PD = 2 W
Transient Voltage Suppressor
SJPZ-N Series
Data Sheet
Description
Package
The SJPZ-N series are power Zener diodes designed
for the protection of automotive electronic units,
especially from the surge generated during load dump
conditions and voltage transients induced by inductive
loads. The package of the IC has high dissipation and
high surge capability.
SJP
(1)
(2)
Features
● AEC-Q101 Qualified
● Meets the Surge Protection Requirements in
ISO7637-2 Standrard (Pulse 1-3)
● High Reliability and Automotive Requirement
● High Surge Capability
● Flammability UL94V-0 (Equivalent)
● Bare Lead Frame: Pb-free (RoHS Compliant)
(1)
(2)
(1) Cathode
(2) Anode
Not to scale
Applications
Protection of sensitive electronic equipment in
passenger cars, trucks, vans, and buses:
●
●
●
●
●
●
●
Selection Guide
Part Number
Engine Control Units
Electric Control Units
Braking System
Power Steering System
Airbag System
Audio System
Infotainment System
VZ
Min.
Max.
SJPZ-N18
16.8 V
19.1 V
SJPZ-N27
25.1 V
28.9 V
SJPZ-N33
31.0 V
35.0 V
PRSM*
PD
500 W
2W
SJPZ-N40
37.8 V
42.2 V
*500 μs, single block pulse
Typical Application
Key
Battery
Load
Surge Absorber
SJPZ-N Series
GND
SJPZ-N-DSE Rev.1.2
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© SANKEN ELECTRIC CO., LTD. 2016
1
SJPZ-N Series
Contents
Description ------------------------------------------------------------------------------------------------------ 1
Contents --------------------------------------------------------------------------------------------------------- 2
Absolute Maximum Ratings --------------------------------------------------------------------------------- 3
Electrical Characteristics ------------------------------------------------------------------------------------ 4
SJPZ-N18 Rating and Characteristic Curves ------------------------------------------------------------ 5
SJPZ-N27 Rating and Characteristic Curves ------------------------------------------------------------ 7
SJPZ-N33 Rating and Characteristic Curves ------------------------------------------------------------ 9
SJPZ-N40 Rating and Characteristic Curves ---------------------------------------------------------- 11
Physical Dimensions ----------------------------------------------------------------------------------------- 13
Marking Diagram-------------------------------------------------------------------------------------------- 14
Important Notes ---------------------------------------------------------------------------------------------- 15
SJPZ-N-DSE Rev.1.2
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© SANKEN ELECTRIC CO., LTD. 2016
2
SJPZ-N Series
Absolute Maximum Ratings
Unless otherwise specified, TA = 25 °C.
Parameter
Symbol
Power Dissipation
(1)
Conditions
PD
Lead temperature
Rating
Unit
2
W
(2)
13
DC Blocking Voltage
20
—
VDC
25
SJPZ-N18
V
30
Peak Reverse Power
PRSM
Junction Temperature
TJ
500 μs, single block
pulse
—
Storage Temperature
TSTG
—
1.6 mm
TL
Device
Remarks
SJPZ-N27
SJPZ-N33
SJPZ-N40
500
W
−55 to 150
°C
−55 to 150
°C
TA
Cu land
2 mm
25 mm
2 mm
2 mm
Substrate
25 mm
Figure 1.
(1)
(2)
Lead Temperature Measurement Conditions
See Figure 2.
See Figure 1.
SJPZ-N-DSE Rev.1.2
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3
SJPZ-N Series
Electrical Characteristics
Unless otherwise specified, TA = 25 °C.
Parameter
Symbol
Forward Voltage Drop
Reverse Leakage Current
Breakdown Voltage
Breakdown Voltage
Temperature Coefficient
Breakdown Region Equivalent
Resistance
Thermal Resistance
(3)
VF
IR
VZ
rZ
RZ
Rth(J-L)
Conditions
Min.
Typ.
Max.
Unit
IF = 2 A
—
—
1.20
V
VR = 13 V
—
—
1
VR = 20 V
—
—
1
VR = 25 V
—
—
1
VR = 30 V
—
—
1
SJPZ-N40
1 6 .8
—
19.1
SJPZ-N18
2 5 .1
—
28.9
3 1 .0
—
35.0
3 7 .8
—
42.2
SJPZ-N40
—
13
—
SJPZ-N18
—
23
—
—
29
—
—
35
—
—
2
—
—
4
—
—
5
—
—
7
—
—
20
—
IZ = 1 mA
IZ = 1 mA
IZ = 10 mA to 20 mA
(3)
Remarks
SJPZ-N18
µA
V
mV/°C
SJPZ-N27
SJPZ-N33
SJPZ-N27
SJPZ-N33
SJPZ-N27
SJPZ-N33
SJPZ-N40
Ω
°C/W
Rth(J-L) is thermal resistance between junction and lead. Lead temperature is measured as shown in Figure 1.
SJPZ-N-DSE Rev.1.2
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© SANKEN ELECTRIC CO., LTD. 2016
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SJPZ-N Series
SJPZ-N18 Rating and Characteristic Curves
10000
Peak Surge Power Capability, PRSM (W)
2.5
Power Dissipation, PD (W)
2.0
1.5
1.0
0.5
1000
100
0.0
0
25
50
75
100
125
10
150
0.1
Ambient Temperature, TA (°C)
Figure 2.
1
10
100
Pulse Width, tW (ms)
SJPZ-N18 Power Dissipation Curves(4)
Figure 3.
SJPZ-N18 Peak Surge Reverse Power
Capability(5)
1000
Thermal Resistance (°C/W)
Between junction and ambient air
100
10
Between junction and lead
1
0.1
10 m
100 m
1
10
100
1000
Pulse Width (s)
Figure 4.
SJPZ-N18 Typical Transient Thermal Resistance(6)
(4)
See Figure 1 for the measurement conditions of the lead temperature.
tW is single block pulse.
(6)
See Figure 1 for the measurement conditions of the lead temperature.
(5)
SJPZ-N-DSE Rev.1.2
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SJPZ-N Series
10
1.E-03
TA = 150 °C
Reverse Current, IR (A)
Forward Current, IF (A)
1.E-04
1
0.1
TA = 100 °C
TA = 25 °C
0.01
TA = −55 °C
1.E-05
1.E-06
TA = 150 °C
1.E-07
0.001
1.E-08
0.0
0.5
1.0
1.5
2.0
0 1 2 3 4 5 6 7 8 9 10 11 12 13
Forward Voltage, VF (V)
Figure 5.
Reverse Voltage, VR (V)
SJPZ-N18 Typical Characteristics: IF vs. VF
Figure 6.
20
1
Breakdown Voltage, VZ (V)
Reverse Current, IZ (A)
10
SJPZ-N18 Typical Characteristics: IR vs. VR
0.1
0.01
19
18
17
16
t = 0.4 ms
0.001
10
15
20
25
30
15
-100
SJPZ-N18 Typical Characteristics: IZ vs. VZ
100
200
Junction Temperature, TJ (°C)
Reverse Voltage, VZ (V)
Figure 7.
0
Figure 8.
SJPZ-N18 Typical Characteristics: VZ vs. TJ
SJPZ-N-DSE Rev.1.2
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SJPZ-N Series
SJPZ-N27 Rating and Characteristic Curves
10000
Peak Surge Power Capability, PRSM (W)
2.5
Power Dissipation, PD (W)
2.0
1.5
1.0
0.5
1000
100
0.0
0
25
50
75
100
125
10
150
0.1
Ambient Temperature, TA (°C)
Figure 9.
1
10
100
Pulse Width, tW (ms)
SJPZ-N27 Power Dissipation Curves(7)
Figure 10.
SJPZ-N27 Peak Surge Reverse Power
Capability(8)
1000
Thermal Resistance (°C/W)
Between junction and ambient air
100
10
Between junction and lead
1
0.1
10 m
100 m
1
10
100
1000
Pulse Width (s)
Figure 11.
SJPZ-N27 Typical Transient Thermal Resistance(9)
(7)
See Figure 1 for the measurement conditions of the lead temperature.
tW is single block pulse..
(9)
See Figure 1 for the measurement conditions of the lead temperature.
(8)
SJPZ-N-DSE Rev.1.2
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7
SJPZ-N Series
10
1.E-03
TA = 150 °C
Reverse Current, IR (A)
Forward Current, IF (A)
1.E-04
1
0.1
TA = 100 °C
TA = 25 °C
0.01
TA = −55 °C
1.E-05
1.E-06
TA = 150 °C
1.E-07
0.001
1.E-08
0.0
0.5
1.0
1.5
2.0
0
5
Forward Voltage, VF (V)
Figure 12.
10
15
20
Reverse Voltage, VR (V)
SJPZ-N27 Typical Characteristics: IF vs. VF
Figure 13.
10
SJPZ-N27 Typical Characteristics: IR vs. VR
31
1
Breakdown Voltage, VZ (V)
Reverse Current, IZ (A)
30
0.1
0.01
0.001
25
30
35
28
27
26
25
t = 0.4 ms
20
29
40
24
-100
SJPZ-N27 Typical Characteristics: IZ vs. VZ
100
200
Junction Temperature, TJ (°C)
Reverse Voltage, VZ (V)
Figure 14.
0
Figure 15.
SJPZ-N27 Typical Characteristics: VZ vs. TJ
SJPZ-N-DSE Rev.1.2
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SJPZ-N Series
SJPZ-N33 Rating and Characteristic Curves
10000
Peak Surge Power Capability, PRSM (W)
2.5
Power Dissipation, PD (W)
2.0
1.5
1.0
0.5
1000
100
0.0
0
25
50
75
100
125
150
10
0.1
Ambient Temperature, TA (°C)
Figure 16.
1
10
100
Pulse Width, tW (ms)
SJPZ-N33 Power Dissipation Curves(10)
Figure 17.
SJPZ-N33 Peak Surge Reverse Power
Capability(11)
1000
Thermal Resistance (°C/W)
Between junction and ambient air
100
10
Between junction and lead
1
0.1
10 m
100 m
1
10
100
1000
Pulse Width (s)
Figure 18.
SJPZ-N33 Typical Transient Thermal Resistance(12)
(10)
See Figure 1 for the measurement conditions of the lead temperature.
tW is single block pulse..
(12)
See Figure 1 for the measurement conditions of the lead temperature.
(11)
SJPZ-N-DSE Rev.1.2
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SJPZ-N Series
10
1.E-03
1.E-04
Reverse Current, IR (A)
Forward Current, IF (A)
TA = 150 °C
1
0.1
TA = 100 °C
TA = 25 °C
0.01
TA = −55 °C
1.E-05
1.E-06
TA = 150 °C
1.E-07
0.001
1.E-08
0.0
0.5
1.0
1.5
2.0
0
5
Forward Voltage, VF (V)
Figure 19.
10
15
20
25
Reverse Voltage, VR (V)
SJPZ-N33 Typical Characteristics: VF vs. IF
Figure 20.
SJPZ-N33 Typical Characteristics: VR vs. IR
37
10
Breakdown Voltage, VZ (V)
Reverse Current, IZ (A)
36
1
0.1
0.01
35
34
33
32
31
t = 0.4 ms
0.001
25
30
35
40
45
30
-100
0
100
200
Junction Temperature, TJ (°C)
Reverse Voltage, VZ (V)
Figure 21.
SJPZ-N33 Typical Characteristics: IZ vs. VZ
Figure 22.
SJPZ-N33 Typical Characteristics: VZ vs. TJ
SJPZ-N-DSE Rev.1.2
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SJPZ-N Series
SJPZ-N40 Rating and Characteristic Curves
10000
Peak Surge Power Capability, PRSM (W)
2.5
Power Dissipation, PD (W)
2.0
1.5
1.0
0.5
1000
100
0.0
0
25
50
75
100
125
10
150
0.1
Ambient Temperature, TA (°C)
Figure 23.
1
10
100
Pulse Width, tW (ms)
SJPZ-N40 Power Dissipation Curves(13)
Figure 24.
SJPZ-N40 Peak Surge Reverse Power
Capability(14)
1000
Thermal Resistance (°C/W)
Between junction and ambient air
100
10
Between junction and lead
1
0.1
10 m
100 m
1
10
100
1000
Pulse Width (s)
Figure 25.
SJPZ-N40 Typical Transient Thermal Resistance(15)
(13)
See Figure 1 for the measurement conditions of the lead temperature.
tW is single block pulse..
(15)
See Figure 1 for the measurement conditions of the lead temperature.
(14)
SJPZ-N-DSE Rev.1.2
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© SANKEN ELECTRIC CO., LTD. 2016
11
SJPZ-N Series
10
1.E-03
TA = 150 °C
Reverse Current, IR (A)
Forward Current, IF (A)
1.E-04
1
0.1
TA = 100 °C
TA = 25 °C
0.01
TA = −55 °C
1.E-05
1.E-06
TA = 150 °C
1.E-07
0.001
1.E-08
0.0
0.5
1.0
1.5
2.0
0
5
Forward Voltage, VF (V)
Figure 26.
10
15
20
25
30
Reverse Voltage, VR (V)
SJPZ-N40 Typical Characteristics: IF vs. VF
Figure 27.
10
SJPZ-N40 Typical Characteristics: IR vs. VR
46
1
Breakdown Voltage, VZ (V)
Reverse Current, IZ (A)
45
0.1
0.01
t = 0.4 ms
40
45
50
43
42
41
40
39
38
37
0.001
35
44
55
36
-100
SJPZ-N40 Typical Characteristics: IZ vs. VZ
100
200
Junction Temperature, TJ (°C)
Reverse Voltage, VZ (V)
Figure 28.
0
Figure 29.
SJPZ-N40 Typical Characteristics: VZ vs. TJ
SJPZ-N-DSE Rev.1.2
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SJPZ-N Series
Physical Dimensions
● SJP
2.15
0.05
+0.1
-0.2
+0.1
-0.05
2.6±0.2
4.5±0.2
1.3±0.4
2.0min.
1.5±0.2
1.3±0.4
+0.4
5.0 -0.1
NOTES:
-
Dimensions in millimeters
Bare lead frame: Pb-free (RoHS compliant)
When soldering the products, be sure to minimize the working time, within the following limits:
MSL: JEDEC LEVEL1
When soldering the products, it is required to minimize the working time, within the following limits:
Flow: 260 ± 5 °C / 10 ± 1 s, 2 times
Soldering Iron: 380 ± 10 °C / 3.5 ± 0.5 s, 1 time
● SJP Land Pattern Example
2.0
2.0
4.0~4.2
NOTE:
- Dimensions in millimeters
SJPZ-N-DSE Rev.1.2
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13
SJPZ-N Series
Marking Diagram
Cathode Mark
Specific Device Code (See Table 1)
YMDD
Lot Number:
Y is the last digit of the year of manufacture (0 to 9)
M is the month of the year (1 to 9, O, N or D)
DD is the day of the month (01 to 31)
Table 1. Specific Device Code
Specific Device Code
Part Number
ZN18
SJPZ-N18
ZN27
SJPZ-N27
ZN33
SJPZ-N33
ZN40
SJPZ-N40
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SJPZ-N Series
Important Notes
● All data, illustrations, graphs, tables and any other information included in this document as to Sanken’s products listed herein (the
“Sanken Products”) are current as of the date this document is issued. All contents in this document are subject to any change
without notice due to improvement of the Sanken Products, etc. Please make sure to confirm with a Sanken sales representative
that the contents set forth in this document reflect the latest revisions before use.
● The Sanken Products are intended for use as components of electronic equipment or apparatus (transportation equipment and its
control systems, home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Prior to use of the
Sanken Products, please put your signature, or affix your name and seal, on the specification documents of the Sanken Products
and return them to Sanken. If considering use of the Sanken Products for any applications that require higher reliability (traffic
signal control systems or equipment, disaster/crime alarm systems, etc.), you must contact a Sanken sales representative to discuss
the suitability of such use and put your signature, or affix your name and seal, on the specification documents of the Sanken
Products and return them to Sanken, prior to the use of the Sanken Products. The Sanken Products are not intended for use in any
applications that require extremely high reliability such as: aerospace equipment; nuclear power control systems; and medical
equipment or systems, whose failure or malfunction may result in death or serious injury to people, i.e., medical devices in Class
III or a higher class as defined by relevant laws of Japan (collectively, the “Specific Applications”). Sanken assumes no liability or
responsibility whatsoever for any and all damages and losses that may be suffered by you, users or any third party, resulting from
the use of the Sanken Products in the Specific Applications or in manner not in compliance with the instructions set forth herein.
● In the event of using the Sanken Products by either (i) combining other products or materials therewith or (ii) physically,
chemically or otherwise processing or treating the same, you must duly consider all possible risks that may result from all such
uses in advance and proceed therewith at your own responsibility.
● Although Sanken is making efforts to enhance the quality and reliability of its products, it is impossible to completely avoid the
occurrence of any failure or defect in semiconductor products at a certain rate. You must take, at your own responsibility,
preventative measures including using a sufficient safety design and confirming safety of any equipment or systems in/for which
the Sanken Products are used, upon due consideration of a failure occurrence rate or derating, etc., in order not to cause any human
injury or death, fire accident or social harm which may result from any failure or malfunction of the Sanken Products. Please refer
to the relevant specification documents and Sanken’s official website in relation to derating.
● No anti-radioactive ray design has been adopted for the Sanken Products.
● No contents in this document can be transcribed or copied without Sanken’s prior written consent.
● The circuit constant, operation examples, circuit examples, pattern layout examples, design examples, recommended examples, all
information and evaluation results based thereon, etc., described in this document are presented for the sole purpose of reference of
use of the Sanken Products and Sanken assumes no responsibility whatsoever for any and all damages and losses that may be
suffered by you, users or any third party, or any possible infringement of any and all property rights including intellectual property
rights and any other rights of you, users or any third party, resulting from the foregoing.
● All technical information described in this document (the “Technical Information”) is presented for the sole purpose of reference
of use of the Sanken Products and no license, express, implied or otherwise, is granted hereby under any intellectual property
rights or any other rights of Sanken.
● Unless otherwise agreed in writing between Sanken and you, Sanken makes no warranty of any kind, whether express or implied,
including, without limitation, any warranty (i) as to the quality or performance of the Sanken Products (such as implied warranty
of merchantability, or implied warranty of fitness for a particular purpose or special environment), (ii) that any Sanken Product is
delivered free of claims of third parties by way of infringement or the like, (iii) that may arise from course of performance, course
of dealing or usage of trade, and (iv) as to any information contained in this document (including its accuracy, usefulness, or
reliability).
● In the event of using the Sanken Products, you must use the same after carefully examining all applicable environmental laws and
regulations that regulate the inclusion or use of any particular controlled substances, including, but not limited to, the EU RoHS
Directive, so as to be in strict compliance with such applicable laws and regulations.
● You must not use the Sanken Products or the Technical Information for the purpose of any military applications or use, including
but not limited to the development of weapons of mass destruction. In the event of exporting the Sanken Products or the Technical
Information, or providing them for non-residents, you must comply with all applicable export control laws and regulations in each
country including the U.S. Export Administration Regulations (EAR) and the Foreign Exchange and Foreign Trade Act of Japan,
and follow the procedures required by such applicable laws and regulations.
● Sanken assumes no responsibility for any troubles, which may occur during the transportation of the Sanken Products including
the falling thereof, out of Sanken’s distribution network.
● Although Sanken has prepared this document with its due care to pursue the accuracy thereof, Sanken does not warrant that it is
error free and Sanken assumes no liability whatsoever for any and all damages and losses which may be suffered by you resulting
from any possible errors or omissions in connection with the contents included herein.
● Please refer to the relevant specification documents in relation to particular precautions when using the Sanken Products, and refer
to our official website in relation to general instructions and directions for using the Sanken Products.
● All rights and title in and to any specific trademark or tradename belong to Sanken or such original right holder(s).
DSGN-AEZ-16002
SJPZ-N-DSE Rev.1.2
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15