SI-8000W_11

1-1-3 DC/DC Converter ICs SI-8000W Series ■Features • Surface-mount package (SOP8) • Output current: 0.6A • High efficiency: 75 to 80% • Requires only 4 discrete components Surface-Mount, Separate Excitation Step-down Switching Mode ■Absolute Maximum Ratings Parameter DC Input Voltage Power Dissipation Junction Temperature Storage Temperature Thermal Resistance (Junction to 7-Pin Lead) Thermal Resistance (Junction to Ambient Air)*1 Symbol VIN PD Tj Tstg Ratings 35 1 –30 to +125 –40 to +125 22 100 Unit V W °C °C °C/W °C/W • Internally-adjusted phase correction and output voltage adjustment performed internally • Built-in reference oscillator (60kHz) • Built-in overcurrent and thermal protection circuits θ j-L θ j-a *1: Glass-epoxy board of 40 × 40mm (copper laminate area 4.3%) ■Applications • Power supplies for telecommunication equipment • Onboard local power supplies ■Recommended Operating Conditions Ratings Parameter DC Input Voltage Range Output Current Range Operating Junction Temperature Range Symbol VIN IO Tjop SI-8033W 5.3 to 28 0 to 0.6 –30 to +125 SI-8050W 7 to 33 Unit V A °C ■Electrical Characteristics Ratings Parameter Symbol min. Output Voltage Efficiency Oscillation Frequency Line Regulation Load Regulation Temperature Coefficient of Output Voltage Ripple Rejection Overcurrent Protection Starting Current VO Conditions 3.17 SI-8033W typ. 3.30 VIN=15V, IO=0.3A 75 VIN=15V, IO=0.3A 60 VIN=15V, IO=0.3A 60 VIN=8 to 28V, IO=0.3A 20 VIN=15V, IO=0.1 to 0.4A ± 0.5 45 f=100 to 120HZ 0.61 VIN=15V 0.61 VIN=20V 30 80 max. 3.43 min. 4.80 SI-8050W typ. 5.00 VIN=20V, IO=0.3A 80 VIN=20V, IO=0.3A 60 VIN=20V, IO=0.3A 80 VIN=10 to 30V, IO=0.3A 30 VIN=20V, IO=0.1 to 0.4A ± 0.5 45 f=100 to 120HZ 40 100 max. 5.20 (Ta=25°C) Unit V % kHZ mV mV mV/ °C dB A η Conditions f Conditions ∆VOLINE Conditions ∆VOLOAD Conditions ∆VO/∆Ta RREJ Conditions IS1 Conditions 14 ICs SI-8000W Series ■External Dimensions (SOP8) 5.1±0.4 1.27 0.4±0.1 0.15+0.1 –0.05 (Unit : mm) 8 7 6 5 1 2 3 4 1.55±0.15 0t 0.995max. o1 0° 1.27 Pin Assignment q VIN w N.C e SW r VOS t GND y GND u GND i GND Plastic Mold Package Type Flammability: UL94V-0 Product Mass: Approx. 0.1g 4.4±0.2 0.5±0.1 0.05±0.05 1.5±0.1 6.2±0.3 0.10 0.4±0.1 0.12 M ■Block Diagram VIN 1 OCP Reg. OSC 3 SW ■Typical Connection Diagram L1 200µH VIN 1 VIN SW 3 4 D1 SJPB-D4 (Sanken) + VO Reset Drive Comp. TSD C1 100µF + SI-8000W GND 5 to 8 VOS C2 330µF Amp. VREF 5 to 8 4 VOS GND GND GND ■Reference Data Copper Laminate Area vs. Power Dissipation 1.2 Tj=100°C Area of PC board : 40 × 40mm Ta=25°C 1 Power Dissipation PD (W) Copper Laminate Area vs. Thermal Resistance θ j-a 140 Area of PC board : 40 × 40mm Ta=50°C Ta=80°C 120 Thermal Resistance θ j-a (°C/W) 0.8 100 0.6 0.4 80 60 0.2 0 10 100 Copper Laminate Area (mm2) (GND Terminal) 1000 40 10 100 Copper Laminate Area (mm2) (GND Terminal) 1000 ICs 15