SLA4061
NPN Darlington
Absolute maximum ratings
(Ta=25°C)
With built-in flywheel diode
Ratings
Unit
Symbol
VCBO
VCEO
VEBO
IC
ICP
IB
IF
IFSM
VR
120
120
6
5
8 (PW≤1ms, Du≤50%)
0.5
5 (PW≤0.5ms, Du≤25%)
8 (PW≤10ms, single)
120
5 (Ta=25°C)
25 (Tc=25°C)
1000 (Between fin and lead pin, AC)
150
–40 to +150
5
V
V
V
A
A
A
A
A
V
ICBO
IEBO
VCEO
hFE
VCE(sat)
VBE(sat)
ton
tstg
tf
VR
VF
IR
trr
fo
IC-VCE Characteristics (Typical)
hFE-IC Characteristics (Typical)
mA
20000
0.5mA
IR=10µA
IF=1A
VR=120V
IF=±100mA
typ
5000
en
3
m
500
3
4
VCE(sat)-IC Temperature Characteristics (Typical)
500
0°
–3
100
100
50
50
20
0.02
5
ec
o
VCE (V)
m
2
hFE
hFE
IC (A)
1
°C
25
=1
Ta °C
5
7 C
°
25
1000
1000
2
(VCE=2V)
20000
5000
0.4mA
0.05
0.5
0.1
1
20
0.02
5
0.05
C
0.1
0.5
1
5
IC (A)
IC (A)
VCE(sat)-IB Characteristics (Typical)
IC-VBE Temperature Characteristics (Typical)
(IC / IB=1000)
(VCE=2V)
5
3
R
IC=5A
2
IC=3A
1
–30°C
25°C
75°C
3
Ta=
N
Ta=–30°C
2
IC (A)
VCE (sat) (V)
ot
4
125
°C
75°C
25°C
2
VCE (sat) (V)
Conditions
V
V
µA
ns
10000
de
I B= 2
10000
4
1
Unit
hFE-IC Temperature Characteristics (Typical)
(VCE=2V)
0.6mA
d
1mA 0.8mA 0.7mA
1
(Ta=25°C)
D
R1: 2.5kΩ typ R2: 200Ω typ
Characteristic curves
0
0
VCC 30V,
IC=3A,
IB1=–IB2=3mA
ew
7
5
IC=3A, IB=3mA
rN
R1 R2
6
VCB=120V
VEB=6V
IC=25mA
VCE=2V, IC=3A
ns
Symbol
Vrms
°C
°C
°C/W
12
8
5
IC=1A
125°C
1
0
0.5
1
0
0.2
5
IC (A)
0.5
θ j-a-PW Characteristics
1
5
10
IB (mA)
0
0
50
PT-Ta Characteristics
20
µs
100
5
10
k
10
0×
tsin
Without Heatsink
ea
5
1
eH
PT (W)
init
θ j–a (°C / W)
Inf
ms
ith
10
0×
s
1m
W
15
10
1
3
Safe Operating Area (SOA)
With Silicone Grease
Natural Cooling
Heatsink: Aluminum
in mm
20
5
2
10
25
10
1
VBE (V)
IC (A)
1
Conditions
µA
mA
V
V
V
µs
µs
µs
Specification
min
typ
max
120
1.2
10
100
10 11
9
4
3
Unit
●Diode for flyback voltage absorption
W
■Equivalent circuit diagram
2
SLA (12-pin)
(Ta=25°C)
Specification
min
typ
max
10
10
120
2000
5000
15000
1.0
1.5
1.6
2.0
0.5
5.5
1.5
es
ig
VISO
Tj
Tstg
θ j-c
•••
Electrical characteristics
Symbol
PT
External dimensions A
0.5
2
50
×50
×2
0.1
Single Pulse
0.05 Without Heatsink
0.5
1
5
10
50 100
PW (mS)
500 1000
0
–40
0
50
Ta (°C)
100
150
0.03 Ta=25°C
3
5
10
50
100
200
VCE (V)
23
Package Type (Dimensions)
• SIP 8 (STA8Pin)
• SIP 10 (STA10Pin)
20.4 max
9.0 ± 0.2
11.3 ± 0.2
b
a
0.5 ± 0.15
ns
C1.5 ± 0.5
1
E
8
+0.2
‒0.1
ew
10.2 ± 0.2
+0.2
‒0.1
*
1.15
*
14 ×P2.03 ± 0.7= 28.42 ±1.0
de
en
m
R
ot
1.45
± 0.15
* 4.0
• SIP 15 with Fin (SLA15Pin)
φ 3.2 ±
31.3 ± 0.2
0.15
φ 3.2 ± 0.15×3.8
31.0 ± 0.2
16.4
± 0.2
N
11 × P2.54 ± 0.7= 27.94 ± 1.0
1.7 ± 0.1
13.0 ± 0.2
9.9 ± 0.2
2.45 ±
R-End
+0.2
0.55
4.8 ± 0.2
± 0.2
1.7 ± 0.1
± 0.2
12
0.85 ‒0.1
± 0.7
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
24.4 ± 0.2
0.65 ‒0.1
+0.2
± 0.15
+0.2
0.55 ‒0.1
+0.2
‒0.1
b
Pin1
2.5 ± 0.2
+1.0
R-End
ec
o
13.0
a
4.8
m
24.4 ± 0.2
± 0.2
2.7
Ellipse
3.2 ± 0.15×3.8
4.0 ± 0.2
D
1.2
± 0.1
a: Part Number
b: Lot No.
31.0
8 9 10
B C E
d
0.55
27.94
± 0.2
7
C
b
0.65
+0.2
0.85 ‒0.1
31.5max
6
B
a
fo
1.46 ± 0.15
• SIP 12 with Fin (SLA12Pin)
5
C
rN
2.4
a
(10.4)
10.2 ± 0.2
2.5 ± 0.2
2.54
16.0± 0.2
4
B
31.0 ± 0.2
4.0 ± 0.2
b
9.5min
3
C
• SIP 15 (SMA15Pin)
31.0 ± 0.2
1.2
2
B
9.7 ‒0.5
7
(3.0) 6.7 ± 0.5
6
+0.2
‒0.1
a: Part Number
b: Lot No.
2.2
± 0.7
*
14 ×P2.03
± 0.7
*
+0.2
=28.42
± 1.0
1.15 ‒0.1
0.2
+1.0
5
9.7 ‒0.5
4
16.0
Pin No.
3
es
ig
4.0 ± 0.2
2
(3.0) 6.7 ± 0.5
1.2 ± 0.2
0.5 ± 0.15
7 ×P2.54 = 17.78
• SIP 12 (SMA12Pin)
φ 3.2
a: Part Number
b: Lot No.
9 × 2.54 = 22.86 ± 0.25
C1.5 ± 0.5
1
± 0.15
(2.54)
0.5 ± 0.15
(2.54)
0.5 ± 0.15
4.0 ± 0.2
1.0 ± 0.25
1.0 ± 0.25
1.2 ± 0.2
4.7 ± 0.5
4.7 ± 0.5
9.0 ± 0.2
11.3 ± 0.2
2.5 max
2.3 ± 0.2
25.25 ± 0.2
+0.2
0.55 ‒0.1
* 4.0 ± 0.7
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
• SIP 21 with Fin (SLA21Pin)
31.0 ± 0.2
24.4 ± 0.2
16.4 ± 0.2
φ 3.2 ± 0.15× 3.8
4.8 ±
1.7 ±
17.9 ±
(5)
b
12.9 ± 0.2
a
16± 0.2
0.15
9.9 ± 0.2
φ 3.2 ±
0.6
Gate burr
0.2
0.1
2.45 ±
0.2
4‒(R1)
+0.2
0.5
0.65 ‒0.1
3±
20 ×P1.43± 0.5 =28.6± 1.0
31.3 ± 0.2
1
190
2
Transistors
3
4
5
6
7
9 11 13 15 17 19 21
8 10 12 14 16 18 20
a: Part Number
b: Lot No.
+0.2
0.55 ‒0.1
4
± 0.7
(Unit:mm)
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