CB1608PA600

DPS-081104 CHIP BEADS Power Line Series v Features • High impedance characteristics • Low Rdc, High Current characteristics • Good reliability (Monolithic structure) • Magnetically shielded • Fast mounting speed • RoHS compliant W L v Dimensions B (unit : mm) T v Applications • PDP/LCD Monitor, Digital TV/VCR etc. Size 1005 1608 2012 L 1.0±0.10 1.6±0.15 2.0±0.20 3.2±0.20 4.5±0.25 4.5±0.25 W 0.5±0.10 0.8±0.15 1.25±0.2 1.6±0.20 1.6±0.20 3.2±0.25 T 0.5±0.10 0.8±0.15 0.85±0.2 1.1±0.20 1.3±0.20 1.5±0.25 B 0.25±0.1 0.3±0.2 0.5±0.3 0.5±0.3 0.5±0.3 0.5±0.3 v General Code CB 1 3216 2012 2 P 3 J 4 601 5 T 6 4516 4532 1 2 3 4 5 6 Series Code CB : Chip Ferrite Beads Dimension Code The first two digits : length(mm) The last two digits : width(mm) Application Code G : Signal Line P : High Current Line U : Ultra High Current Line Material Code A: General Frequency K,J: Medium Frequency M: High Frequency V: Very High Frequency Impedance Value Code The first two digits represents significant The last digit is the number of zeros following ex) 601 = 600 (Ω) Packaging Code T : Reel paper packaging E : Reel embossed tape packaging v Temperature Range • Operating Temp. -55 ~ +125℃ • Storage Temp. -10 ~ +40 ℃ v Typical Material Characteristics High μ (Low RXCP) Low μ (High RXCP) V M J,K A This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS, For Power Line v 1608 SIZE Impedance (Ω) ± 25% 10 30 60 120 180 10 30 60 120 180 30 60 120 30 60 120 DC Resistance (Ω) max. 0.05 0.05 0.08 0.10 0.12 0.05 0.05 0.08 0.10 0.12 0.05 0.10 0.12 0.06 0.08 0.12 Rated Current (mA) max. 2000 2000 1000 800 800 2000 2000 Test Frequency (MHz) Samwha P/N CB1608PA100 CB1608PA300 CB1608PA600 CB1608PA121 CB1608PA181 CB1608PK100 CB1608PK300 CB1608PK600 CB1608PK121 CB1608PK181 CB1608PJ300 CB1608PJ600 CB1608PJ121 CB1608PM300 CB1608PM600 CB1608PM121 CHIP BEAD, Power Line Series 1000 800 800 2000 1000 1000 1500 1000 800 100 ※ Measuring Equipment -. Z : HP4291B / E4991A -. Rdc : HP4338B This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS, For Power Line v 1608 SIZE 16 CB 1608 PA 100 Z Impedance [W] 40 CB 1608 PA 300 Z Impedance [W] R 100 CB 1608 PA 600 Z R Impedance [W] 12 30 75 R 8 20 50 X 4 X 10 25 X 0 1 10 100 1000 0 1 10 100 1000 0 1 10 100 1000 Frequency [MHz] Frequency [MHz] Frequency [MHz] 160 CB 1608 PA 121 Z Impedance [W] R 160 CB 1608 PK 600 Impedance [W] 240 CB 1608 PK 121 CHIP BEAD, Power Line Series Impedance [W] 120 120 Z R 180 Z R X 1 10 100 1000 80 80 120 40 X 40 X 1 10 100 1000 60 0 1 10 100 1000 0 0 Frequency [MHz] Frequency [MHz] Frequency [MHz] 100 CB 1608 PJ 300 Impedance [W] 120 CB 1608 PJ 600 Z Impedance [W] 120 CB 1608 PM 300 Impedance [W] 75 Z R 90 90 50 60 R X 60 Z R 25 X 1 10 100 1000 30 30 X 0 1 10 100 1000 0 1 10 100 1000 0 Frequency [MHz] Frequency [MHz] Frequency [MHz] 200 CB 1608 PM 600 Impedance [W] 400 CB 1608 PM 121 Impedance [W] 150 300 Z 100 Z 200 R 50 R 100 X 1 10 100 1000 X 1 10 100 1000 0 0 Frequency [MHz] Frequency [MHz] This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS, For Power Line v 2012 SIZE Impedance (Ω) ± 25% 11 30 60 120 220 300 600 15 30 60 120 180 220 300 600 1000 2000 600 800 60 120 220 300 600 DC Resistance (Ω) max. 0.007 0.015 0.025 0.050 0.050 0.100 0.130 0.080 0.015 0.025 0.050 0.050 0.050 0.070 0.130 0.250 0.300 0.100 0.150 0.020 0.050 0.050 0.070 0.130 Rated Current (mA) max. 3000 3000 3000 2500 2000 2000 1500 Test Frequency (MHz) Samwha P/N CB2012PA110 CB2012PA300 CB2012PA600 CB2012PA121 CB2012PA221 CB2012PA301 CB2012PA601 CB2012PK150 CB2012PK300 CB2012PK600 CB2012PK121 CB2012PK181 CB2012PK221 CB2012PK301 CB2012PK601 CB2012PK102 CB2012PK202 CB2012PJ601 CB2012PJ801 CB2012PM600 CB2012PM121 CB2012PM221 CB2012PM301 CB2012PM601 CHIP BEAD, Power Line Series 2000 3000 3000 2500 2000 2000 2000 1500 1000 500 1500 1500 3000 2500 2000 2000 1500 100 70 100 ※ Measuring Equipment -. Z : HP4291B / E4991A -. Rdc : HP4338B This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS, For Power Line v 2012 SIZE 20 CB 2012 PA 110 Impedance [W] Z R 120 CB 2012 PA 600 Impedance [W] 160 CB 2012 PA 121 Z Impedance [W] 15 90 Z R X 1 10 100 1000 120 R 80 10 60 5 X 30 40 X 0 1 10 100 1000 0 0 1 10 100 1000 Frequency [MHz] Frequency [MHz] Frequency [MHz] 400 CB 2012 PA 221 Impedance [W] Z R X 1 10 100 1000 800 CB 2012 PA 601 Impedance [W] Z R X 160 CB 2012 PK 121 Z CHIP BEAD, Power Line Series Impedance [W] 300 600 120 R 80 200 400 X 40 100 200 0 0 1 10 100 1000 0 1 10 100 1000 Frequency [MHz] Frequency [MHz] Frequency [MHz] 400 CB 2012 PK 301 Z Impedance [W] 800 CB 2012 PK 601 Z Impedance [W] 1200 CB 2012 PK 102 Z R Impedance [W] 300 600 900 R 200 400 X 100 R X 600 X 300 200 0 1 10 100 1000 0 1 10 100 1000 0 1 10 100 1000 Frequency [MHz] Frequency [MHz] Frequency [MHz] 2500 CB 2012 PK 202 Z Impedance [W] 1000 CB 2012 PJ 601 Z Impedance [W] 1000 CB 2012 PJ 801 Z 2000 Impedance [W] 750 750 1500 R X R 500 R 500 1000 500 250 X 250 X 0 1 10 100 1000 0 1 10 100 1000 0 1 10 100 1000 Frequency [MHz] Frequency [MHz] Frequency [MHz] This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS, For Power Line v 2012 SIZE 120 CB 2012 PM 600 Z Impedance [W] R 400 CB 2012 PM 121 Impedance [W] 1200 CB 2012 PM 601 Z Impedance [W] 90 300 900 Z 200 R 600 60 R 100 30 X X 300 X 0 1 10 100 1000 0 1 10 100 1000 0 1 10 100 1000 Frequency [MHz] Frequency [MHz] Frequency [MHz] CHIP BEAD, Power Line Series This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS, For Power Line v 3216 SIZE Impedance (Ω) ± 25% 31 35 50 60 70 90 100 120 150 300 500 600 500 600 600 120 600 DC Resistance (Ω) max. 0.03 0.03 0.03 0.03 0.03 0.03 0.03 0.03 0.03 0.06 0.06 0.06 0.06 0.06 0.06 0.03 0.06 Rated Current (mA) max. 3000 3000 3000 3000 3000 3000 3000 Test Frequency (MHz) Samwha P/N CB3216PA310 CB3216PA350 CB3216PA500 CB3216PA600 CB3216PA700 CB3216PA900 CB3216PA101 CB3216PA121 CB3216PA151 CB3216PA301 CB3216PA501 CB3216PA601 CB3216PK501 CB3216PK601 CB3216PJ601 CB3216PM121 CB3216PM601 CHIP BEAD, Power Line Series 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 100 ※ Measuring Equipment -. Z : HP4291B / E4991A -. Rdc : HP4338B This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS, For Power Line v 3216 SIZE 80 CB 3216 PA 310 Impedance [W] 80 CB 3216 PA 350 Impedance [W] 80 CB 3216 PA 500 Z R Impedance [W] 60 60 60 40 Z R Z 40 40 R 20 20 20 X X 0 1 10 100 1000 0 1 10 100 X 1000 0 1 10 100 1000 Frequency [MHz] Frequency [MHz] Frequency [MHz] 120 CB 3216 PA 101 Z Impedance [W] R 160 CB 3216 PA 121 Z Impedance [W] R 600 CB 3216 PA 501 Z Impedance [W] 90 120 450 CHIP BEAD, Power Line Series R 300 60 80 X 30 40 X 150 X 0 1 10 100 1000 0 1 10 100 1000 0 1 10 100 1000 Frequency [MHz] Frequency [MHz] Frequency [MHz] 600 CB 3216 PK 501 Z Impedance [W] 320 CB 3216 PM 121 Z Impedance [W] 1200 CB 3216 PM 601 Z Impedance [W] 450 240 900 R 300 R 160 R 600 X 150 80 X 300 X 0 1 10 100 1000 0 1 10 100 1000 0 1 10 100 1000 Frequency [MHz] Frequency [MHz] Frequency [MHz] This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS Reliability & Test Condition Item Operating temperature range Storage temperature range Requirements - 55 ℃ ~ + 125 ℃ 40 ℃ max., 70% RH max. Test Conditions at packing condition Preheat temperature : 100 ~ 150 ℃ Preheat time : 60 sec. Solder temperature : 245 ± 5 ℃ Soldering time : 10 ± 1 sec. Solderability More than 90% of the terminal electrode shall be covered with new solder CHIP BEAD, Reliability & Test Condition Resistance to soldering heat 1. No damage such as cracks should be caused in chip element 2. More than 75% of the terminal electrode shall be covered with new solder 3. Impedance shall not change more than ±30 % More than 50% of the terminal electrode shall be covered with new solder Preheat temperature : 100 ~ 150 ℃ Preheat time : 60 sec. Solder temperature : 270 ± 10 ℃ Soldering time : 10 ± 0.5 sec. Reflow soldering ST ≥ ST 1 CT 2 CT Preheat temperature : 150 ℃ Preheat time : 60 sec. Solder temperature : 245 ± 5 ℃ Soldering time : 10 sec. max. (Reflow soldering profile) High temperature resistance Temperature : 125 ± 3 ℃ Time : 500 ± 12 hours Measurement at room ambient temperature after placing for 24 hours Temperature : 125 ± 3 ℃ Applied current : rated current Time : 1000 ± 12 hours Measurement at room ambient temperature after placing for 24 hours Temperature : 40 ± 2 ℃ Humidity : 90 ± 2 % RH Time : 500 ± 12 hours Measurement at room ambient temperature after placing for 24 hours High temperature load resistance 1. No mechanical damage 2. Impedance shall not change more than ±30 % Humidity resistance This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS Reliability & Test Condition Item Requirements Test Conditions Temperature : 40 ± 2 ℃ Humidity : 90 ± 2 % RH Applied current : rated current Time : 500 ± 12 hours Measurement at room ambient temperature after placing for 24 hours Temperature : -55 ± 3 ℃ Time : 1000 ± 12 hours Measurement at room ambient temperature after placing for 24 hours 1. -55 ± 3℃ for 30 minutes 2.125 ± 3 ℃ for 30 minutes 3. repeat 100 cycle Frequency : 10 ~ 55 Hz Amplitude : 1.5 mm Direction : X, Y, Z Sweep time : 2 hours for each axis Drop 10 times on a concrete floor from a height of 100 cm No mechanical damage ITEM A (mm) B (mm) C (mm) W (kgf) 1005 1608 2012 3216 4516 4532 Humidity load resistance Low temperature resistance 1. No mechanical damage 2. Impedance shall not change more than ±30 % Thermal shock CHIP BEAD, Reliability & Test Condition Vibration Drop W R0.5 0.7 0.5 0.7 0.7 1.0 0.8 1.3 2.0 1.0 1.0 1.3 4.0 1.3 1.5 3.0 5.0 1.5 3.6 3.0 5.0 1.5 3.6 3.8 Flexure strength C A 5.0 B 20 A 50 W Bending strength The terminal electrode shall be neither break off nor the chip damage R340 2 mm Resistance meter This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS Packaging v Standard Quantity Size 1005 1608 2012 3216 4516 4532 Q’TY(PCS) 10,000 4,000 4,000 3,000 2,000 1,000 0.85 T size Remarks v Reel Dimension CHIP BEAD, Packaging (Unit:mm) A Φ178±2 D 4±0.8 B Φ50 min. E 2±0.2 C Φ13±0.5 W 9±1.5 v Leader & Blank Portion (Unit:mm) Blank 350±50 mm 60 Pitch Chips Blank 350±50 mm 60 Pitch Leader 150 min This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS Packaging v Taping Dimensions (Paper tape) T A B S P (Unit:mm) Type 1005 1608 2012 A ±0.1 1.15 1.80 2.30 B ±0.1 0.65 1.00 1.55 P ±0.1 2.0 4.0 4.0 S ±0.1 1.0 2.0 2.0 T (Max.) 0.8 1.1 1.1 CHIP BEAD, Packaging v Taping Dimensions (Emboss tape) (Unit:mm) Type 2012 3216 4516 4532 A ±0.1 2.25 3.50 4.90 4.85 B ±0.1 1.45 1.85 1.90 3.60 C ±0.1 1.50 1.25 1.35 1.40 D ±0.1 0.23 0.23 0.30 0.30 This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS Soldering Profile v Reflow Soldering Pre - heating 230 180 150 Soldering 245±5℃ Cooling 10 sec. max. 60~120 sec. 30~60 sec. 60 sec. min. CHIP BEAD, Soldering Profile v Flow Soldering Pre - heating 250 180 150 Soldering 250±5℃ Cooling 60 sec. min. 10 sec. max. 60 sec. min. v Manual Soldering 300 Soldering Iron : 30W max. Diameter of soldering iron : 1.2 mm max. 2 sec. max. Tc This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD