CBA3216GK301N4

DPS-081104 CHIP BEADS ARRAY Array Series v Features • Good reliability (Monolithic structure) • Magnetically shielded • Fast mounting speed • RoHS compliant W D L Size L W 3216 3.2±0.20 1.6±0.20 0.9±0.20 0.3±0.20 0.4±0.15 0.8±0.10 v Dimensions (unit : mm) B T E v Applications • CD-ROM, DVD, MD Lines • Digital TVs and VTRs v General Code CBA 1 T B 3216 2 G 3 A 4 121 5 N4 6 E 7 E D 1 2 3 4 5 6 7 Series Code CBA : Chip Ferrite Beads Array Dimension Code The first two digits : length (mm) The last two digits : width (mm) Application Code G : Signal Line P : High Current Line U : Ultra High Current Line Material Code A: General Frequency K,J: Medium Frequency M: High Frequency V: Very High Frequency Impedance Value Code The first two digits represents significant The last digit is the number of zeros following ex) 121 = 120 (Ω) Number of circuit N4 : 4 array Packaging Code E : Reel embossed tape packaging v Temperature Range • Operating Temp. -55 ~ +125℃ • Storage Temp. -10 ~ +40 ℃ v Typical Material Characteristics High μ (Low RXCP) Low μ (High RXCP) V M J,K A This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS ARRAY v 3216 SIZE Impedance (Ω) ± 25% 30 60 120 220 300 470 601 100 60 120 220 300 470 600 1000 30 60 120 300 470 600 DC Resistance (Ω) max. 0.10 0.25 0.30 0.35 0.40 0.45 0.50 0.70 0.25 0.30 0.35 0.40 0.50 0.60 0.75 0.10 0.12 0.20 0.45 0.45 0.50 Rated Current (mA) max. 200 200 300 150 100 100 100 50 400 350 250 250 200 200 150 200 200 100 100 100 100 100 Test Frequency (MHz) Samwha P/N CBA3216GA300N4 CBA3216GA600N4 CBA3216GA121N4 CBA3216GA221N4 CBA3216GA301N4 CBA3216GA471N4 CBA3216GA601N4 CBA3216GA102N4 CBA3216GK600N4 CBA3216GK121N4 CBA3216GK221N4 CBA3216GK301N4 CBA3216GK471N4 CBA3216GK601N4 CBA3216GK102N4 CBA3216GM300N4 CBA3216GM600N4 CBA3216GM121N4 CBA3216GM301N4 CBA3216GM471N4 CBA3216GM601N4 ※ Measuring Equipment CHIP BEAD ARRAY Series -. Z : HP4291B / E4991A -. Rdc : HP4338B This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS ARRAY v 3216 SIZE CBA 3216 GA 300 N4 Impedance [W ] 60 100 CBA 3216 GA 600 N4 Z R X Impedance [W ] 200 CBA 3216 GA 121 N4 Z R X Impedance [W ] 45 75 150 Z 30 50 100 R 15 25 50 X 0 1 10 100 1000 0 1 10 100 1000 0 1 10 100 1000 Frequency [MHz] Frequency [MHz] Frequency [MHz] 300 CBA 3216 GA 221 N4 Z Impedance [W ] R 400 CBA 3216 GA 301 N4 Z Impedance [W ] R 800 CBA 3216 GA 601 N4 Z R Impedance [W ] 225 300 600 CHIP BEAD ARRAY Series 150 200 400 75 X 100 X 200 X 1 10 100 1000 0 1 10 100 1000 0 1 10 100 1000 0 Frequency [MHz] Frequency [MHz] Frequency [MHz] 1200 CBA 3216 GA 102 N4 Z Impedance [W ] R 240 CBA 3216 GK 121 N4 Z R Impedance [W ] 400 CBA 3216 GK 221 N4 Z R X 1 10 100 1000 Impedance [W ] 900 180 300 600 120 200 300 X 60 X 1 10 100 1000 100 0 1 10 100 1000 0 0 Frequency [MHz] Frequency [MHz] Frequency [MHz] 600 CBA 3216 GK 301 N4 Impedance [W ] 800 CBA 3216 GK 471 N4 Z R Impedance [W ] 1000 CBA 3216 GK 601 N4 Z Impedance [W ] 400 Z R 600 750 R 500 400 200 200 250 X X 0 1 10 100 1000 0 1 10 100 X 1000 0 1 10 100 1000 Frequency [MHz] Frequency [MHz] Frequency [MHz] This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS ARRAY Reliability & Test Condition Item Operating temperature range Storage temperature range Requirements - 55 ℃ ~ + 125 ℃ 40 ℃ max., 70% RH max. Test Conditions at packing condition Preheat temperature : 100 ~ 150 ℃ Preheat time : 60 sec. Solder temperature : 245 ± 5 ℃ Soldering time : 10 ± 1 sec. Solderability More than 90% of the terminal electrode shall be covered with new solder CHIP BEAD, Reliability & Test Condition Resistance to soldering heat 1. No damage such as cracks should be caused in chip element 2. More than 75% of the terminal electrode shall be covered with new solder 3. Impedance shall not change more than ±30 % More than 50% of the terminal electrode shall be covered with new solder Preheat temperature : 100 ~ 150 ℃ Preheat time : 60 sec. Solder temperature : 270 ± 10 ℃ Soldering time : 10 ± 0.5 sec. Reflow soldering ST ≥ ST 1 CT 3 CT Preheat temperature : 150 ℃ Preheat time : 60 sec. Solder temperature : 245 ± 5 ℃ Soldering time : 10 sec. max. (Reflow soldering profile) High temperature resistance Temperature : 125 ± 3 ℃ Time : 500 ± 12 hours Measurement at room ambient temperature after placing for 24 hours Temperature : 125 ± 3 ℃ Applied current : rated current Time : 1000 ± 12 hours Measurement at room ambient temperature after placing for 24 hours Temperature : 40 ± 2 ℃ Humidity : 90 ± 2 % RH Time : 500 ± 12 hours Measurement at room ambient temperature after placing for 24 hours High temperature load resistance 1. No mechanical damage 2. Impedance shall not change more than ±30 % Humidity resistance This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS ARRAY Reliability & Test Condition Item Requirements Test Conditions Temperature : 40 ± 2 ℃ Humidity : 90 ± 2 % RH Applied current : rated current Time : 500 ± 12 hours Measurement at room ambient temperature after placing for 24 hours Temperature : -55 ± 3 ℃ Time : 1000 ± 12 hours Measurement at room ambient temperature after placing for 24 hours 1. -55 ± 3℃ for 30 minutes 2.125 ± 3 ℃ for 30 minutes 3. repeat 100 cycle Frequency : 10 ~ 55 Hz Amplitude : 1.5 mm Direction : X, Y, Z Sweep time : 2 hours for each axis Drop 10 times on a concrete floor from a height of 100 cm No mechanical damage ITEM Flexure strength A (mm) B (mm) C (mm) W (kgf) 4 ARRAY Humidity load resistance Low temperature resistance 1. No mechanical damage 2. Impedance shall not change more than ±30 % Thermal shock CHIP BEAD, Reliability & Test Condition Vibration Drop R0.5 Land pattern BC A D 0.8 0.8 3.0 0.4 W 50 20 W Bending strength The terminal electrode shall be neither break off nor the chip damage R340 2 mm Resistance meter This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS Packaging v Standard Quantity Size 1005 1608 2012 3216 4516 4532 Q’TY(PCS) 10,000 4,000 4,000 3,000 2,000 1,000 0.85 T size Remarks v Reel Dimension CHIP BEAD, Packaging (Unit:mm) A Φ178±2 D 4±0.8 B Φ50 min. E 2±0.2 C Φ13±0.5 W 9±1.5 v Leader & Blank Portion (Unit:mm) Blank 350±50 mm 60 Pitch Chips Blank 350±50 mm 60 Pitch Leader 150 min This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS Packaging v Taping Dimensions (Paper tape) T A B S P (Unit:mm) Type 1005 1608 2012 A ±0.1 1.15 1.80 2.30 B ±0.1 0.65 1.00 1.55 P ±0.1 2.0 4.0 4.0 S ±0.1 1.0 2.0 2.0 T (Max.) 0.8 1.1 1.1 CHIP BEAD, Packaging v Taping Dimensions (Emboss tape) (Unit:mm) Type 2012 3216 4516 4532 A ±0.1 2.25 3.50 4.90 4.85 B ±0.1 1.45 1.85 1.90 3.60 C ±0.1 1.50 1.25 1.35 1.40 D ±0.1 0.23 0.23 0.30 0.30 This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD DPS-081104 CHIP BEADS Soldering Profile v Reflow Soldering Pre - heating 230 180 150 Soldering 245±5℃ Cooling 10 sec. max. 60~120 sec. 30~60 sec. 60 sec. min. CHIP BEAD, Soldering Profile v Flow Soldering Pre - heating 250 180 150 Soldering 250±5℃ Cooling 60 sec. min. 10 sec. max. 60 sec. min. v Manual Soldering 300 Soldering Iron : 30W max. Diameter of soldering iron : 1.2 mm max. 2 sec. max. Tc This description in the this catalogue is subject to change without notice http://www.samwha.com/chip SAMWHA ELECTRONICS CO., LTD