CB1608UK600

DPS-081104 CHIP BEADS Ultra Power Line Series v Features • High Current characteristics • Low Rdc characteristics • Good reliability (Monolithic structure) • Magnetically shielded • Fast mounting speed • RoHS compliant W L v Dimensions B (unit : mm) T v Applications • PDP/LCD Monitor, Digital TV/VCR etc. Size 1005 1608 2012 L 1.0±0.10 1.6±0.15 2.0±0.20 3.2±0.20 4.5±0.25 4.5±0.25 W 0.5±0.10 0.8±0.15 1.25±0.2 1.6±0.20 1.6±0.20 3.2±0.25 T 0.5±0.10 0.8±0.15 0.85±0.2 1.1±0.20 1.3±0.20 1.5±0.25 B 0.25±0.1 0.3±0.2 0.5±0.3 0.5±0.3 0.5±0.3 0.5±0.3 v General Code CB 1 3216 2012 2 U 3 A 4 300 5 T 6 4516 4532 1 2 3 4 5 6 Series Code CB : Chip Ferrite Beads Dimension Code The first two digits : length(mm) The last two digits : width(mm) Application Code G : Signal Line P : High Current Line U : Ultra High Current Line Material Code A: General Frequency K,J: Medium Frequency M: High Frequency V: Very High Frequency Impedance Value Code The first two digits represents significant The last digit is the number of zeros following ex) 300 = 30 (Ω) Packaging Code T : Reel paper packaging E : Reel embossed tape packaging v Temperature Range • Operating Temp. -55 ~ +125℃ • Storage Temp. -10 ~ +40 ℃ v Typical Material Characteristics High μ (Low RXCP) Low μ (High RXCP) V M J,K A This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS, For Ultra Power Line v 1608~4532 SIZE Impedance (Ω) ± 25% 100 50 60 30 60 100 120 120 120 120 120 60 120 60 120 400 DC Resistance (Ω) max. 0.030 0.025 0.030 0.010 0.015 0.020 0.030 0.030 0.030 0.030 0.020 0.010 0.200 0.010 0.030 0.045 Rated Current (mA) max. 4000 4000 4000 5000 5000 4000 Test Frequency (MHz) Samwha P/N CB1608UA101 CB1608UK500 CB1608UK600 CB2012UA300 CB2012UA600 CB2012UA101 CB2012UA121 CB2012UK121 CB2012UJ121 CB2012UM121 CB3216UA121 CB3216UM600 CB3216UM121 CB4516UM600 CB4532UK121 CB4532UK401 CHIP BEAD, Ultra Power Line Series 4000 4000 4000 4000 6000 6000 6000 6000 6000 4000 100 ※ Measuring Equipment -. Z : HP4291B / E4991A -. Rdc : HP4338B This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS, For Ultra Power Line v 1608~4532 SIZE CB 1608 UK 500 100 100 C B 1608 UK 600 Z Z Impedance [ O ] 75 Impedance [ O ] 75 R R 50 50 X 25 25 X 1 10 100 1000 0 1 10 100 1000 0 Frequency [MHz] Frequency [MHz] 60 C B 2012 UA 300 Impedance [Ohm] 120 C B 2012 UA 101 Z Impedance [Ohm] R 200 C B 2012 UK 121 Z R CHIP BEAD, Ultra Power Line Series Impedance [Ohm] 45 90 150 Z 30 60 100 R 15 X 1 10 100 1000 30 50 X X 0 1 10 100 1000 0 0 1 10 100 1000 Frequency [MHz] Frequency [MHz] Frequency [MHz] 200 C B 2012 UJ 121 Z 160 CB 2012 UM 121 Z Impedance [ Ω ] Im p e d a n c e [ O ] 150 120 R 100 R 80 X 50 X 40 0 0 1 10 100 1000 1 10 100 1000 Frequency [MHz] Frequency[MHz] 180 C B 3216 UA 121 Z 160 CB 3216 UM 121 Z Impedance [ O ] 280 C B 4532 UK 121 Z R Impedance [ Ω ] Impedance [ O ] 135 R 120 210 R 80 90 140 X 40 45 X 70 X 0 0 1 10 100 1000 1 10 100 1000 0 1 10 100 1000 Frequency [MHz] Frequency[MHz] Frequency [MHz] This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS Reliability & Test Condition Item Operating temperature range Storage temperature range Requirements - 55 ℃ ~ + 125 ℃ 40 ℃ max., 70% RH max. Test Conditions at packing condition Preheat temperature : 100 ~ 150 ℃ Preheat time : 60 sec. Solder temperature : 245 ± 5 ℃ Soldering time : 10 ± 1 sec. Solderability More than 90% of the terminal electrode shall be covered with new solder CHIP BEAD, Reliability & Test Condition Resistance to soldering heat 1. No damage such as cracks should be caused in chip element 2. More than 75% of the terminal electrode shall be covered with new solder 3. Impedance shall not change more than ±30 % More than 50% of the terminal electrode shall be covered with new solder Preheat temperature : 100 ~ 150 ℃ Preheat time : 60 sec. Solder temperature : 270 ± 10 ℃ Soldering time : 10 ± 0.5 sec. Reflow soldering ST ≥ ST 1 CT 2 CT Preheat temperature : 150 ℃ Preheat time : 60 sec. Solder temperature : 245 ± 5 ℃ Soldering time : 10 sec. max. (Reflow soldering profile) High temperature resistance Temperature : 125 ± 3 ℃ Time : 500 ± 12 hours Measurement at room ambient temperature after placing for 24 hours Temperature : 125 ± 3 ℃ Applied current : rated current Time : 1000 ± 12 hours Measurement at room ambient temperature after placing for 24 hours Temperature : 40 ± 2 ℃ Humidity : 90 ± 2 % RH Time : 500 ± 12 hours Measurement at room ambient temperature after placing for 24 hours High temperature load resistance 1. No mechanical damage 2. Impedance shall not change more than ±30 % Humidity resistance This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS Reliability & Test Condition Item Requirements Test Conditions Temperature : 40 ± 2 ℃ Humidity : 90 ± 2 % RH Applied current : rated current Time : 500 ± 12 hours Measurement at room ambient temperature after placing for 24 hours Temperature : -55 ± 3 ℃ Time : 1000 ± 12 hours Measurement at room ambient temperature after placing for 24 hours 1. -55 ± 3℃ for 30 minutes 2.125 ± 3 ℃ for 30 minutes 3. repeat 100 cycle Frequency : 10 ~ 55 Hz Amplitude : 1.5 mm Direction : X, Y, Z Sweep time : 2 hours for each axis Drop 10 times on a concrete floor from a height of 100 cm No mechanical damage ITEM A (mm) B (mm) C (mm) W (kgf) 1005 1608 2012 3216 4516 4532 Humidity load resistance Low temperature resistance 1. No mechanical damage 2. Impedance shall not change more than ±30 % Thermal shock CHIP BEAD, Reliability & Test Condition Vibration Drop W R0.5 0.7 0.5 0.7 0.7 1.0 0.8 1.3 2.0 1.0 1.0 1.3 4.0 1.3 1.5 3.0 5.0 1.5 3.6 3.0 5.0 1.5 3.6 3.8 Flexure strength C A 5.0 B 20 A 50 W Bending strength The terminal electrode shall be neither break off nor the chip damage R340 2 mm Resistance meter This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS Packaging v Standard Quantity Size 1005 1608 2012 3216 4516 4532 Q’TY(PCS) 10,000 4,000 4,000 3,000 2,000 1,000 0.85 T size Remarks v Reel Dimension CHIP BEAD, Packaging (Unit:mm) A Φ178±2 D 4±0.8 B Φ50 min. E 2±0.2 C Φ13±0.5 W 9±1.5 v Leader & Blank Portion (Unit:mm) Blank 350±50 mm 60 Pitch Chips Blank 350±50 mm 60 Pitch Leader 150 min This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS Packaging v Taping Dimensions (Paper tape) T A B S P (Unit:mm) Type 1005 1608 2012 A ±0.1 1.15 1.80 2.30 B ±0.1 0.65 1.00 1.55 P ±0.1 2.0 4.0 4.0 S ±0.1 1.0 2.0 2.0 T (Max.) 0.8 1.1 1.1 CHIP BEAD, Packaging v Taping Dimensions (Emboss tape) (Unit:mm) Type 2012 3216 4516 4532 A ±0.1 2.25 3.50 4.90 4.85 B ±0.1 1.45 1.85 1.90 3.60 C ±0.1 1.50 1.25 1.35 1.40 D ±0.1 0.23 0.23 0.30 0.30 This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS Soldering Profile v Reflow Soldering Pre - heating 230 180 150 Soldering 245±5℃ Cooling 10 sec. max. 60~120 sec. 30~60 sec. 60 sec. min. CHIP BEAD, Soldering Profile v Flow Soldering Pre - heating 250 180 150 Soldering 250±5℃ Cooling 60 sec. min. 10 sec. max. 60 sec. min. v Manual Soldering 300 Soldering Iron : 30W max. Diameter of soldering iron : 1.2 mm max. 2 sec. max. Tc This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD