SI-3033ZD

1-1-1 Linear Regulator ICs SI-3000ZD Series Surface-Mount, Low Dropout Voltage Linear Regulator ICs ■Features • Compact surface-mount package (TO263-5) • Output current: 3.0A • Low dropout voltage: VDIF ≤ 0.6V (at IO = 3.0A) • Low circuit current at output OFF: Iq (OFF) ≤ 1µA • Built-in overcurrent and thermal protection circuits ■Absolute Maximum Ratings Parameter DC Input Voltage Output Control Terminal Voltage DC Output Current Power Dissipation Junction Temperature Operating Ambient Temperature Storage Temperature Thermal Resistance (Junction to Ambient Air) Thermal Resistance (Junction to Case) Symbol VIN*1 VC IO*1 PD*3 Tj Top Tstg Ratings 10 6 3.0 3 –30 to +125 –30 to +85 –40 to +125 33.3 3 Unit V V A W °C °C °C °C/W °C/W (Ta=25°C) ■Applications • Secondary stabilized power supply (local power supply) θ j-a θ j-c ■Recommended Operating Conditions Parameter Input Voltage Output Current Operating Ambient Temperature Operating Junction Temperature Output Voltage Variable Range Symbol VIN IO Top (a) Top (j) VOADJ Ratings *2 Unit V A °C °C V Remarks to 6*1 0 to 3 –20 to +85 –20 to +100 1.2 to 5 Only for SI-3011ZD. Refer to the block diagram. *1: VIN (max) and IO (max) are restricted by the relation PD = (VIN - VO) × IO. *2: Set the input voltage to 2.4V or higher when setting the output voltage to 2.0V or lower (SI-3011ZD). *3: When mounted on glass-epoxy board of 40 × 40mm (copper laminate area 100%). ■Electrical Characteristics Ratings Parameter Output Voltage (Reference Voltage VADJ for SI-3011ZD) Line Regulation Load Regulation Dropout Voltage Quiescent Circuit Current Circuit Current at Output OFF Temperature Coefficient of Output Voltage Ripple Rejection Overcurrent Protection Starting Current*2 *4 (Ta=25°C, VC=2V unless otherwise specified) SI-3011ZD (Variable type) min. typ. 1.100 VIN=VO+1V, IO=10mA 10 VIN=3.3 to 5V, IO=10mA (VO=2.5V) 40 VIN=3.3V, IO=0 to 3A (VO=2.5V) 0.6 IO=3A (VO=2.5V) 1 VIN=VO+1V, IO=0A, VC=2V 1 VIN=VO+1V, VC=0V ± 0.3 Tj=0 to 100°C 60 VIN=VO+1V, f=100 to 120HZ, IO=0.1A 3.2 VIN=VO+1V 2 0.8 100 VC=2.7V –5 0 VC=0V –5 VC=2.7V 0 VC=0V 2 0.8 100 3.2 VIN=5V VIN=5V, VC=0V ± 0.3 Tj=0 to 100°C 60 VIN=5V, f=100 to 120HZ, IO=0.1A 1.5 IO=3A 1 VIN=5V, IO=0A, VC=2V 1 1.5 VIN=5V, IO=0 to 3A 0.6 VIN=4.5 to 5.5V, IO=10mA 40 max. 1.122 min. 3.234 1.078 SI-3033ZD typ. 3.300 VIN=5V, IO=10mA 10 max. 3.366 V mV mV V mA Unit Symbol VO (VADJ) Conditions ∆VOLINE Conditions ∆VOLOAD Conditions VDIF Conditions Iq Conditions Iq (OFF) Conditions ∆VO/∆Ta Conditions RREJ Conditions IS1 Conditions VC, IH VC, IL IC, IH Conditions IC, IL Conditions µA mV/ °C dB A V Control Voltage (Output ON)*3 Control Voltage (Output OFF)*3 VC Control Current(Output ON) Terminal Control Current(Output OFF) µA µA *1: *2: *3: *4: Set the input voltage to 2.4V or higher when setting the output voltage to 2.0V or lower. IS1 is specified at the –5% drop point of output voltage VO under the condition of Output Voltage parameter. Output is OFF when the output control terminal (VC terminal) is open. Each input level is equivalent to LS-TTL level. Therefore, the device can be driven directly by LS-TTLs. These products cannot be used for the following applications because the built-in foldback-type overcurrent protection may cause errors during start-up stage. (1) Constant current load (2) Positive and negative power supply (3) Series-connected power supply (4) VO adjustment by raising ground voltage 26 ICs SI-3000ZD Series ■External Dimensions (TO263-5) Case temperature measurement point (0.40) 1.2 ±0.2 (Unit : mm) ±0.2 10.0 (8.0) 4.5 3-R0.3 ±0.2 (15°) (4.4) 1.3 –0.05 +0.10 (4.6) (1.75) (6.8) ±0.2 9.2± 9.2 ±0.2 φ1.5 Dp: ±0.2 (3°) (2×R0.45) (3°) ±0.1 0.10 (3°) ±0.15 2.4 (R0.3) ±0.3 ±0.2 0.88 ±0.10 (R0.3) 0~6° ±0.1 (0.5) (1.7 ±0.25 ) 1 2 3 4 9.9 ±0.2 0.8 ±0.25 ) (1.7 5 (3°) ±0.1 (1.7 ±0.25 ) 0.8 ±0.25 (1.7 ) Pin Assignment q VC w VIN e GND (Common to the rear side of product) r VO t Sense (ADJ for SI-3011ZD) Plastic Mold Package Type Flammability: UL94V-0 Product Mass: Approx. 1.48g ±0.3 15.3 ±0.2 2.0 15.30 ±0.3 (0.75) 4.9 (3°) 2-R0.3 0.1 10.0 ±0.02 ■Block Diagram SI-3011ZD VIN + 2.54 4.9 ±0.2 2 4 VO R3 * CIN REF + + R1 + Drive TSD OCP AMP1 5 ADJ CO R2 CIN: Input capacitor (Approx. 10µF) CO: Output capacitor (47µF or larger) The output voltage may oscillate if a low ESR type capacitor (such as a ceramic capacitor) is used for the output capacitor in the SI-3000ZD Series. VC ON/ OFF 1 + SI-3033ZD VIN + 2 CIN REF + + TSD OCP AMP1 CO VC ON/ OFF 1 + 3 GND ■Reference Data Copper Laminate Area (on Glass-Epoxy Board) vs. Thermal Resistance (from Junction to Ambient Temperature) (Typical Value) 55 Junction to Ambient Temperature Thermal Resistance θ j-a (°C/W) 50 When Using Glass-Epoxy Board of 40 × 40 mm 45 40 35 30 0 200 400 600 800 1000 1200 1400 1600 1800 Copper Laminate Area (mm2) + Drive - 3 GND 4 5 VO SENSE R1, R2: Output voltage setting resistors The output voltage can be set by connecting R1 and R2 as shown at left. The recommended value for R2 is 10kΩ or 11kΩ. R1= (VO–VADJ) / (VADJ/R2) *: Insert R3 in case of setting VO to VO ≤ 1.8V. The recommended value for R3 is 10kΩ. • A higher heat radiation effect can be achieved by enlarging the copper laminate area connected to the inner frame to which a monolithic IC is mounted. • Obtaining the junction temperature Measure GND terminal temperature TC with a thermocouple, etc. Then substitute this value in the following formula to obtain the junction temperature. Tj=PD×θ j–C+TC PD= (VIN–VO)•IOUT ICs 27