Product state ◆ : Year □ : Month ■ : Day (1~9, A, B~V) △△△ : Product serial number (001 ~ 009) ▲▲▲ : Tray number (S: Korea, G: Tianjin, China) (A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample) (Y: 2014, Z: 2015, A: 2016, …) (1~9, A, B, C) (001 ~ 999) 20 7. Packing Structure Packing material Max. quantity in pcs of COB Tray Dimension (mm) Length Width Height Tolerance 60 322.6 135.9 10.8 1.0 Aluminum Bag 480 (8 trays) 450 230 - 10 PE Foam Pad - 280 130 10 2 Inner Box 480 (1 aluminum bag) 338 148 55 2 Outer Box 1,920 (4 inner boxes) 351 308 120 5 Pallet 107,520 (56 outer boxes) 1000 1000 130 10 a) Packing Structure Cover Tray(1pcs) Body Tray(8pcs) HUMIDITY INDICATOR SILICA GEL(5g) (Do not use Cobalt Dichloride.) (Do not use Cobalt Dichloride.) MBB bag Heat Sealing Taping (Taping Strength : feebly) Material is PET(Antistatic) 10(5) ~ 10(9) ohm/sq 8body + 1cover tray / MBB bag (MBB-BAG : Heat Sealing) 4 inner-box / Out-box BODY TRAY 8ea 6ea 4ea 2ea PEFOAM 0ea 1ea 2ea 3ea 21 b) Tray ① COVER ② BODY 22 c) Aluminum Vinyl Packing Bag d) Silica Gel & Humidity Indicator Card inside Aluminum Vinyl Packing Bag 23 8. Precautions in Handling & Use 1) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA is recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the device. 2) LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped from Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 months at temperature 0~40 ºC, 0~90 % RH). 3) After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be: a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 ºC / 60 % RH, or b. Stored at 60 % at 23 ± 5 ºC. 6) Devices must be baked for 1 hour at 60 ± 5 ºC, if baking is required. 7) The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or antielectrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current. 8) VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical properties of materials used in luminaires and they must be carefully selected. 9) The resin area is very sensitive, please do not handle, press, touch, rub, clean, or pick by with tweezers on it. Instead, please pick at the handling area as indicated below. Legal and additional information. About Samsung Electronics Co., Ltd. Samsung Electronics Co., Ltd. inspires the world and shapes the future with transformative ideas and technologies, redefining the worlds of TVs, smartphones, wearable devices, tablets, cameras, digital appliances, printers, medical equipment, network systems and semiconductors. We are also leading in the Internet of Things space through, among others, our Digital Health and Smart Home initiatives. We employ 307,000 people across 84 countries. To discover more, please visit our official website at www.samsung.com and our official blog at global.samsungtomorrow.com. Copyright © 2015 Samsung Electronics Co., Ltd. All rights reserved. Samsung is a registered trademark of Samsung Electronics Co., Ltd. Specifications and designs are subject to change without notice. Non-metric weights and measurements are approximate. All data were deemed correct at time of creation. Samsung is not liable for errors or omissions. All brand, product, service names and logos are trademarks and/or registered trademarks of their respective owners and are hereby recognized and acknowledged. Samsung Electronics Co., Ltd. 95, Samsung 2-ro Giheung-gu Yongin-si, Gyeonggi-do, 446-711 KOREA www.samsungled.com