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SI-8000S_10

SI-8000S_10

  • 厂商:

    SANKEN(三垦)

  • 封装:

  • 描述:

    SI-8000S_10 - Full-Mold, Separate Excitation Step-down Switching Mode Regulator ICs - Sanken electri...

  • 数据手册
  • 价格&库存
SI-8000S_10 数据手册
1-1-2 Switching Mode Regulator ICs SI-8000S Series Full-Mold, Separate Excitation Step-down Switching Mode Regulator ICs ■Features • Compact full-mold package (equivalent to TO220) • Output current: 3.0A • High efficiency: 79 to 91% • Requires only 4 discrete components • Internally-adjusted phase correction and output voltage • Built-in reference oscillator (60kHz) • Built-in overcurrent and thermal protection circuits • Built-in soft start circuit (Output ON/OFF available) ■Lineup Part Number VO(V) IO(A) SI-8033S 3.3 SI-8050S 5.0 SI-8090S 9.0 3.0 SI-8120S 12.0 SI-8150S 15.0 ■Absolute Maximum Ratings Parameter DC Input Voltage Power Dissipation Junction Temperature Storage Temperature SW Terminal Applied Reverse Voltage Thermal Resistance(junction to case) Symbol VIN PD1 PD2 Tj Tstg VSW Ratings 43* 18(With infinite heatsink) 1.5(Without heatsink, stand-alone operation) +125 –40 to +125 –1 5.5 Unit V W W °C °C V °C/W θ j-c *35V for SI-8033S ■Applications • Power supplies for telecommunication equipment • Onboard local power supplies ■Recommended Operating Conditions Ratings Parameter DC Input Voltage Range Output Current Range Operating Junction Temperature Range Symbol VIN IO Tjop SI-8033S 5.5 to 28 SI-8050S 7 to 40 SI-8090S 12 to 40 0 to 3.0 –30 to +125 SI-8120S 15 to 40 SI-8150S 18 to 40 Unit V A °C ■Electrical Characteristics Ratings Parameter SI-8000S*1 Output Voltage SI-8000SS VO Conditions Efficiency Oscillation Frequency Line Regulation Load Regulation Temperature Coefficient of Output Voltage Overcurrent Protection Starting Current Symbol min. 3.17 3.234 SI-8033S typ. 3.30 3.30 79 VIN=15V, IO=1.0A 60 VIN=15V, IO=1.0A 25 10 80 30 VIN=8 to 28V, IO=1.0A VIN=15V, IO=0.5 to 1.5A ± 0.5 3.1 VIN=15V 3.1 VIN=20V max. 3.43 3.366 min. 4.80 4.90 SI-8050S typ. 5.00 5.00 84 VIN=20V, IO=1.0A 60 VIN=20V, IO=1.0A 40 10 100 40 VIN=10 to 30V, IO=1.0A VIN=20V, IO=0.5 to 1.5A ±0.5 3.1 VIN=21V max. 5.20 5.10 VIN=21V, IO=1.0A 88 VIN=21V, IO=1.0A 60 VIN=21V, IO=1.0A 50 10 120 40 VIN=15 to 30V, IO=1.0A VIN=21V, IO=0.5 to 1.5A ±1.0 3.1 VIN=24V VIN=24V, IO=1.0A 90 VIN=24V, IO=1.0A 60 VIN=24V, IO=1.0A 60 10 130 40 VIN=18 to 30V, IO=1.0A VIN=24V, IO=0.5 to 1.5A ± 1.0 3.1 VIN=25V VIN=25V, IO=1.0A 91 VIN=25V, IO=1.0A 60 VIN=25V, IO=1.0A 60 10 130 VIN=21 to 30V, IO=1.0A 40 VIN=25V, IO=0.5 to 1.5A ± 1.0 min. 8.55 SI-8090S typ. 9.00 max. 9.45 min. 11.50 SI-8120S typ. 12.00 max. 12.50 min. 14.25 SI-8150S typ. 15.00 max. 15.75 (Ta=25°C) Unit V VIN=15V, IO=1.0A VIN=20V, IO=1.0A η Conditions f Conditions ∆VOLINE Conditions ∆VOLOAD Conditions ∆VO/∆Ta IS1 Conditions % kHZ mV mV mV/ °C A *1: “S” may be printed to the right of the marking (except SI-8090S, SI-8120S, SI-8150S). 62 ICs SI-8000S Series ■External Dimensions (TO220F-5) 0.5 (Unit : mm) 4.2 2.8±0.2 ±0.2 10.0 ±0.2 4.0±0.2 7.9±0.2 16.9±0.3 φ 3.2±0.2 (17.9) 2.6±0.1 (2.0) 0.95±0.15 0.85 –0.1 (4.6) +0.2 0.45 –0.1 P1.7±0.7×4=6.8±0.7 +0.2 Pin Assignment q VIN w SWOUT e GND r VOS t S.S Plastic Mold Package Type Flammability: UL94V-0 Product Mass: Approx. 2.3g 3.9±0.7 (4.3) 8.2±0.7 12345 Forming No. 1101 ■Block Diagram VIN 1 Reg. OSC Reset OCP 2 SWOUT Drive Comp. TSD 4 VOS Amp. VREF 5 S.S. 3 GND ■Typical Connection Diagram VIN 1 2 VIN SWOUT L1 VO (8.0) + C1 SI-8000S VOS S.S 5 GND 3 4 D1 + C2 C1,2 : 1000µF L1 : 150µH D1 : RK46(Sanken) GND GND ■Ta-PD Characteristics 20 Infinite heatsink PD=VO•IO With Silicone Grease Heatsink: Aluminum 100 –1 ηχ –VF•IO 1– VO VIN Power Dissipation PD (W) 15 200×200×2mm (2.3°C/W) The efficiency depends on the input voltage and the output current. Therefore, obtain the value from the efficiency graph and substitute the percentage in the formula above. VO VIN IO ηx VF : : : : : Output voltage Input voltage Output current Efficiency (%) Diode D1 forward voltage 0.5V(RK46) 100×100×2mm 10 (5.2°C/W) 75×75×2mm (7.6°C/W) 5 Without heatsink 0 –25 0 25 50 75 100 125 Operating Ambient Temperature Ta (°C) Thermal design for D1 must be considered separately. ICs 63
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