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SI-8000JD_11

SI-8000JD_11

  • 厂商:

    SANKEN(三垦)

  • 封装:

  • 描述:

    SI-8000JD_11 - Surface-Mount, Separate Excitation Step-down Switching Mode - Sanken electric

  • 数据手册
  • 价格&库存
SI-8000JD_11 数据手册
1-1-3 DC/DC Converter ICs SI-8000JD Series ■Features • Surface-mount package (TO263-5) • Output current: 1.5A • High efficiency: 77 to 88% • Requires only 4 discrete components • Internally-adjusted phase correction and output voltage Surface-Mount, Separate Excitation Step-down Switching Mode ■Lineup Part Number VO(V) IO(A) SI-8033JD 3.3 SI-8050JD 5.0 1.5 SI-8090JD 9.0 SI-8120JD 12.0 ■Absolute Maximum Ratings Parameter DC Input Voltage Output Current Power Dissipation* Symbol VIN IO PD Tj Tstg Ratings 43 1.5 3 +125 –40 to +125 3 33.3 Unit V A W °C °C °C/W °C/W When mounted on glass-epoxy board 40 × 40 mm (copper area 100%) When mounted on glass-epoxy board 40 × 40 mm (copper area 100%) Conditions • Capable of downsizing a choke-coil due to IC's high switching frequency (125 kHz). (Compared with conventional Sanken devices) • Built-in foldback-overcurrent and thermal protection circuits • Output ON/OFF available (Circuit current at output OFF: 200µA max) • Soft start available by ON/OFF pin Conditions Junction Temperature Storage Temperature Thermal Resistance (Junction to Case) Thermal Resistance (Junction to Ambient Air) θ j-c θ j-a *: Limited by thermal protection circuit ■Applications • Power supplies for telecommunication equipment • Onboard local power supplies, etc. ■Recommended Operating Conditions Ratings Parameter DC Input Voltage Range DC Output Current Range* Operating Junction Temperature Range Operating Temperature Range* Symbol VIN1 VIN2 IO Tjop Top SI-8033JD 5.3 to 40 6.3 to 40 SI-8050JD 7 to 40 8 to 40 0 to 1.5 –30 to +125 –30 to +125 SI-8090JD 11 to 40 12 to 40 SI-8120JD 14 to 40 15 to 40 V A °C °C Unit Conditions IO=0 to 1A IO=0 to 1.5A VIN≥VO+3V *: Limited by Ta–PD characteristics ■Electrical Characteristics Ratings Parameter Symbol min. VO Output Voltage Efficiency Oscillation Frequency Line Regulation Load Regulation Temperature Coefficient of Output Voltage Overcurrent Protection Starting Current Low Level Voltage ON/OFF* Pin Outflow Current at Low Voltage Conditions 3.234 SI-8033JD typ. 3.30 77 VIN=15V, IO=0.5A 125 VIN=15V, IO=0.5A 25 10 ± 0.5 1.6 VIN=15V 0.5 100 7 VIN=15V, Io=0A 200 VIN=15V, VON/OFF=0.3V 7 VIN=20V, Io=0A 200 VIN=20V, VON/OFF=0.3V 1.6 VIN=20V 0.5 100 VSSL=0V 7 VIN=21V, Io=0A 200 VIN=21V, VON/OFF=0.3V 7 VIN=24V, Io=0A 200 VIN=24V, VON/OFF=0.3V 80 30 VIN=8 to 30V, IO=0.5A VIN=15V, IO=0.2 to 0.8A max. 3.366 min. 4.90 SI-8050JD typ. 5.00 82 VIN=20V, IO=0.5A 125 VIN=20V, IO=0.5A 40 10 ± 0.5 1.6 VIN=21V 0.5 100 100 40 VIN=10 to 30V, IO=0.5A VIN=20V, IO=0.2 to 0.8A max. 5.10 min. 8.82 SI-8090JD typ. 9.00 86 VIN=21V, IO=0.5A 125 VIN=21V, IO=0.5A 50 10 ± 1.0 1.6 VIN=24V 0.5 100 120 40 VIN=15 to 30V, IO=0.5A VIN=21V, IO=0.2 to 0.8A max. 9.18 min. 11.76 SI-8120JD typ. 12.00 88 VIN=24V, IO=0.5A 125 VIN=24V, IO=0.5A 60 10 ± 1.0 130 VIN=18 to 30V, IO=0.5A 40 VIN=24V, IO=0.2 to 0.8A max. 12.24 (Ta=25°C) Unit VIN=15V, IO=0.5A VIN=20V, IO=0.5A VIN=21V, IO=0.5A VIN=24V, IO=0.5A V % kHZ mV mV mV/ °C A V η Conditions f Conditions ∆VOLINE Conditions ∆VOLOAD Conditions ∆VO/∆Ta IS1 Conditions VSSL ISSL Conditions Iq Conditions Iq(oFF) Conditions µA mA Quiescent Circuit Current µA *: Pin 5 is the ON/OFF pin. Soft start at power on can be performed with a capacitor connected to this pin. The output can also be turned ON/OFF with this pin. The output is stopped by setting the voltage of this pin to VSSL or lower. ON/OFF-pin voltage can be changed with an open-collector drive circuit of a transistor. When using both the soft-start and ON/OFF functions together, the discharge current from C3 flows into the ON/OFF control transistor. Therefore, limit the current securely to protect the transistor if C3 capacitance is large. The ON/OFF pin is pulled up to the power supply in the IC, so applying the external voltage is prohibited. SI-8000JD SI-8000JD SI-8000JD 5 ON/OFF 5 ON/OFF C3 5 ON/OFF C3 VOUT. ON/OFF Soft Start Soft Start +VOUT. ON/OFF 16 ICs SI-8000JD Series ■External Dimensions (TO263-5) Case temperature measurement point (0.40) ±0.2 (Unit : mm) 10.0 ±0.2 (8.0) 4.5 3-R0.3 ±0.2 1.2 (15°) (4.4) 1.3 +0.10 –0.05 (4.6) (1.75) (6.8) ±0.2 ±0.2 φ1.5 Dp: ±0.2 (3°) (2×R0.45) (3°) ±0.1 0.10 (3°) ±0.15 2.4 (R0.3) ±0.3 ±0.2 0.88 ±0.10 (R0.3) 0 to 6° (0.5) ±0.1 Pin Assignment q VIN w SWOUT e GND r VOS t ON/OFF Plastic Mold Package Type Flammability: 94V-0 Product Mass: Approx. 1.48g 9.2± ±0.3 15.3 ±0.2 2.0 15.30 ±0.3 (0.75) 4.9 (1.7 ±0.25 ) 1 2 3 4 9.9 ±0.2 0.8 ±0.25 ) (1.7 5 (3°) ±0.1 2.54 (1.7 ±0.25 ) 0.8 ±0.25 (1.7 ) (3°) 2-R0.3 10.0 ±0.02 ■Block Diagram ■Typical Connection Diagram L1 VIN 1 VIN SWOUT 2 4 + Di VOUT 1 VIN PReg. OCP SWOUT 2 4.9 ±0.2 9.2 SI-8000JD C1 + ON/OFF GND 5 3 C3 VOS 5 ON/OFF ON/OFF Soft Start Reset OSC + – C2 Latch & Drive GND Comp. Error Amp. + – GND TSD 4 VREF GND 3 C1 C2 C3 L1 Di : : : : : 50V/220µF 25V/470µF 10V/0.47µF (Only when using soft-start function) 100µH SJPB-H6 (Sanken) ■Reference Data Copper Laminate Area on Glass Epoxy Board vs. Thermal Resistance (Junction to Ambient Air) (Typical Value) Thermal Resistance (junction to ambient air) θ j-a (°C/W ) 55 50 2.6 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 Output Current vs. Power Dissipation (Typical) With glass epoxy board of 40 × 40 mm 45 40 35 30 0 Power Dissipation Pd (W) 40V 30V 20V VIN 8V 200 400 600 800 1000 1200 1400 1600 1800 Copper Laminate Area (mm2) 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Output Current IO (A) ■Ta-PD Characteristics 3.5 3 Copper Area 40×40 mm ( θ j-a : 33.3°C/W) 20×40 mm ( θ j-a : 37°C/W) 20×20 mm ( θ j-a :44°C/W) 10×10 mm ( θ j-a : 53°C/W) PD=VO·IO 100 VO –1 –VF·IO 1– ηχ VIN Power Dissipation PD (W) 2.5 2 1.5 1 0.5 The efficiency depends on the input voltage and the output current. Therefore, obtain the value from the efficiency graph and substitute the percentage in the formula above. VO : Output Voltage VIN : Input Voltage IO : Output Current ηχ : Efficiency (%) VF : D1 forward voltage 0.4V(IO=2A)(SJPB-H6) Thermal design for D1 must be considered separately. 0 –25 0 25 50 75 100 125 Ambient Temperature Ta (°C) ICs 17
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