SI-3050LU

1-1-1 Linear Regulator ICs SI-3000LU Series Surface-Mount, Low Current Consumption, Low Dropout Voltage Linear Regulator ICs ■Features • Compact surface-mount package (SOT89-5) • Output current: 250 mA • Low current consumption lq (OFF) ≤ 1µA (VC = 0 V) • Low dropout voltage: VDIF ≤ 0.5 V (at IO = 250 mA) • Output voltage range (1.5V to 15V) • Built-in drooping-type-overcurrent and thermal protection circuits ■Absolute Maximum Ratings Parameter DC Input Voltage Output control terminal voltage DC Output Current Power Dissipation Junction Temperature Storage Temperature Thermal Resistance (Junction to Ambient Air) Symbol VIN VC IO PD*1 Tj*2 Tstg*2 Ratings 18 VIN 250 0.75 –40 to +135 –40 to +125 146 Unit V V mA W °C °C °C/W (Ta=25°C) θ j-a*1 *1: When mounted on glass-epoxy board 40 × 40 mm (copper laminate area 2%). *2: Thermal protection circuits may operate if the junction temperature exceeds 135°C. ■Applications • Auxiliary power supplies for PC • Battery-driven electronic equipment ■Recommended Operating Conditions Ratings Parameter Input Voltage DC Output Current Operating Ambient Temperature Symbol VIN IO Top min. *2, *3 max. VO+2*1 250 85 Unit V mA °C 0 –20 *1: VIN (max) and IO (max) are restricted by the relation PD = (VIN - VO) × IO. Calculate these values referring to the reference data on page 11. *2: Refer to the Dropout Voltage parameter. *3: For the SI-3012LU, set the input voltage to Vin ≥ 2.4 V, and secure the minimum voltage as explained in "Setting DC Input Voltage" section in Linear Regulator Application Note. ■Electrical Characteristics Ratings Parameter Symbol min. Reference Voltage VADJ Conditions VDIF Dropout Voltage Conditions Conditions ∆VLINE Line Regulation Conditions ∆VLOAD Load Regulation Conditions Temperature Coefficient of Reference Voltage Ripple Rejection Conditions Quiescent Circuit Current Circuit Current at Output OFF Overcurrent Protection Starting Current*1 Control Voltage (Output VC Terminal ON)*2 Control Voltage (Output OFF)*2 Control Current (Output ON) Control Current (Output OFF) Iq Conditions Iq(OFF) Conditions IS1 Conditions VC, IH VC, IL IC, IH Conditions IC, IL Conditions VC=2V 0 VC=0V 2.0 260 VIN=VO +1V VIN=VO+1V, VC=0V VIN=VO+1V, IO =0mA VC=2V, R2=100kΩ ∆VO/∆Ta Conditions RREJ VIN=VO +1V, IO=1 to 250mA( V O=3.3V) ±0.3 Tj=0 to 100°C 55 VIN=VO +1V , f=100 to 120HZ( VO=3.3V) VIN=VO+1 to VO+5V, IO=10mA( VO=3.3V) IO=100mA(VO =3.3V) 1.210 SI-3012LU(Variable) typ. 1.250 VIN=VO+1V, IO =10mA (Ta=25°C, VC=2V unless otherwise specified) Unit max. 1.290 0.3 0.5 IO=250mA(VO =3.3V) 10 mV 20 mV V V mV/ °C dB 150 µA 1 µA mA V 0.8 40 –5 µA µA *1: Is1 is specified at the 5% drop point of output voltage VO on the condition that VIN = 3.3 V, and IO = 10 mA. *2: Output is OFF when the output control terminal (VC terminal) is open. Each input level is equivalent to LS-TTL level. Therefore, the device can be driven directly by LS-TTLs. 10 ICs SI-3000LU Series ■External Dimensions (SOT89-5) 4.5±0.05 1.6±0.05 4.2±0.05 t 4.2±0.05 4.2±0.05 r 0.4±0.03 0.1±0.05 (Unit : mm) 2.5±0.05 4.3±0.05 ( φ1 .0 ±0.0 5) Pin Assignment q ADJ w GND e VC r VIN t VO Plastic Mold Package Type Flammability: UL94V-0 Product Mass: Approx. 0.05g 0.40 q w e ■Block Diagram SI-3012LU VIN 4 5 VO 0.4±0.05 1.5±0.05 1.5±0.05 1.5±0.05 0.90±0.1 4.2±0.05 4.7±0.05 4.2±0.05 0.90±0.1 VC 3 TSD + – 1 ADJ 2 GND REF ■Standard External Circuit SI-3012LU VIN CIN 4 3 1 2 GND VC ADJ R2 5 VO R1 Load + VIN CO: Output capacitor (10 µF or larger) For SI-3000LU series, Co has to be a low ESR capacitor such as a ceramic capacitor. CIN: Input capacitor (10 µF approx.) Setting of SI-3012LU output voltage (recommended voltage: 1.5 V to 15 V) R1 and R2: Resistors for output setting The output voltage can be set by connecting R1 and R2 as shown in the diagram on the left. R2: 100 kΩ is recommended R1=(VO–VADJ)/(VADJ/R2) • ■Reference Data Copper Laminate Area vs Power Dissipation Tj=100°C PCB size 40×40 1 0.9 Ta=25°C Ta=40°C Ta=60°C Ta=85°C Power Dissipation PD (W) 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10 Case temperature Tc measurement point • A monolithic ICs mounts an inner frame stage that is connected to the GND pin (pin 2). Therefore, enlarging the copper laminate area connected to the GND pin improves heat radiation effect. • Obtaining the junction temperature Measure the temperature TC at the lead part of the GND pin (pin 2) with a thermocouple, etc. Then, substitute this value in the following formula to obtain the junction temperature. T j=P D×θ j–c+Tc (θ j–c=5 ° C/W) 100 1000 Copper Laminate Area (mm2) ICs 11