SI-8000E_11

1-1-3 DC/DC Converter ICs SI-8000E Series ■Features • Compact full-mold package (equivalent to TO220) • High efficiency: 80% • Requires only 4 discrete components Full-Mold, Separate Excitation Step-down Switching Mode ■Lineup Part Number VO(V) IO(A) SI-8050E 5.0 0.6 • Internally-adjusted phase correction and output voltage • Built-in reference oscillator (60kHz) • Built-in overcurrent and thermal protection circuits ■Absolute Maximum Ratings Parameter DC Input Voltage Power Dissipation Junction Temperature Storage Temperature Thermal Resistance(junction to case) Thermal Resistance(junction to ambient air) Symbol VIN PD1 PD2 Tj Tstg Ratings 43 14(With infinite heatsink) 1.5(Without heatsink, stand-alone operation) +125 –40 to +125 7.0 66.7 Unit V W W °C °C °C/W °C/W ■Applications • Power supplies for telecommunication equipment • Onboard local power supplies θ j-c θ j-a ■Recommended Operating Conditions Ratings Parameter DC Input Voltage Range Output Current Range Operating Junction Temperature Range Operating Temperature Range Symbol VIN IO Tjop Top SI-8050E 7 to 40 0 to 0.6 –30 to +125 –30 to +125 Unit V A °C °C ■Electrical Characteristics Ratings Parameter Symbol VO Output Voltage Efficiency Oscillation Frequency Line Regulation Load Regulation Temperature Coefficient of Output Voltage Overcurrent Protection Starting Current Conditions min. 4.80 SI-8050E typ. 5.00 VIN=20V, IO=0.3A 80 VIN=20V, IO=0.3A 60 VIN=20V, IO=0.3A 80 VIN=10 to 30V, IO=0.3A 30 VIN=20V, IO=0.1 to 0.4A ± 0.5 0.61 VIN=10V 40 100 max. 5.20 (Ta=25°C) Unit V % kHZ mV mV mV/ °C A η Conditions f Conditions ∆VOLINE Conditions ∆VOLOAD Conditions ∆VO/∆Ta IS1 Conditions 32 ICs SI-8000E Series ■External Dimensions (TO220F-5) 10.0 ±0.2 (Unit : mm) ±0.2 0.5 4.0±0.2 7.9±0.2 16.9±0.3 φ 3.2±0.2 (17.9) 4.2 ±0.2 2.8 2.6±0.1 0.95 ±0.15 +0.2 0.85 –0.1 0.45 –0.1 P1.7±0.7×4=6.8±0.7 +0.2 Pin Assignment q VIN w SWOUT e GND r VOS t N.C Plastic Mold Package Type Flammability: UL94V-0 Product Mass: Approx. 2.3g (4.6) 3.9±0.7 (4.3) 8.2±0.7 12345 Forming No. 1101 ■Block Diagram (8.0) (2.0) ■Typical Connection Diagram 5V : 200µH VIN 1 OCP Reg. OSC Reset Drive Comp. 4 VOS TSD 2 SWOUT VIN 1 2 VIN SWOUT L1 VO + C1 100µF SI-8000E VOS GND 3 NC 5 4 D1 AK06 (Sanken) + C2 330µF Amp. VREF 3 GND 5 N.C GND GND ■Ta-PD Characteristics 15 Infinite heatsink With Silicone Grease Heatsink: Aluminum PD=VO·IO 100 VO –1 –VF·IO 1– ηχ VIN Power Dissipation PD (W) 10 10 0× 10 The efficiency depends on the input voltage and the output current. Therefore, obtain the value from the efficiency graph and substitute the percentage in the formula above. .3 20 5 Without heatsink 0 –30 0 25 m (5 75 .2° ×7 C/ 5× W 2m ) m (7. 6° C/ W) / °C W Operating Ambient Temperature Ta (°C) Thermal design for D1 must be considered separately. 20 0× 0× 2m m 2m 0× (2 ) VO VIN IO ηx VF 100 125 : : : : : 50 75 Output voltage Input voltage Output current Efficiency (%) Diode D1 forward voltage 0.4V(AK06) ICs 33