SCM1240M
High Voltage, High Current 3-Phase Motor Drivers
Features and Benefits
Description
▪ Each half-bridge circuit consists of a pre-driver circuit that
is completely independent from the others
▪ 10 to 30 A continuous output IPM in a small-footprint
package
▪ Protection against simultaneous high- and low-side turning on
▪ Bootstrap diodes with series resistors for suppressing
inrush current are incorporated
▪ CMOS compatible input (3.3 to 5 V)
▪ Designed to minimize simultaneous current through both
high- and low-side IGBTs by optimizing gate drive resistors
▪ Integrated Fast Recovery Diode (FRD) as freewheeling
diode for each IGBT
▪ UVLO protection with auto restart
▪ Thermal shutdown (TSD) with auto restart
▪ Fault (¯F¯O¯ indicator) signal output at protection activation:
UVLO (low side only), OCP, STP, and TSD
▪ Proprietary power DIP package
▪ UL Recognized Component (File No.: E118037)
The SCM1240M inverter power module (IPM) devices provide
a robust, highly-integrated solution for optimally controlling
3-phase motor power inverter systems and variable speed
control systems used in energy-conserving designs to drive
motors of residential and commercial appliances. These ICs
take 85 to 253 VAC input voltage, and 10 to 30 A (continuous)
output current. They can withstand voltages of up to 600 V
(IGBT breakdown voltage).
Applications include residential white goods (home appliances)
and commercial appliance motor control, such as:
▪ Air conditioner compressor motor
▪ Air conditioner fan motor
▪ Refrigerator compressor motor
▪ Washing machine main motor
Packages: Power DIP
Not to scale
Fully molded
LF 2551
The high current SCM1240M employs a new, small-footprint
proprietary DIP package. The IC itself consists of all of the
necessary power elements (six IGBTs), pre-drive ICs (three),
and freewheeling diodes (six), needed to configure the main
circuit of an inverter, as well as a bootstrap circuit (three
bootstrap diodes and three boot resistors) as a high-side drive
power supply. This enables the main circuit of the inverter to
be configured with fewer external components than traditional
designs.
Heatsink pad
LF2552
Functional Block Diagram
One of three phases
SCM1240M
VB
VBB
HS
RB
BootDi
UV
Detect
VCC
HIN
Input Logic
LIN
COM
UV
Detect
Level
Shift
FRD
Drive
Circuit
U,V,W
Drive
Circuit
STP
FO
OCP
MIC
O.C.
Protect
Thermal
Protect
FRD
Figure 1. Diagram of one of three phases in the device.
SCM1240MDS-Rev. 5
SANKEN ELECTRIC CO., LTD.
http://www.sanken-ele.co.jp/en/
LS
SCM1240M
High Voltage, High Current 3-Phase Motor Drivers
Selection Guide
Package
Packing
IGBT Breakdown
Voltage, VCES(min)
(V)
SCM1241M
Fully Molded
10 pieces per tube
600
SCM1243MF
Heatsink Pad
10 pieces per tube
600
SCM1245MF
Heatsink Pad
10 pieces per tube
SCM1246MF
Heatsink Pad
10 pieces per tube
Part Number
IGBT Saturation
Voltage, VCE(sat)(typ)
(V)
Output Current
Continuous,
IO(max)
(A)
Pulsed,
IOP (max)
(A)
1.7
10
20
1.7
15
30
600
1.7
20
30
600
1.7
30
45
Absolute Maximum Ratings, valid at TA = 25°C
Characteristic
Supply Voltage
Supply Voltage (Surge)
Symbol
Remarks
Rating
Units
VDC
Between VBB and LS1, LS2, and LS3
450
V
VDC(surge)
Between VBB and LS1, LS2, and LS3
500
V
IGBT Breakdown Voltage
VCES
VCC = 15 V, IC = 1 mA, VIN = 0 V
600
V
Logic Supply Voltage
VCC
Between VCC and COM
20
V
Boot-strap Voltage
VBS
Between VB and HS (U,V,W)
20
V
Output Current, Continuous
Output Current, Pulsed
IO
IOP
SCM1241M
TCase = 25°C
10
Adc
SCM1243MF
TCase = 25°C
15
Adc
SCM1245MF
TCase = 25°C
20
Adc
SCM1246MF
TCase = 25°C
30
Adc
SCM1241M
Pulse Width ≤ 1 ms
20
A
SCM1243MF
Pulse Width ≤ 1 ms
30
A
SCM1245MF
Pulse Width ≤ 1 ms
30
A
SCM1246MF
Pulse Width ≤ 1 ms
45
A
–0.5 to 7
V
Input Voltage
VIN
HIN, LIN, and OCP
¯F
¯¯O
¯ Terminal Voltage
VFO
¯¯O
¯ and COM
Between ¯F
SCM1241M
R(j-c)Q
Thermal Resistance, Junction-to-Case
SCM1243MF
SCM1245MF
SCM1246MF
1 element operation (IGBT)
SCM1241M
R(j-c)F
SCM1243MF
SCM1245MF
SCM1246M
1 element operation (FRD)
7
V
6.0
°C/W
3.0
°C/W
6.5
°C/W
4.0
°C/W
Case Operating Temperature
TOPC
–20 to 100
°C
Junction Temperature (IGBT)
TJ
150
°C
Storage Temperature
Tstg
Isolation Voltage
Viso
Between exposed thermal pad and each pin; 1 minute, ac
–40 to 150
°C
2000
Vrms
All performance characteristics given are typical values for circuit or system baseline design only and are at the nominal operating voltage and an
ambient temperature, TA, of 25°C, unless otherwise stated.
SCM1240MDS-Rev. 5
SANKEN ELECTRIC CO., LTD.
2
SCM1240M
High Voltage, High Current 3-Phase Motor Drivers
Recommended Operating Conditions
Characteristic
Symbol
Remarks
Min.
Typ.
Max.
Units
–
300
400
V
Between VCC and COM
13.5
–
16.5
V
Between VB and HS
13.5
–
16.5
V
tINmin(on)
On pulse
0.5
–
–
μs
tINmin(off)
Off pulse
0.5
–
–
μs
Main Supply Voltage
VDC
Between VBB and LS
Logic Supply Voltage
VCC
Logic Supply Voltage
VBS
Minimum Input Pulse Width
Dead Time*
tdead
1.0
–
–
μs
¯F
¯¯O
¯ Pull-up Resistor
RFO
1
–
22
kΩ
¯F
¯¯O
¯ Pull-up Voltage
VFO
3.0
–
5.5
V
Bootstrap Capacitor
CBOOT
10
–
220
μF
SCM1241M
For IP ≤ 20 A
27
–
–
mΩ
SCM1243MF
SCM1245MF
SCM1246MF
For IP ≤ 30 A
15
–
–
mΩ
Shunt Resistor
RS
RC Filter Resistor
RO
–
–
100
Ω
RC Filter Capacitor
CO
–
–
2200
pF
PWM Carrier Frequency
fC
–
–
20
kHz
Junction Temperature
TJ
–
–
125
°C
*Dead Time must be controlled from an external source.
SCM1240MDS-Rev. 5
SANKEN ELECTRIC CO., LTD.
3
SCM1240M
High Voltage, High Current 3-Phase Motor Drivers
Typical Application Diagram
Typical application utilizing one shunt resistor, RS
VCC
CP
CBOOT
(7)
VB1
(8)
HS1
(31)
RB
BootDi
(6)
ZD
CP
UV
Detect
VCC1
(5)
HIN1
(3)
LIN1
(4)
COM1
(1)
FO1
UV
Detect
Level
Shift
Input Logic
CBOOT
OCP1
(15)
VB2
(16)
HS2
Controller
LIN2
(12)
COM2
(9)
FO2
UV
Detect
UV
Detect
Level
Shift
Input Logic
STP
CBOOT
OCP2
(23)
VB3
(24)
HS3
INT
(19)
LIN3
COM3
(17)
FO3
FRD (30)
Thermal
Protect
LS2
RB
UV
Detect
VCC3
(20)
M
V
(25)
(22)
HIN3
(29)
MIC2
BootDi
(21)
FRD
Drive
Circuit
Drive
Circuit
O.C.
Protect
(10)
LS1
(28)
VCC2
HIN2
(33)
FRD
Thermal
Protect
RB
(14)
(11)
(32)
MIC１
BootDi
(13)
U
Drive
Circuit
STP
O.C.
Protect
(2)
FRD
Drive
Circuit
Input Logic
VBB
UV
Detect
Level
Shift
STP
FRD
Drive
Circuit
(26)
Drive
Circuit
W
Thermal
Protect
FRD (27)
CS
VFO
(18)
RFO
OCP3
O.C.
Protect
LS3
MIC3
A/D
RO
CFO
CO
DRS
RS
COM
See application notes on next page.
SCM1240MDS-Rev. 5
SANKEN ELECTRIC CO., LTD.
4
SCM1240M
High Voltage, High Current 3-Phase Motor Drivers
Notes for Typical Application Diagram
▪ To use the OCP circuit shown in the Typical Application drawing,
an external shunt resistor, RS, is needed. The RS value depends on
how many low-side IGBTs turn on simultaneously.
However, the low pass filter causes an additional delay to detecting
an overcurrent condition of the SCM1240M, and if the total delay
exceeds 1.7 μs, permanent damage to the SCM1240M may result.
▪ To avoid malfunction, the wiring between the LS and COM pins
should be as short as possible.
▪ To prevent surge destruction, put a 0.01 to 1 μF snubber capacitor,
CS, in parallel with the electrolytic capacitor.
▪ To prevent surge destruction, put a 18 to 20 V Zener diode between
the VCC and COM pins.
▪ To prevent surge malfunction, put a 0.01 to 0.1 μF ceramic
capacitor between the VCC and COM pins and the VB and HS
pins.
▪ To add an external low pass filter, place RO and CO between the
A to D pin of the application controller and shunt resistor RS,
ensuring that the time constant of this low pass filter is less than
0.2 μs. The internal OCP circuit has a 1.5 μs (min) filtering delay.
▪ To suppress noise, connect a resistor, RF, and capacitor, CF, to the
¯F¯O¯x pins. Also, when an overcurrent condition is detected, the
¯F¯O¯x pin goes low for 25 μs (typ) as an active low fault flag, and
then returns up to its normal state. It is recommended to connect
the ¯F¯O¯x pin directly to an interrupt pin of the external controller, to
ensure the 25 μs interval is detected.
SCM1240MDS-Rev. 5
▪ To provide the best thermal shutdown protection (TSD), it is
strongly recommended that the three ¯F¯O¯x pins be tied together. In
this way an overtemperature event (internal temperature rise above
150°C) in any of the three phases will cause all three phases to shut
down. If the ¯F¯O¯x pins are not tied together, but are independently
pulled up to +5 V, the TSD function for each phase shuts down
only that phase.
SANKEN ELECTRIC CO., LTD.
5
SCM1240M
High Voltage, High Current 3-Phase Motor Drivers
ELECTRICAL CHARACTERISTICS, valid at TA=25°C, unless otherwise noted
Characteristics
Symbol
Conditions
Min
Typ
Max
Units
Logic Supply Voltage
VCC
Between VCC and COM
13.5
–
16.5
V
Logic Supply Current
ICC
VCC = 15 V, 3 phases operating
–
3
–
mA
Bootstrap Supply Current
Input Voltage
Input Voltage Hysteresis
Input Current
Undervoltage Lock Out (High Side)
Undervoltage Lock Out (Low Side)
¯F
¯¯O
¯ Terminal Output Voltage
Overcurrent Protection Trip Voltage
Overcurrent Protection Hold Time
IBS
VB – HS = 15 V, one phase operating
–
140
–
μA
VIH
VCC = 15 V, output on
–
2.0
2.5
V
VIL
VCC = 15 V, output off
1.0
1.5
–
V
VIhys
VCC = 15 V
–
0.5
–
V
IIHH
VCC = 15 V, VIN = 5 V
–
230
500
μA
IILH
VCC = 15 V, VIN = 0 V
–
–
2
μA
10.0
11.0
12.0
V
10.5
11.5
12.5
V
10.0
11.0
12.0
V
10.5
11.5
12.5
V
–
–
0.5
V
UVHL
UVHH
UVLL
UVLH
VFOL
VFOH
VCC = 15 V
VCC = 15 V
VCC = 15 V, VFO = 5 V, RFO = 10 kΩ
VTRIP
VCC = 15 V
tP
VCC = 15 V
4.8
–
–
V
0.46
0.50
0.54
V
20
25
–
μs
135
150
165
°C
105
120
135
°C
–
1.65
–
μs
Overtemperature Protection Activation
and Releasing Temperature
TDH
Blanking Time
tblank
VCC = 15 V
IGBT Breakdown Voltage
VCES
VCC = 15 V, IC = 1 mA, VIN = 0 V
600
–
–
V
IGBT Leakage Current
ICES
VCC = 15 V, VCE = 600 V, VIN = 0 V
–
–
1
mA
SCM1241M
VCC = 15 V, IC = 10 A, VIN = 5 V
–
1.7
2.2
V
SCM1243MF
VCC = 15 V, IC = 15 A, VIN = 5 V
–
1.7
2.2
V
SCM1245MF
VCC = 15 V, IC = 20 A, VIN = 5 V
–
1.7
2.2
V
IGBT Saturation Voltage
TDL
VCE(sat)
VCC = 15 V
SCM1246MF
VCC = 15 V, IC = 30 A, VIN = 5 V
–
1.7
2.2
V
SCM1241M
VCC = 15 V, IF = 10 A, VIN = 0 V
–
1.9
2.4
V
SCM1243MF
VCC = 15 V, IF = 15 A, VIN = 0 V
–
1.75
2.2
V
SCM1245MF
VCC = 15 V, IF = 20 A, VIN = 0 V
–
1.9
2.4
V
SCM1246MF
VCC = 15 V, IF = 30 A, VIN = 0 V
Diode Forward Voltage
VF
–
1.5
2.0
V
Diode Recovery Time (Bootstrap)
trr
IF = IRECOVERY(PEAK) = 100 mA
–
70
–
ns
Diode Leakage Current (Boot Strap)
IIB
VR = 600 V
–
–
10
μA
Diode Forward Voltage (Boot Strap)
VFB
IF = 0.15 A
–
1.1
1.3
V
Diode Series Resistor (Boot Strap)
RB
17.6
22.0
26.4
Ω
Continued on the next page…
SCM1240MDS-Rev. 5
SANKEN ELECTRIC CO., LTD.
6
SCM1240M
High Voltage, High Current 3-Phase Motor Drivers
ELECTRICAL CHARACTERISTICS, valid at TA=25°C, unless otherwise noted
Characteristics
Symbol
Conditions
Min
Typ
Max
Units
–
590
–
ns
–
80
–
ns
–
60
–
ns
tdH(off)
–
550
–
ns
tfH
–
90
–
ns
tdH(on)
–
600
–
ns
–
70
–
ns
–
70
–
ns
tdH(off)
–
620
–
ns
tfH
–
60
–
ns
tdH(on)
–
695
–
ns
trH
–
95
–
ns
tdH(on)
trH
trrH
SCM1241M
trH
trrH
High Side Switching Time
trrH
SCM1243MF
SCM1245MF
VDC = 300 V, VCC = 15 V, IC = 10 A, inductive
load; HIN = 05 V or 50 V
VDC = 300 V, VCC = 15 V, IC = 15 A, inductive
load; HIN = 05 V or 50 V
VDC = 300 V, VCC = 15 V, IC = 20 A, inductive
load; HIN = 05 V or 50 V
–
75
–
ns
tdH(off)
–
675
–
ns
tfH
–
55
–
ns
tdH(on)
–
660
–
ns
trH
–
110
–
ns
SCM1246MF
VDC = 300 V, VCC = 15 V, IC = 30 A, inductive
load; HIN = 05 V or 50 V
–
60
–
ns
tdH(off)
–
700
–
ns
tfH
–
50
–
ns
trrH
Continued on the next page…
SCM1240MDS-Rev. 5
SANKEN ELECTRIC CO., LTD.
7
SCM1240M
High Voltage, High Current 3-Phase Motor Drivers
ELECTRICAL CHARACTERISTICS, valid at TA=25°C, unless otherwise noted
Characteristics
Symbol
Min
Typ
Max
tdL(on)
Conditions
–
570
–
ns
trL
–
100
–
ns
trrL
SCM1241M
–
70
–
ns
tdL(off)
–
560
–
ns
tfL
–
100
–
ns
tdL(on)
–
600
–
ns
–
100
–
ns
–
80
–
ns
tdL(off)
–
600
–
ns
tfL
–
70
–
ns
trL
trrL
Low Side Switching Time
VDC = 300 V, VCC = 15 V, IC = 10 A, inductive
load; LIN = 05 V or 50 V
Units
SCM1243MF
VDC = 300 V, VCC = 15 V, IC = 15 A, inductive
load; LIN = 05 V or 50 V
tdL(on)
–
715
–
ns
trL
–
135
–
ns
–
115
–
ns
tdL(off)
–
670
–
ns
tfL
–
50
–
ns
trrL
SCM1245MF
VDC = 300 V, VCC = 15 V, IC = 20 A, inductive
load; LIN = 05 V or 50 V
tdL(on)
–
660
–
ns
trL
–
150
–
ns
SCM1246MF
VDC = 300 V, VCC = 15 V, IC = 30 A, inductive
load; LIN = 05 V or 50 V
–
70
–
ns
tdL(off)
–
690
–
ns
tfL
–
50
–
ns
trrL
VIN
trr
t(on)
Switching Timing Definitions
td(on) tr
90%
t(off)
td(off) tf
90%
VCE
IC
SCM1240MDS-Rev. 5
10%
SANKEN ELECTRIC CO., LTD.
10%
8
SCM1240M
High Voltage, High Current 3-Phase Motor Drivers
Input-Output Truth Table
Mode
Normal1
TSD
OCP
VCCx UVLO2
VBx UVLO3
¯F
¯¯O
¯ x Low
HINx
LINx
High-side
MOSFET
Low-side
MOSFET
L
L
Off
Off
H
L
On
Off
L
H
Off
On
H
H
Off
Off
L
L
Off
Off
H
L
Off
Off
L
H
Off
Off
H
H
Off
Off
Off
L
L
Off
H
L
Off
Off
L
H
Off
Off
H
H
Off
Off
L
L
Off
Off
H
L
Off
Off
L
H
Off
Off
H
H
Off
Off
L
L
Off
Off
H
L
Off
Off
L
H
Off
On
H
H
Off
Off
L
L
Off
Off
H
L
Off
Off
L
H
Off
Off
H
H
Off
Off
1In the case where a pair of HINx and LINx signals are asserted at the same time, the shoot-through
prevention feature sets both the high-side and the low-side IGBTs off.
2After the VCCx power rail recovers from a UVLO condition, a rising edge of HINx starts driving the highside IGBT (edge trigger). On the other hand, after the UVLO condition is released, the input level of the
LINx pins reflects the state of the low-side IGBTs (level trigger).
3After the VBx power rail recovers from a UVLO condition, a rising edge of HINx starts driving the highside IGBT (edge trigger).
SCM1240MDS-Rev. 5
SANKEN ELECTRIC CO., LTD.
9
SCM1240M
High Voltage, High Current 3-Phase Motor Drivers
Pin-out Diagram
25
33
Branded Side
24
1
(Bottom View)
Terminal List Table
Name
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
SCM1240MDS-Rev. 5
32
Number
¯F
¯¯O
¯1
OCP1
LIN1
COM1
HIN1
VCC1
VB1
HS1
¯F
¯¯O
¯2
OCP2
LIN2
COM2
HIN2
VCC2
VB2
HS2
¯F
¯¯O
¯3
OCP3
LIN3
COM3
HIN3
VCC3
VB3
HS3
VBB
W
LS3
VBB
V
LS2
VBB
U
33
LS1
Function
U phase fault output for overcurrent and UVLO detected
Input for U phase overcurrent protection
Signal input for low-side U phase (active high)
Supply ground for U phase IC
Signal input for high-side U phase (active high)
Supply voltage for U phase IC
High-side floating supply voltage for U phase
High-side floating supply ground for U phase
V phase fault output for overcurrent and UVLO detected
Input for V phase overcurrent protection
Signal input for low-side V phase (active high)
Supply ground for V phase IC
Signal input for high-side V phase (active high)
Supply voltage for V phase IC
High-side floating supply voltage for V phase
High-side floating supply ground for V phase
W phase fault output for overcurrent and UVLO detected
Input for W phase overcurrent protection
Signal input for low-side W phase (active high)
Supply ground for W phase IC
Signal input for high-side W phase (active high)
Supply voltage for W phase IC
High-side floating supply voltage for W phase
High-side floating supply ground for W phase
Positive DC bus supply voltage
Output for W phase
Negative DC bus supply ground for W phase
(Pin trimmed) positive DC bus supply voltage
Output for V phase
Negative DC bus supply ground for V phase
(Pin trimmed) positive DC bus supply voltage
Output for U phase
Negative DC bus supply ground for U phase
SANKEN ELECTRIC CO., LTD.
10
SCM1240M
High Voltage, High Current 3-Phase Motor Drivers
Timing Diagrams
(one phase of three phases)
High-Side Driver Input/Output and UVLO Protection
VCC = 15 V
Low-Side Driver Input/Output and UVLO Protection
VB – HS = 15 V
HIN
HIN
LIN
LIN
UVHL
UVHH
VCC
HO
HO
LO
LO
FO
UVLH
UVLL
VB- HS
*No FO output at H-side UVLO.
*HO starts from positive edge after UVLO release.
FO
* LO starts after UVLO release
Shoot-Through Prevention
VCC, VB – HS = 15 V
Thermal Shutdown
HIN
HIN
LIN
LIN
TDH
Tmic
VCC,
VB
TDL
HO
HO
LO
LO
FO
FO
* Tmic is the temperature of the predriver IC (MIC)
* HO and LO start after TSD release
* While both HIN and LIN are in high state
HO and LO turn off and FO signals out.
Overcurrent Protection
HIN
…
LIN
…
HO
LO
Vtrip
(0.5 V TYP)
OCP
BlankingTime
(1.65 μs TYP)
FO
20 μs(min)
* HO and LO start after OCP release
SCM1240MDS-Rev. 5
SANKEN ELECTRIC CO., LTD.
11
SCM1240M
High Voltage, High Current 3-Phase Motor Drivers
PACKAGE OUTLINE DRAWING
0.5
(2.6)
C
0.5
C
8 x P5.1 = 40.8
4.4 ±0.3
1.2 ±0.2
47 ±0.3
MAX 1.2
15.95 ±0.5
Ø3.2 ±0.15
43.3 ±0.3
2.08 ±0.2
5 x P1.27 = 6.35
3.24
3.7
1.27
3.7
D
(0.6)
(2.6)
1.27
11.2 ±0.5
D
2 +0.2
–0.1
C–C
0.5 +0.2
–0.1
Pin pitch measured at root
Cu Thermal Pad
B–B
0.7 +0.2
–0.1
A–A
Leadform: 2551 (SCM1241M: Fully molded) or
2552 (SCM1243MF, SCM1245MF, SCM1246MF:
Exposed copper thermal pad)
Dimensions in millimeters
The body shall be clean and shall not bear any stain, rust or flaw.
The type number and lot number shall be clearly stamped by
laser on the body so that cannot be erased easily.
0.6 +0.2
–0.1
0.5 +0.2
–0.1
2.57
3.7
1.27
B
5 x P1.27 = 6.35
+0.2
0.5 –0.1
5 x P1.27 = 6.35
(Top View)
(5°)
B
0.5 +0.2
–0.1
Two different types of marks
to be used:
Mark 1:
Mark 2:
B
11.45 ±0.5
A
12.25 ±0.5
17.25 ±0.5
Branding Area
JAPAN
(5°)
A
19 ±0.3
(Bottom View)
2 +0.5
0
A
1.2 +0.2
–0.1
D–D
Branding codes
(exact appearance at manufacturer discretion):
Section A, type: SCM124xMF or SCM1241M
Section B,
lot: YMDDT
Where: Y is the last digit of the year of manufacture
M is the month (1 to 9, O, N, D)
DD is the date
T is the tracking letter (A to Z)
Device composition complies with the RoHS directive.
SCM1240MDS-Rev. 5
SANKEN ELECTRIC CO., LTD.
12
SCM1240M
High Voltage, High Current 3-Phase Motor Drivers
0.5
(2.6)
C
0.5
C
8 x P5.1 = 40.8
4.4 ±0.3
1.2 ±0.2
47 ±0.3
MAX 1.2
15.95 ±0.5
Ø3.2 ±0.15
43.3 ±0.3
B
2.08 ±0.2
5 x P1.27 = 6.35
3.24
3.7
1.27
3.7
D
(0.6)
(2.6)
1.27
D
2 +0.2
–0.1
C–C
0.5 +0.2
–0.1
Pin pitch measured at root
Cu Thermal Pad
B–B
0.7 +0.2
–0.1
A–A
Leadform: 2557 (SCM1241M: Fully molded) or
(SCM1243MF, SCM1245MF, SCM1246MF:
Exposed copper thermal pad)
Dimensions in millimeters
The body shall be clean and shall not bear any stain, rust or flaw.
The type number and lot number shall be clearly stamped by
laser on the body so that cannot be erased easily.
0.6 +0.2
–0.1
0.5 +0.2
–0.1
2.57
3.7
1.27
14 to 14.8
5 x P1.27 = 6.35
0.5 +0.2
–0.1
5 x P1.27 = 6.35
(Top View)
(5°)
B
0.5 +0.2
–0.1
Two different types of marks
to be used:
Mark 1:
Mark 2:
B
12.25 ±0.5
17.25 ±0.5
A
11.45 ±0.5
Branding Area
JAPAN
(5°)
A
19 ±0.3
(Bottom View)
2 +0.5
0
A
1.2 +0.2
–0.1
D–D
Branding codes
(exact appearance at manufacturer discretion):
Section A, type: SCM124xMF or SCM1241M
Section B,
lot: YMDDT
Where: Y is the last digit of the year of manufacture
M is the month (1 to 9, O, N, D)
DD is the date
T is the tracking letter (A to Z)
Device composition complies with the RoHS directive.
SCM1240MDS-Rev. 5
SANKEN ELECTRIC CO., LTD.
13
SCM1240M
High Voltage, High Current 3-Phase Motor Drivers
0.5
(2.6)
C
0.5
C
8 x P5.1 = 40.8
4.4 ±0.3
1.2 ±0.2
47 ±0.3
(5°)
MAX 1.2
Branding Area
15.95 ±0.5
Ø3.2 ±0.15
43.3 ±0.3
2.08 ±0.2
5 x P1.27 = 6.35
3.24
3.7
1.27
3.7
D
(0.6)
(2.6)
1.27
11.2 ±0.5
D
2 +0.2
–0.1
C–C
0.5 +0.2
–0.1
Pin pitch measured at root
Cu Thermal Pad
B–B
0.7 +0.2
–0.1
A–A
Leadform: 2558 (SCM1241M: Fully molded) or
(SCM1243MF, SCM1245MF, SCM1246MF:
Exposed copper thermal pad)
Dimensions in millimeters
The body shall be clean and shall not bear any stain, rust or flaw.
The type number and lot number shall be clearly stamped by
laser on the body so that cannot be erased easily.
0.6 +0.2
–0.1
0.5 +0.2
–0.1
2.57
3.7
1.27
B
5 x P1.27 = 6.35
0.5 +0.2
–0.1
5 x P1.27 = 6.35
(Top View)
(5°)
B
0.5 +0.2
–0.1
Two different types of marks
to be used:
Mark 1:
Mark 2:
B
11.45 ±0.5
A
JAPAN
14.75 ±0.5
17.25 ±0.5
A
19 ±0.3
(Bottom View)
2 +0.5
0
A
1.2 +0.2
–0.1
D–D
Branding codes
(exact appearance at manufacturer discretion):
Section A, type: SCM124xMF or SCM1241M
Section B,
lot: YMDDT
Where: Y is the last digit of the year of manufacture
M is the month (1 to 9, O, N, D)
DD is the date
T is the tracking letter (A to Z)
Device composition complies with the RoHS directive.
SCM1240MDS-Rev. 5
SANKEN ELECTRIC CO., LTD.
14
SCM1240M
High Voltage, High Current 3-Phase Motor Drivers
MECHANICAL CHARACTERISTICS
Characteristic
Remarks
Min.
Typ.
Max.
Units
58.8
–
78.4
N•cm
kgf•cm
Heatsink Mounting Screw Torque
Use one M3 screw each end
6.0
–
8.0
Flatness of Heatsink Attachment Area
Refer to figure below
0
–
200
μm
SCM1241M
–
10.8
–
g
SCM124xMF
–
11.8
–
g
Package Weight
Flatness Measurement Position
(Top View)
＋
＋ −
−
＋
SCM1240MDS-Rev. 5
＋
SANKEN ELECTRIC CO., LTD.
15
SCM1240M
High Voltage, High Current 3-Phase Motor Drivers
PACKING SPECIFICATION
Dimensions in millimeters
:
Tube type SCM-A
Maximum 10 pieces per tube
Pins aligned along X direction
Rubber plug at each end
Maximum 5 tubes in Y direction
Maximum 5 tubes in Z direction
<
;
SCM1240MDS-Rev. 5
Maximum pieces per carton:
10 pieces per tube
5 rows of tubes
x 5 layers of tubes
250 pieces per carton
SANKEN ELECTRIC CO., LTD.
16
SCM1240M
High Voltage, High Current 3-Phase Motor Drivers
WARNING — These devices are designed to be operated at lethal voltages and energy levels. Circuit designs
that embody these components must conform with applicable safety requirements. Precautions must be
taken to prevent accidental contact with power-line potentials. Do not connect grounded test equipment.
The use of an isolation transformer is recommended during circuit development and breadboarding.
Because reliability can be affected adversely by improper storage
environments and handling methods, please observe the following
cautions.
Cautions for Storage
•
Ensure that storage conditions comply with the standard
temperature (5°C to 35°C) and the standard relative humidity
(around 40 to 75%); avoid storage locations that experience
extreme changes in temperature or humidity.
•
Avoid locations where dust or harmful gases are present and
avoid direct sunlight.
•
Reinspect for rust on leads and solderability of product that has
been stored for a long time.
Cautions for Testing and Handling
•
When tests are carried out during inspection testing and other
standard test periods, protect the product from power surges from
the testing device, shorts between adjacent product packages,
and shorts to the heatsink.
•
The screwing torque for attaching a heatsink shall be 58.8 to
78.4 N•cm (6.0 to 8.0 Kgf•cm).
• Ensure there are no foreign objects between the heatsink and thermal
pad; only silicone thermal grease is allowed.
Remarks About Using Silicone Grease with a Heatsink
• When silicone grease is used in mounting this product with
a heatsink, grease shall be applied evenly and thinly. If more
silicone grease than required is applied, it may produce stress.
• Volatile-type silicone greases may permeate the product and
produce cracks after long periods of time, resulting in reduced
heat radiation effect, and possibly shortening the lifetime of the
product.
• Hard silicone greases may cause cracks in the product when
screwing the product to a heatsink.
SCM1240MDS-Rev. 5
•
Our recommended silicone greases for heat radiation purposes,
which will not cause any adverse effect on the product life, are
indicated below:
Type
G746
YG6260
Suppliers
Shin-Etsu Chemical Co., Ltd.
Momentive Performance Materials Holding, Inc.
SC102
Dow Corning Toray Silicone Co., Ltd.
Soldering
•
When soldering the product, please be sure to minimize the
working time, within the following limits:
260±5°C 10 s
380±5°C 5 s
•
Soldering iron should be at a distance of at least 1.5 mm from the
body of the product
Electrostatic Discharge
•
When handling the product, operator must be grounded.
Grounded wrist straps worn should have at least 1 MΩ of
resistance to ground to prevent shock hazard.
•
Workbenches where the product is handled should be grounded
and be provided with conductive table and floor mats.
•
When using measuring equipment such as a curve tracer, the
equipment should be grounded.
•
When soldering the product, the head of soldering irons or the
solder bath must be grounded in other to prevent leak voltages
generated by them from being applied to the product.
•
The product should always be stored and transported in our
shipping containers or conductive containers, or be wrapped in
aluminum foil.
SANKEN ELECTRIC CO., LTD.
17
SCM1240M
High Voltage, High Current 3-Phase Motor Drivers
• The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the latest revision of the document
before use.
• Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and Sanken can assume
no responsibility for any infringement of industrial property rights, intellectual property rights or any other rights of Sanken or any third party which may result from
its use.
• Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is
inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any
possible injury, death, fires or damages to the society due to device failure or malfunction.
• Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances,
office equipment, telecommunication equipment, measuring equipment, etc.).
When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and its control systems, traffic
signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose
electronic equipment or apparatus, please contact your nearest Sanken sales representative to discuss, prior to the use of the products herein.
The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required (aerospace equipment, nuclear
power control systems, life support systems, etc.) is strictly prohibited.
• In the case that you use our semiconductor devices or design your products by using our semiconductor devices, the reliability largely depends on the degree of
derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the load from each rated value or surge
voltage or noise is considered for derating in order to assure or improve the reliability. In general, derating factors include electric stresses such as electric voltage,
electric current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor
devices. For these stresses, instantaneous values, maximum values and minimum values must be taken into consideration.
In addition, it should be noted that since power devices or IC’s including power devices have large self-heating value, the degree of derating of junction temperature
(TJ) affects the reliability significantly.
• When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or
treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility.
• Anti radioactive ray design is not considered for the products listed herein.
• Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken’s distribution network.
• The contents in this document must not be transcribed or copied without Sanken’s written consent.
SCM1240MDS-Rev. 5
SANKEN ELECTRIC CO., LTD.
18
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