LC5550LD Series
Single-Stage Power Factor Corrected
High Efficiency Non-Isolated Buck LED Driver
Description
• PWM and quasi-resonant topology
• Integrated on-time control circuit (it realizes high power
factor by average current control)
• Integrated soft-start circuit (reduces power stress during
start-up on the incorporated power MOSFET and output
rectifier)
• Integrated bias assist circuit (improves startup
performance, suppresses VCC voltage droop during
operation, and allows use of low-rated ceramic capacitor
on VCC pin)
• Integrated Leading Edge Blanking (LEB) circuit
• Integrated maximum on-time limit circuit
• Protection features:
▫ Overcurrent protection (OCP): pulse-by-pulse
▫ Overvoltage protection (OVP): latched shutdown
▫ Overload protection (OLP): latched shutdown
▫ Thermal shutdown (TSD): latched shutdown
LC5550LD series are PWM and quasi-resonant topology
non-isolated buck LED driver ICs. They incorporate separate controller and power MOSFET chips, and are designed
for input capacitorless applications. The controller adapts
the average current control method for realizing high power
factors. The rich set of protection features helps to realize
low component counts, and high performance-to-cost power
supply.
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Applications
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• LED lighting fixtures
• LED light bulbs
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Package: 8-pin DIP
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Features and Benefits
Typical Application
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Not to scale
D6
D3
D4
D1
D2
NF
5
6
ISENSE
D/ST
8
V AC
R2
U1
LC5550LD
Contro1
N
ot
R
R1
COMP
4
3 OCP/BD
2
1
V CC
S/GND
C2
C3
C4
C5
R5
C6
R3
R4
C1
T1
C7
R6
LED
D5
LC5550LD-DS
SANKEN ELECTRIC CO., LTD.
July 9, 2012
LC5550LD
Series
Single-Stage Power Factor Corrected
High Efficiency Non-Isolated Buck LED Driver
Selection Guide
PWM Operation
Frequency, fOSC(typ)
(kHz)
On-Time
tON(MAX)(typ)
(μs)
LC5555LD
650
3.95
72
9.3
LC5556LD
650
1.9
60
11.2
ns
RDS(on)
(max)
(Ω)
*Based on the thermal rating; the allowable maximum output power can be
up to 120% to 140% of this value. However, maximum output power may be
limited in such an application with low output voltage or short duty cycle.
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The polarity value for current specifies a sink as "+," and a source as “−,” referencing the IC.
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MOSFET
VDSS(min)
(V)
D
Part
Number
Characteristic
Symbol
d
EAS
VCC
VOCP
COMP Pin Voltage
VCOMP
Single pulse
m
ISENSE Pin Voltage
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PD1
Rating
Unit
2.5
A
8–1
4.0
A
LC5555LD
ILPeak = 2.0 A, VDD = 99 V, L = 20 mH
8–1
47
mJ
ILPeak = 2.7 A, VDD = 99 V, L = 20 mH
8–1
86
mJ
VSEN
Allowable Power Dissipation of
MOSFET3
Pins
8–1
LC5556LD
m
Input Voltage for Control Part (MIC)
OCP/BD Pin Voltage
Single pulse
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LC5556LD
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Single Pulse Avalanche Energy2
Notes
LC5555LD
IDPeak
Drain Current1
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LC5550LD Absolute Maximum Ratings Unless specifically noted, TA is 25°C
Mounted on a 15 mm × 15 mm PCB
2–1
35
V
3–1
−2.0 to 5.0
V
4–1
−0.3 to 7.0
V
6–1
−0.3 to 5.0
V
8–1
0.97
W
°C
TOP
―
−55 to 125
Storage Temperature
Tstg
―
−55 to 125
°C
Tch
―
150
°C
Channel Temperature
to MOSFET Safe Operating Area Curve.
to MOSFET Avalanche Energy Derating Coefficient Curve.
3Refer to MOSFET Temperature versus Power Dissipation Curve.
ot
1Refer
R
Operating Ambient Temperature
N
2Refer
LC5550LD-DS
2
SANKEN ELECTRIC CO., LTD.
July 9, 2012
LC5550LD
Series
Single-Stage Power Factor Corrected
High Efficiency Non-Isolated Buck LED Driver
LC5550LD Electrical Characteristics of Control Part (MIC) Unless specifically noted, TA is 25°C, VCC is 18 V
Characteristic
Symbol
Test Conditions
Pins
Min.
Typ.
Max.
Unit
Power Supply Startup Operation
VCC(ON)
2–1
13.8
15.1
17.3
V
Operation Stop Voltage*
VCC(OFF)
2–1
8.4
9.4
10.7
V
ICC(ON)
2–1
–
VSTARTUP
8–1
18
Startup Circuit Operation Voltage
ICC(STARTUP) VCC = 13 V
Startup Current Threshold Biasing
Voltage*
2–1
VCC(BIAS)
2–1
Normal Operation
Maximum On-Time
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LC5555LD
fOSC
8–1
LC5556LD
LC5555LD
tON(MAX)
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PWM Operation Frequency
4.7
mA
24
V
−8.5
−4.0
−1.5
mA
9.5
11.0
12.5
V
72
84
kHz
D
Startup Current
–
21
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Circuit Current in Operation
ns
Operation Start Voltage
8–1
50
60
70
kHz
8.0
9.3
11.2
μs
9.0
11.2
13.4
μs
4–1
0.30
0.55
0.80
V
6–1
–0.21
–0.2
–0.19
V
4–1
−36
−24
−12
μA
4–1
12
24
36
μA
3–1
−
600
−
ns
3–1
0.14
0.24
0.34
V
3–1
0.11
0.16
0.21
V
3–1
−0.92
−0.8
−0.68
V
IOCP
3–1
−120
−40
−10
μA
OCP/BD Pin Overvoltage Protection
(OVP) Operation Voltage
VBD(OVP)
3–1
2.2
2.6
3.0
V
Overload Protection (OLP) Threshold
Voltage
VCOMP(OLP)
4–1
4.1
4.5
4.9
V
VCC(OVP)
2–1
28.5
31.5
34.0
V
TJ(TSD)
–
135
–
–
°C
Error Amplifier Sink Current
ISEN(SINK)
tON(LEB)
VBD(TH1)
Quasi-Resonant Operation Threshold
Voltage-2
VBD(TH2)
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R
OCP.BD Pin Source Current
VCC Pin OVP Threshold Voltage
N
Thermal Shutdown Activating
Temperature
m
VOCP
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OCP/BD Pin Overcurrent Protection
(OCP) Threshold Voltage
m
Leading Edge Blanking Time
Quasi-Resonant Operation Threshold
Voltage-1
Protected Operation
fo
VSEN(TH)
ISEN(SOURCE)
d
Error Amplifier Source Current
de
Error Amplifier Reference Voltage
VCOMP(MIN)
en
COMP Pin Control Minimum Voltage
LC5556LD
60
*VCC(BIAS) > VCC(OFF) always.
LC5550LD-DS
3
SANKEN ELECTRIC CO., LTD.
July 9, 2012
LC5550LD
Series
Single-Stage Power Factor Corrected
High Efficiency Non-Isolated Buck LED Driver
LC5550LD Electrical Characteristics of MOSFET Unless specifically noted, TA is 25°C
VDSS
Drain Leakage Current
IDSS
On-Resistance
RDS(ON)
Switching Time
tf
Rθch-c
LC5555LD
Pins
Min.
Typ.
Max.
Unit
8–1
650
―
―
V
8–1
―
―
300
μA
―
―
3.95
Ω
―
―
1.9
Ω
―
250
ns
8–1
LC5556LD
LC5555LD
8–1
LC5556LD
LC5555LD
―
LC5556LD
―
―
―
400
ns
―
―
42
°C/W
―
―
35.5
°C/W
D
Thermal Resistance*
Test Conditions
ns
Symbol
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Characteristic
Drain-to-Source Breakdown Voltage
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*The thermal resistance between the channels of the MOSFET and the case. TC measured at the center of the case marked side.
LC5550LD-DS
4
SANKEN ELECTRIC CO., LTD.
July 9, 2012
LC5550LD
Series
Single-Stage Power Factor Corrected
High Efficiency Non-Isolated Buck LED Driver
Characteristic Performance
LC5555LD
MOSFET Safe Operating Area Curve
10
Drain current limited
by on-resistance
100
40
0
0
25
50
75
100
125
ns
0.1
ew
20
1 ms
1
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ig
60
150
To use this graph, apply the S.O.A
temperature derating coefficient
taken from the graph at the left
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Channel Temperature, Tch (°C)
m
40
m
20
0
25
Allowable Power Dissipation, PD1 (W)
de
en
60
50
75
100
125
1
10
150
1.0
0.8
0.6
0.4
0.2
0
0
R
25
50
75
100
125
150
Ambient Temperature, TA (°C)
Transient Thermal Resistance Curve
N
ot
Transient Thermal Resistance, Rθch-c (°C/W)
1000
1.2
Channel Temperature, Tch (°C)
10
100
Drain-to-Source Voltage, VDS (V)
MOSFET Temperature versus Power Dissipation Curve
d
100
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EAS
Temperature Derating Coefficient (%)
MOSFET Avalanche Energy Derating Coefficient Curve
fo
0.01
80
0.1 ms
D
80
Drain Current, ID (A)
Safe Operating Area
Temperature Derating Coefficient (%)
S. O. A. Temperature Derating Coefficient Curve
1
0.1
0.01
10–6
10–5
10–4
10–3
10–2
10–1
Time (s)
LC5550LD-DS
5
SANKEN ELECTRIC CO., LTD.
July 9, 2012
LC5550LD
Series
Single-Stage Power Factor Corrected
High Efficiency Non-Isolated Buck LED Driver
Characteristic Performance
LC5556LD
MOSFET Safe Operating Area Curve
10
0.1 ms
100
1 ms
40
0
25
50
75
100
125
ns
0.1
ew
20
Drain current limited
by on-resistance
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60
0
1
D
80
Drain Current, ID (A)
Safe Operating Area
Temperature Derating Coefficient (%)
S. O. A. Temperature Derating Coefficient Curve
150
To use this graph, apply the S.O.A
temperature derating coefficient
taken from the graph at the left
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Channel Temperature, Tch (°C)
0.01
en
60
m
40
m
20
0
25
Allowable Power Dissipation, PD1 (W)
de
80
50
75
100
125
10
150
1.0
0.8
0.6
0.4
0.2
0
0
R
25
50
75
100
125
150
Ambient Temperature, TA (°C)
Transient Thermal Resistance Curve
N
ot
Transient Thermal Resistance, Rθch-c (°C/W)
1000
1.2
Channel Temperature, Tch (°C)
10
100
Drain-to-Source Voltage, VDS (V)
MOSFET Temperature versus Power Dissipation Curve
d
100
ec
o
EAS
Temperature Derating Coefficient (%)
MOSFET Avalanche Energy Derating Coefficient Curve
fo
1
1
0.1
0.01
10–6
10–5
10–4
10–3
10–2
10–1
Time (s)
LC5550LD-DS
6
SANKEN ELECTRIC CO., LTD.
July 9, 2012
LC5550LD
Series
Single-Stage Power Factor Corrected
High Efficiency Non-Isolated Buck LED Driver
Typical Application Circuit 1, PWM Topology
R1
ns
D6
R2
LC5550LD
D1
D2
2
D/ST
8
V AC
1
V CC
C2
S/GND
C3
C4
C5
R5
C6
R3
R4
T1
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D3
D4
3 OCP/BD
Contro1
6
ISENSE
COMP
4
D
5
ew
NF
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U1
C1
C7
R6
C7
R6
LED
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D5
m
Typical Application Circuit 2, Quasi-Resonant Topology
D6
m
R1
R2
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U1
LC5550LD
D3
D4
D/ST
8
D1
COMP
4
D7
3 OCP/BD
2
1
V CC
S/GND
C2
C3
C4
C5
R5
C6
D8
D2
R7
C6
R3
N
V AC
ot
6
ISENSE
Contro1
5
R
NF
R4
T1
CV
C1
LED
D5
LC5550LD-DS
7
SANKEN ELECTRIC CO., LTD.
July 9, 2012
LC5550LD
Series
Single-Stage Power Factor Corrected
High Efficiency Non-Isolated Buck LED Driver
Functional Block Diagram
VCC
②
Control Part
⑧ D/ST
START UP
UVLO
Reg
Drv
Bias
OVP
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① S/GND
S
RQ
⑥ ISENSE
Bottom
Detection
OLP
OTA
ew
OCP
OSC
D
OCP/BD ③
NF ⑤
ns
TSD
LEB
Reg
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Feedback
Control
④ COMP
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Reg
Pin List Table
8 D/ST
VCC 2
6 ISENSE
5 NF
N
ot
COMP 4
R
OCP/BD 3
LC5550LD-DS
MOSFET source and GND pin for the Control Part
2
VCC
Supply voltage input and Overvoltage Protection (OVP) signal input
3
OCP/BD
4
COMP
Feedback phase-compensation input
5
NF
6
ISENSE
7
–
8
D/ST
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S/GND 1
S/GND
Function
m
1
Pin-out Diagram
Name
m
Number
Overcurrent Protection (OCP), quasi-resonant signal input, and
Overvoltage Protection (OVP) signal input
No function; must be externally connected to S/GND pin with as short a
trace as possible, for stable operation of the IC
Output current sensing voltage input
Pin removed
MOSFET drain pin and input of the startup current
8
SANKEN ELECTRIC CO., LTD.
July 9, 2012
LC5550LD
Series
Single-Stage Power Factor Corrected
High Efficiency Non-Isolated Buck LED Driver
Package Diagram
DIP8 package
5
1
4
D
+0.3
1.52
-0.05
ew
1.0 +0.3
-0.05
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6.5 ±0.2
8
ns
9.4 ±0.3
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3.3 ±0.2
7.5 ±0.5
4.2 ±0.3
3.4 ±0.1
(7.6 TYP)
m
2.54 TYP
０～１５° ０～１５°
0.5 ±0.1
ec
o
m
0.89 TYP
0.2 5 + 0.
- 0.01
5
8
N
ot
R
Unit： mm
LC555x
SK YMD L
Part Number
Lot Number
Y is the last digit of the year (0 to 9)
M is the month (1 to 9, O, N, or D)
D is a period of days (1 to 3):
1 – 1st to 10th
2 – 11th to 20th
3 – 21st to 31st
Sanken Control Number
1
Pb-free. Device composition compliant
with the RoHS directive.
LC5550LD-DS
9
SANKEN ELECTRIC CO., LTD.
July 9, 2012
LC5550LD
Series
Single-Stage Power Factor Corrected
High Efficiency Non-Isolated Buck LED Driver
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Soldering
•
When soldering the products, please be sure to minimize the
working time, within the following limits:
260±5°C 10±1 s
(Flow, 2 times)
380±10°C 3.5±0.5 s (Soldering iron, 1 time)
• Soldering should be at a distance of at least 1.5 mm from the
body of the products.
Electrostatic Discharge
•
When handling the products, the operator must be grounded.
Grounded wrist straps worn should have at least 1 MΩ of
resistance from the operator to ground to prevent shock hazard,
and it should be placed near the operator.
•
Workbenches where the products are handled should be
grounded and be provided with conductive table and floor mats.
•
When using measuring equipment such as a curve tracer, the
equipment should be grounded.
•
When soldering the products, the head of soldering irons or the
solder bath must be grounded in order to prevent leak voltages
generated by them from being applied to the products.
•
The products should always be stored and transported in Sanken
shipping containers or conductive containers, or be wrapped in
aluminum foil.
m
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Because reliability can be affected adversely by improper storage
environments and handling methods, please observe the following
cautions.
Cautions for Storage
•
Ensure that storage conditions comply with the standard
temperature (5°C to 35°C) and the standard relative humidity
(around 40% to 75%); avoid storage locations that experience
extreme changes in temperature or humidity.
•
Avoid locations where dust or harmful gases are present and
avoid direct sunlight.
•
Reinspect for rust on leads and solderability of the products that
have been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and other
standard test periods, protect the products from power surges
from the testing device, shorts between the product pins, and
wrong connections. Ensure all test parameters are within the
ratings specified by Sanken for the products.
Remarks About Using Silicone Grease with a Heatsink
• When silicone grease is used in mounting the products on a
heatsink, it shall be applied evenly and thinly. If more silicone
grease than required is applied, it may produce excess stress.
• Volatile-type silicone greases may crack after long periods of
time, resulting in reduced heat radiation effect. Silicone greases
with low consistency (hard grease) may cause cracks in the mold
resin when screwing the products to a heatsink.
Our recommended silicone greases for heat radiation purposes,
which will not cause any adverse effect on the product life, are
indicated below:
Suppliers
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Type
G746
Shin-Etsu Chemical Co., Ltd.
Momentive Performance Materials Inc.
SC102
Dow Corning Toray Co., Ltd.
N
ot
R
YG6260
LC5550LD-DS
10
SANKEN ELECTRIC CO., LTD.
July 9, 2012
LC5550LD
Series
D
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Single-Stage Power Factor Corrected
High Efficiency Non-Isolated Buck LED Driver
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• The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the
latest revision of the document before use.
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• Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or
any other rights of Sanken or any third party which may result from its use.
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• Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures
including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device
failure or malfunction.
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• Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.).
m
en
When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and
its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever
long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales
representative to discuss, prior to the use of the products herein.
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The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required
(aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited.
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• In the case that you use Sanken products or design your products by using Sanken products, the reliability largely depends on the
degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the
load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general,
derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such
as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. For these stresses,
instantaneous values, maximum values and minimum values must be taken into consideration.
N
In addition, it should be noted that since power devices or IC's including power devices have large self-heating value, the degree of
derating of junction temperature affects the reliability significantly.
• When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically
or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance
and proceed therewith at your own responsibility.
• Anti radioactive ray design is not considered for the products listed herein.
• Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken's distribution network.
• The contents in this document must not be transcribed or copied without Sanken's written consent.
LC5550LD-DS
11
SANKEN ELECTRIC CO., LTD.
July 9, 2012
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