SMA6821MHLF2452

250 V to 600 V, 1.5 A to 2.5 A High Voltage 3-phase Motor Driver ICs SLA/SMA6820MH Series Data Sheet Description Packages SLA/SMA6820MH series are high voltage 3-phase motor driver ICs in which transistors, pre-driver ICs (MICs), and bootstrap circuits (diodes and resistors) are highly integrated. You can select from the fully-molded type or the heatsink-type ZIP24 package according to your mounting condition. SLA/SMA6820MH series are optimal for the inverting control of small to middle power motors. ZIP24 Fully Molded Type (SMA682xMH) Features ● Built-in Bootstrap Diodes with Current Limmiting Resistors (22 Ω) ● CMOS-compatible Input (3.3 or 5 V) ● Fault Signal Output (FO pin) ● 7.5 V Regurator Output ● Bare lead frame: Pb-free (RoHS compliant) ● Protections Undervoltage Lockout for Power Supply High-side (UVLO_VB): Auto-restart Low-side (UVLO_VCC): Auto-restart Thermal Detection (TD): Fault Signal Output Heatsink Type (SLA6826MH) LF No. 2451 LF No. 2175 LF No. 2452 LF No. 2171 Not to scale Selection Guide Typical Application VD 3 1 CBOOT1 VCC HIN3 HIN2 HIN1 VCC1 5 2 VB2 COM1 HIN3 HIN2 HIN1 4 VB3 Controller VREG 6 7 8 9 CBOOT2 CBOOT3 10VBB1 11VBB2 VDC ● Output Charactaristic VDSS IO 16 250 V 24 U 2.0 A MIC LIN3 LIN2 LIN1 COM2 LIN3 LIN2 LIN1 5V RFO Fault 18 19 20 21 FO 22 VCC2 23 13 V M 500 V W1 12 14 W2 600 V Part Number SMA682xMH SLA6826MH Part Number SLA6826MH SMA6821MH 1.5 A SMA6822MH 2.5 A SMA6823MH 1.5 A SMA6824MH CSB CDC Applications 15 LS2 17 LS1 CFO RS GND ● Packages Package Fully Molded Type Heatsink Type VB1 ● ● ● ● Washing Machine Fan Motor and Pump Motor Air Conditioner Fan Motor Air Cleaner Fan Motor Fan Motor for Electric Stand Fan SLA/SMA6820MH-DSE Rev.2.0 SANKEN ELECTRIC CO., LTD. Dec. 12, 2016 http://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2013 1 SLA/SMA6820MH Series Contents Description ------------------------------------------------------------------------------------------------------ 1 Contents --------------------------------------------------------------------------------------------------------- 2 1. Absolute Maximum Ratings----------------------------------------------------------------------------- 3 2. Recommended Operating Conditions ----------------------------------------------------------------- 4 3. Electrical Characteristics -------------------------------------------------------------------------------- 4 3.1. Characteristics of Control Parts------------------------------------------------------------------ 4 3.2. Bootstrap Diode Characteristics ----------------------------------------------------------------- 5 3.3. Thermal Resistance Characteristics ------------------------------------------------------------- 5 3.4. Transistor Characteristics ------------------------------------------------------------------------- 6 3.4.1. SLA6826MH ----------------------------------------------------------------------------------- 6 3.4.2. SMA6821MH ----------------------------------------------------------------------------------- 7 3.4.3. SMA6822MH ----------------------------------------------------------------------------------- 7 3.4.4. SMA6823MH ----------------------------------------------------------------------------------- 8 3.4.5. SMA6824MH ----------------------------------------------------------------------------------- 8 4. Truth Table ------------------------------------------------------------------------------------------------- 9 5. Block Diagram ------------------------------------------------------------------------------------------- 10 6. Pin Configuration Definitions------------------------------------------------------------------------- 11 7. Typical Application ------------------------------------------------------------------------------------- 12 8. Timing Chart in Protection Operation -------------------------------------------------------------- 13 9. Physical Dimensions ------------------------------------------------------------------------------------ 15 9.1. ZIP24 (Fully Molded Type) --------------------------------------------------------------------- 15 9.2. ZIP24 (Heatsink Type) --------------------------------------------------------------------------- 16 10. Marking Diagrams -------------------------------------------------------------------------------------- 17 10.1. ZIP24 (Full Molded Type) ----------------------------------------------------------------------- 17 10.2. ZIP24 (Heatsink Type) --------------------------------------------------------------------------- 17 Important Notes ---------------------------------------------------------------------------------------------- 18 SLA/SMA6820MH-DSE Rev.2.0 SANKEN ELECTRIC CO., LTD. Dec. 12, 2016 http://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2013 2 SLA/SMA6820MH Series 1. Absolute Maximum Ratings Current polarities are defined as follows: a current flow going into the IC (sinking) is positive current (+); and a current flow coming out of the IC (sourcing) is negative current (−). Unless specifically noted, TA = 25°C, COM1 = COM2 that is called COM. Characteristic Symbol Conditions Rating Unit Remarks SLA6826MH 250 SMA6821MH ID = 100 μA SMA6822MH V MOSFET Breakdown Voltage VDSS 500 VINx = 0 V SMA6823MH 600 SMA6824MH VCC1–COM Logic Supply Voltage VCC 20 V VCC2–COM VB1–U Bootstrap Supply Voltage VBS VB2–V 20 V VB3–W1 SMA6822MH 1.5 SMA6824MH SLA6826MH Output Current (DC) IO TC = 25 °C A 2.0 SMA6821MH 2.5 SMA6823MH SMA6822MH 2.25 SMA6824MH TC = 25 °C, SLA6826MH Output Current (Pulse) IOP A PW ≤ 100 μs, 3.0 SMA6821MH Duty = 1% 3.75 SMA6823MH Regulator Output Current IREG Input Voltage VIN HIN1–COM HIN2–COM HIN3–COM LIN1–COM LIN2–COM LIN3–COM Power Dissipation PD TC = 25 °C 35 mA −0.5 to 7 V 28 32 W TC(OP) −30 to 100 °C Junction Temperature Tj 150 °C Storage Temperature Tstg −40 to 150 °C Operating Case Temperature SLA/SMA6820MH-DSE Rev.2.0 SANKEN ELECTRIC CO., LTD. Dec. 12, 2016 http://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2013 SMA682xMH SLA6826MH 3 SLA/SMA6820MH Series 2. Recommended Operating Conditions Unless specifically noted, TA = 25°C, COM1 = COM2 that is called COM. Characteristic Symbol Conditions Min. Typ. Main Supply Voltage VDC VBB–LS1 VBB–LS2 Max. Unit — 150 200 V — 300 400 V — 300 450 V 13.5 — 16.5 V 1.5 — — Μs Logic Supply Voltage VCC Dead Time of Input Signal tDEAD VCC1–COM VCC2–COM TJ = −25 to 150 °C tIN_MIN(ON) TJ = −25 to 150 °C 0.5 — — μs tIN_MIN(OFF) TJ = −25 to 150 °C 0.5 — — μs Minimum Input Pulse Width 3. Remarks SLA6826MH SMA6821MH SMA6822MH SMA6823MH SMA6824MH Electrical Characteristics Current polarities are defined as follows: a current flow going into the IC (sinking) is positive current (+); and a current flow coming out of the IC (sourcing) is negative current (−). Unless specifically noted, VCC = 15 V, TA = 25°C, COM1 = COM2 that is called COM. 3.1. Characteristics of Control Parts Characteristic Logic Supply Current Input Voltage Input Current Symbol Min. Typ. Max. Unit — 4 6 mA VIH — 2.0 2.5 V VIL 1.0 1.5 — V VHYS — 0.5 — V ICC IREG = 0 A IIH INx = 5 V — 50 100 μA IIL INx = 0 V — — 2 μA 9.0 10.0 11.0 V 9.5 10.5 11.5 V — 0.5 — V 10.0 11.0 12.0 V 10.5 11.5 12.5 V VUV_HYS — 0.5 — V VFOL 0 — 1.0 V VFOH 4.0 — 5.5 V 135 150 165 °C 105 120 135 °C — 30 — °C 6.75 7.5 8.25 V VUVHL Undervoltage Lockout for Power Supply (High side) Conditions VUVHH VUV_HYS VB1–U VB2–V VB3–W1 VUVLL Undervoltage Lockout for Power Supply (Low side) FO Pin Output Voltage VUVLH VCC1–COM VCC2–COM TDH Thermal Detection Threshold Temperature TDL IREG = 0 mA, No heatsink TD_HYS Regulator Output Voltage VREG IREG = 0 to 35 mA SLA/SMA6820MH-DSE Rev.2.0 SANKEN ELECTRIC CO., LTD. Dec. 12, 2016 http://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2013 Remarks All transistors on state. All transistors off state. 4 SLA/SMA6820MH Series 3.2. Bootstrap Diode Characteristics Characteristic Bootstrap Diode Forward Voltage Bootstrap Diode Leakage Current Bootstrap Diode Series Resistor 3.3. Symbol VFB ILBD Conditions Min. Typ. Max. Unit IFB = 0.15 A — 1.1 1.3 V VR = 250 V — — 10 VR = 500 V — — 10 VR = 600 V — — 10 17.6 22.0 26.4 Ω Min. Typ. Max. Unit — — 4.46 — — 3.8 — — 31.25 RB μA Remarks SLA6826MH SMA6821MH SMA6822MH SMA6823MH SMA6824MH Thermal Resistance Characteristics Characteristic Symbol Conditions Junction-to-Case Thermal Resistance RJ-C All transistors operation Junction-to-Ambient Thermal Resistance RJ-A All transistors operation SLA/SMA6820MH-DSE Rev.2.0 SANKEN ELECTRIC CO., LTD. Dec. 12, 2016 http://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2013 °C/W °C/W Remarks SMA682xMH SLA6826MH SMA682xMH 5 SLA/SMA6820MH Series 3.4. Transistor Characteristics Figure 3-1 shows the definition of switching characteristics. IN trr toff ton td(off) td(on) 90% VDS 90% 10% ID Figure 3-1. 3.4.1. tf tr 10% Switching Characteristics Definitions SLA6826MH Characteristic Min. Typ. Max. Unit VDS = 250 V, VIN = 0 V — — 100 µA RDS(ON) ID = 1.0 A, VIN = 5 V — 1.25 1.5 Ω VSD ISD = 1.0 A, VIN = 0 V — 1.1 1.5 V — 65 — ns — 430 — ns — 55 — ns td(off) — 355 — ns Fall Time tf — 20 — ns Low-side Switching Source-to-Drain Diode Reverse Recovery Time Turn-on Delay Time trr — 65 — ns — 505 — ns — 60 — ns — 495 — ns — 20 — ns Drain-to-Source Leakage Current Drain-to-Source Saturation Voltage Source-to-Drain Diode Forward Voltage High-side Switching Source-to-Drain Diode Reverse Recovery Time Turn-on Delay Time Rise Time Turn-off Delay Time Rise Time Turn-off Delay Time Fall Time Symbol IDSS Conditions trr td(on) tr td(on) tr td(off) VDC = 150 V, ID = 2.0 A, VIN = 0 ~ 5 V, TJ = 25 °C, inductive load VDC = 150 V, ID = 2.0 A, VIN = 0 ~ 5 V, TJ = 25 °C, inductive load tf SLA/SMA6820MH-DSE Rev.2.0 SANKEN ELECTRIC CO., LTD. Dec. 12, 2016 http://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2013 6 SLA/SMA6820MH Series 3.4.2. SMA6821MH Characteristic Min. Typ. Max. Unit VDS = 250 V, VIN = 0 V — — 100 µA RDS(ON) ID = 1.0 A, VIN = 5 V — 1.25 1.5 Ω VSD ISD = 1.0 A, VIN = 0 V — 1.1 1.5 V — 65 — ns — 430 — ns — 55 — ns td(off) — 355 — ns Fall Time tf — 20 — ns Low-side Switching Source-to-Drain Diode Reverse Recovery Time Turn-on Delay Time trr — 65 — ns — 505 — ns — 60 — ns — 495 — ns — 20 — ns Min. Typ. Max. Unit Drain-to-Source Leakage Current Drain-to-Source Saturation Voltage Source-to-Drain Diode Forward Voltage High-side Switching Source-to-Drain Diode Reverse Recovery Time Turn-on Delay Time Rise Time IDSS Rise Time td(on) td(on) tr Turn-off Delay Time Fall Time Conditions trr tr Turn-off Delay Time 3.4.3. Symbol td(off) VDC = 150 V, ID = 2.0 A, VIN = 0 ~ 5 V, TJ = 25 °C, inductive load VDC = 150 V, ID = 2.0 A, VIN = 0 ~ 5 V, TJ = 25 °C, inductive load tf SMA6822MH Characteristic Drain-to-Source Leakage Current Drain-to-Source Saturation Voltage Source-to-Drain Diode Forward Voltage High-side Switching Source-to-Drain Diode Reverse Recovery Time Turn-on Delay Time Symbol Conditions IDSS VDS = 500 V, VIN = 0 V — — 100 µA RDS(ON) ID = 0.75 A, VIN = 5 V — 3.2 4.0 Ω VSD ISD = 0.75 A, VIN = 0 V — 1.1 1.5 V — 120 — ns — 485 — ns — 85 — ns td(off) — 420 — ns Fall Time tf — 30 — ns Low-side Switching Source-to-Drain Diode Reverse Recovery Time Turn-on Delay Time trr — 130 — ns — 620 — ns — 100 — ns td(off) — 585 — ns tf — 25 — ns Rise Time Turn-off Delay Time Rise Time Turn-off Delay Time Fall Time trr td(on) tr td(on) tr VDC = 300 V, ID = 1.5 A, VIN = 0 ~ 5 V, TJ = 25 °C, inductive load VDC = 300 V, ID = 1.5 A, VIN = 0 ~ 5 V, TJ = 25 °C, inductive load SLA/SMA6820MH-DSE Rev.2.0 SANKEN ELECTRIC CO., LTD. Dec. 12, 2016 http://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2013 7 SLA/SMA6820MH Series 3.4.4. SMA6823MH Characteristic Drain-to-Source Leakage Current Drain-to-Source Saturation Voltage Source-to-Drain Diode Forward Voltage High-side Switching Source-to-Drain Diode Reverse Recovery Time Turn-on Delay Time Symbol Conditions Min. Typ. Max. Unit IDSS VDS = 500 V, VIN = 0 V — — 100 µA RDS(ON) ID = 1.25 A, VIN = 5 V — 2.0 2.4 Ω VSD ISD = 1.25 A, VIN = 0 V — 1.1 1.5 V — 170 — ns — 700 — ns — 165 — ns td(off) — 580 — ns Fall Time tf — 40 — ns Low-side Switching Source-to-Drain Diode Reverse Recovery Time Turn-on Delay Time trr — 170 — ns — 800 — ns — 180 — ns td(off) — 690 — ns tf — 35 — ns Min. Typ. Max. Unit Rise Time td(on) tr Turn-off Delay Time Rise Time td(on) tr Turn-off Delay Time Fall Time 3.4.5. trr VDC = 300 V, ID = 2.5 A, VIN = 0 ~ 5 V, TJ = 25 °C, inductive load VDC = 300 V, ID = 2.5 A, VIN = 0 ~ 5 V, TJ = 25 °C, inductive load SMA6824MH Characteristic Drain-to-Source Leakage Current Drain-to-Source Saturation Voltage Source-to-Drain Diode Forward Voltage High-side Switching Source-to-Drain Diode Reverse Recovery Time Turn-on Delay Time Symbol Conditions IDSS VDS = 600 V, VIN = 0 V — — 100 µA RDS(ON) ID = 0.75 A, VIN = 5 V — 2.9 3.5 Ω VSD ISD = 0.75 A, VIN = 0 V — 1.0 1.5 V — 155 — ns — 685 — ns — 115 — ns td(off) — 555 — ns Fall Time tf — 55 — ns Low-side Switching Source-to-Drain Diode Reverse Recovery Time Turn-on Delay Time trr — 155 — ns — 740 — ns — 130 — ns td(off) — 670 — ns tf — 35 — ns Rise Time Turn-off Delay Time Rise Time Turn-off Delay Time Fall Time trr td(on) tr td(on) tr VDC = 300 V, ID = 1.5 A, VIN = 0 ~ 5 V, TJ = 25 °C, inductive load VDC = 300 V, ID = 1.5 A, VIN = 0 ~ 5 V, TJ = 25 °C, inductive load SLA/SMA6820MH-DSE Rev.2.0 SANKEN ELECTRIC CO., LTD. Dec. 12, 2016 http://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2013 8 SLA/SMA6820MH Series 4. Truth Table Table 4-1 is a truth table that provides the logic level definitions of operation modes. In the case where HINx and LINx signals in each phase are high at the same time, both the high-side and low-side transistors are set on (simultaneous on-state). You must set the input signals so that the simultaneous on-state is not occuerd. After recovering from a UVLO_VCC condition, the high-side and low-side transistors resume switching according to the input logic levels of the next HINx and LINx signals (level-triggered). After recovering from a UVLO_VB condition, the high-side transistors resume switching at the next rising edge of an HIN signal (edge-triggered). Table 4-1. Truth Table for Operation Modes Mode Normal Operation High-side Undervoltage Lockout for Power Supply (UVLO_VB) Low-side Undervoltage Lockout for Power Supply (UVLO_VCC) Thermal Detection (TD) HINx L H L H L H L H L H L H L H L H LINx L L H H L L H H L L H H L L H H High-side Transistors OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF OFF OFF ON OFF ON SLA/SMA6820MH-DSE Rev.2.0 SANKEN ELECTRIC CO., LTD. Dec. 12, 2016 http://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2013 Low-side Transistors OFF OFF ON ON OFF OFF ON ON OFF OFF OFF OFF OFF OFF ON ON 9 SLA/SMA6820MH Series 5. Block Diagram Bootstrap Diode RB VD VB1 1 VB2 2 VB3 4 3 10 VBB1 VCC1 11 VBB2 5 UVLO UVLO HIN1 HIN2 HIN3 9 8 7 COM1 6 Input Logic UVLO UVLO High-side Level Shift Driver 12 W1 14 W2 13 V VCC2 23 VREG 16 LIN1 20 LIN2 19 LIN3 18 COM2 21 24 U 7.5 V Regulator UVLO Input Logic Low-side Driver Thermal Detection 15 LS2 17 LS1 FO 22 SLA/SMA6820MH-DSE Rev.2.0 SANKEN ELECTRIC CO., LTD. Dec. 12, 2016 http://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2013 10 SLA/SMA6820MH Series 6. Pin Configuration Definitions SMA682xMH SLA6826MH Branding Area Branding Area 1 24 1 24 Pin Number Pin Name Functions 1 VB1 U-phase high-side floating supply voltage input 2 VB2 V-phase high-side floating supply voltage input 3 VD Anode of bootstrap diodes 4 VB3 W-phase high-side floating supply voltage input 5 VCC1 High side logic supply voltage input 6 COM1 High side logic ground 7 HIN3 Logic input for W-phase high-side gate driver 8 HIN2 Logic input for V-phase high-side gate driver 9 HIN1 Logic input for U-phase high-side gate driver 10 VBB1 Positive DC bus supply voltage (be connected toVBB2 by PCB trace) 11 VBB2 Positive DC bus supply voltage (be connected toVBB2 by PCB trace) 12 W1 13 V 14 W2 W-phase output (be connected toW1 by PCB trace) 15 LS2 U and V-phase power MOSFET Source (be connected toLS1 by PCB trace) 16 VREG 17 LS1 W-phase power MOSFET Source (be connected toLS2 by PCB trace) 18 LIN3 Logic input for W-phase low-side gate driver 19 LIN2 Logic input for V-phase low-side gate driver 20 LIN1 Logic input for U-phase low-side gate driver 21 COM2 22 FO 23 VCC2 24 U W-phase output (be connected toW2 by PCB trace) V-phase output Regulator output Low side logic ground Fault signal output for thermal detection and UVLO, active high Low side logic supply voltage input U-phase output SLA/SMA6820MH-DSE Rev.2.0 SANKEN ELECTRIC CO., LTD. Dec. 12, 2016 http://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2013 11 SLA/SMA6820MH Series 7. Typical Application Capacitors should be place near the IC. If the circuit noise is large, connect the noise reduction ceramic capacitor to the electrolytic capacitor in parallel. Pull down resistance (about 100 kΩ) is built-in the HINx pin and the LINx pin. If the unstable signal or noisy signal may be input, connect the resistor in external to the HINx pin and the LINx pin. VD 3 1 VB1 CBOOT1 VCC HIN3 HIN2 HIN1 VCC1 5 2 VB2 COM1 HIN3 HIN2 HIN1 4 VB3 Controller VREG 6 7 8 9 CBOOT2 CBOOT3 10VBB1 11VBB2 VDC 16 24 U MIC LIN3 LIN2 LIN1 COM2 LIN3 LIN2 LIN1 5V RFO 18 19 20 21 13 V M W1 12 14 W2 FO 22 VCC2 23 Fault CSB CDC 15 LS2 17 LS1 CFO RS GND Figure 7-1. Typical Application SLA/SMA6820MH-DSE Rev.2.0 SANKEN ELECTRIC CO., LTD. Dec. 12, 2016 http://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2013 12 SLA/SMA6820MH Series 8. Timing Chart in Protection Operation HIN UVHH VB-HS UVHL UVLO release HO Figure 8-1. High-side Undervoltage Lockout for Power Supply (UVLO_VB) LIN UVHH VCC UVHL UVLO release LO FO Figure 8-2. Low-side Undervoltage Lockout for Power Supply (UVLO_VCC) SLA/SMA6820MH-DSE Rev.2.0 SANKEN ELECTRIC CO., LTD. Dec. 12, 2016 http://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2013 13 SLA/SMA6820MH Series LIN TDH Tmic TDL LO FO When the FO pin is “L”, a internal transistor that is open collector is on state. Figure 8-3. Thermal Detection (TD) SLA/SMA6820MH-DSE Rev.2.0 SANKEN ELECTRIC CO., LTD. Dec. 12, 2016 http://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2013 14 SLA/SMA6820MH Series 9. 9.1. Physical Dimensions ZIP24 (Fully Molded Type) ● LF No. 2451 31±0.2 4±0.2 23xP1.27±0.6=29.21±0.7 2.2±0.7 0～0.55 0～0.55　 +0.15 0.5 -0.05 (Ends of pins) （先端寸法） 23xP1.27±0.1=(29.21) （根元寸法） (Roots of pins) （根元寸法） ※１ ※４ 2.2 ±0.7 +0.15 0.6 -0.05 1.2±0.1 ※３ ※２ (4.4) 10.2±0.2 +0.15 0.7 -0.05 (End of pin) （先端寸法） Gate burr ゲートバリ ※２ +0.5 3 -0.3 (End of pin) （先端寸法） (Ends of pins) （先端寸法） NOTES: 31.3±0.2 ● Dimensions in millimeters ● Bare lead frame: Pb-free (RoHS compliant) ● Maximum “Gate burr” height: 3 mm 1 3 2 5 4 7 6 9 8 11 13 15 17 19 21 23 10 12 14 16 18 20 22 24 ● LF No. 2452 31 ±0.2 4 ±0.2 ±0.2 Gate burr 　 ゲートバリ 1.2 ±0.1 -0.5 9.5 Ｒ－ｅｎｄ +0.7 10.2 （根元寸法） 0.6 +0.15 0.5 -0.05 ２ ３× Ｐ １． ２７ ± ０． ５ ＝２ ９ ．２ １± ０ ．６ 4.5 （先端寸法） (Ends of pins) 31.3 ±0.15 ±0.5 （先端寸法） (Ends of pins) ±0.2 NOTES: （樹脂バリを含む） 24 ● Dimensions in millimeters ● Bare lead frame: Pb-free (RoHS compliant) ● Maximum “Gate burr” height: 3 mm 1 SLA/SMA6820MH-DSE Rev.2.0 SANKEN ELECTRIC CO., LTD. Dec. 12, 2016 http://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2013 15 SLA/SMA6820MH Series 9.2. ZIP24 (Heatsink Type) (Ends of pins) (End of pin) ● LF No. 2175 (Ends of pins) (Ends of pins) NOTES: Gate burr including ● Dimensions in millimeters ● Bare lead frame: Pb-free (RoHS compliant) ● The recommended screw torque: 58.8~78.4N∙cm (6.0 ~ 8.0 kgf∙cm) ● LF No. 2171 Gate burr (Ends of pins) (Ends of pins) NOTES: Gate burr including ● Dimensions in millimeters ● Bare lead frame: Pb-free (RoHS compliant) ● The recommended screw torque: 58.8~78.4N∙cm (6.0 ~ 8.0 kgf∙cm) SLA/SMA6820MH-DSE Rev.2.0 SANKEN ELECTRIC CO., LTD. Dec. 12, 2016 http://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2013 16 SLA/SMA6820MH Series 10. Marking Diagrams 10.1. ZIP24 (Full Molded Type) The marking diagrams of ZIP24 package is either in follows: JAPAN YMDDX S MA 682 xM H 1 24 Lot Number: Y is the last digit of the year of manufacture (0 to 9) M is the month of the year (1 to 9, O, N, or D) DD is the day of the month (01 to 31) X is the control number Part Number YMDDXXXX S MA 682 xM H 1 24 Lot Number: Y is the last digit of the year of manufacture (0 to 9) M is the month of the year (1 to 9, O, N, or D) DD is the day of the month (01 to 31) XXXX is the control number Part Number 10.2. ZIP24 (Heatsink Type) JAPAN SLA68xxMZ Y MD DX 1 Part Number 24 Lot Number: Y is the last digit of the year of manufacture (0 to 9) M is the month of the year (1 to 9, O, N, or D) DD is the day of the month (01 to 31) X is the control number SLA/SMA6820MH-DSE Rev.2.0 SANKEN ELECTRIC CO., LTD. Dec. 12, 2016 http://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2013 17 SLA/SMA6820MH Series Important Notes ● All data, illustrations, graphs, tables and any other information included in this document as to Sanken’s products listed herein (the “Sanken Products”) are current as of the date this document is issued. All contents in this document are subject to any change without notice due to improvement of the Sanken Products, etc. Please make sure to confirm with a Sanken sales representative that the contents set forth in this document reflect the latest revisions before use. ● The Sanken Products are intended for use as components of general purpose electronic equipment or apparatus (such as home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Prior to use of the Sanken Products, please put your signature, or affix your name and seal, on the specification documents of the Sanken Products and return them to Sanken. When considering use of the Sanken Products for any applications that require higher reliability (such as transportation equipment and its control systems, traffic signal control systems or equipment, disaster/crime alarm systems, various safety devices, etc.), you must contact a Sanken sales representative to discuss the suitability of such use and put your signature, or affix your name and seal, on the specification documents of the Sanken Products and return them to Sanken, prior to the use of the Sanken Products. The Sanken Products are not intended for use in any applications that require extremely high reliability such as: aerospace equipment; nuclear power control systems; and medical equipment or systems, whose failure or malfunction may result in death or serious injury to people, i.e., medical devices in Class III or a higher class as defined by relevant laws of Japan (collectively, the “Specific Applications”). Sanken assumes no liability or responsibility whatsoever for any and all damages and losses that may be suffered by you, users or any third party, resulting from the use of the Sanken Products in the Specific Applications or in manner not in compliance with the instructions set forth herein. ● In the event of using the Sanken Products by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or treating the same, you must duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility. ● Although Sanken is making efforts to enhance the quality and reliability of its products, it is impossible to completely avoid the occurrence of any failure or defect in semiconductor products at a certain rate. You must take, at your own responsibility, preventative measures including using a sufficient safety design and confirming safety of any equipment or systems in/for which the Sanken Products are used, upon due consideration of a failure occurrence rate or derating, etc., in order not to cause any human injury or death, fire accident or social harm which may result from any failure or malfunction of the Sanken Products. Please refer to the relevant specification documents and Sanken’s official website in relation to derating. ● No anti-radioactive ray design has been adopted for the Sanken Products. ● No contents in this document can be transcribed or copied without Sanken’s prior written consent. ● The circuit constant, operation examples, circuit examples, pattern layout examples, design examples, recommended examples, all information and evaluation results based thereon, etc., described in this document are presented for the sole purpose of reference of use of the Sanken Products and Sanken assumes no responsibility whatsoever for any and all damages and losses that may be suffered by you, users or any third party, or any possible infringement of any and all property rights including intellectual property rights and any other rights of you, users or any third party, resulting from the foregoing. ● All technical information described in this document (the “Technical Information”) is presented for the sole purpose of reference of use of the Sanken Products and no license, express, implied or otherwise, is granted hereby under any intellectual property rights or any other rights of Sanken. ● Unless otherwise agreed in writing between Sanken and you, Sanken makes no warranty of any kind, whether express or implied, including, without limitation, any warranty (i) as to the quality or performance of the Sanken Products (such as implied warranty of merchantability, or implied warranty of fitness for a particular purpose or special environment), (ii) that any Sanken Product is delivered free of claims of third parties by way of infringement or the like, (iii) that may arise from course of performance, course of dealing or usage of trade, and (iv) as to any information contained in this document (including its accuracy, usefulness, or reliability). ● In the event of using the Sanken Products, you must use the same after carefully examining all applicable environmental laws and regulations that regulate the inclusion or use of any particular controlled substances, including, but not limited to, the EU RoHS Directive, so as to be in strict compliance with such applicable laws and regulations. ● You must not use the Sanken Products or the Technical Information for the purpose of any military applications or use, including but not limited to the development of weapons of mass destruction. In the event of exporting the Sanken Products or the Technical Information, or providing them for non-residents, you must comply with all applicable export control laws and regulations in each country including the U.S. Export Administration Regulations (EAR) and the Foreign Exchange and Foreign Trade Act of Japan, and follow the procedures required by such applicable laws and regulations. ● Sanken assumes no responsibility for any troubles, which may occur during the transportation of the Sanken Products including the falling thereof, out of Sanken’s distribution network. ● Although Sanken has prepared this document with its due care to pursue the accuracy thereof, Sanken does not warrant that it is error free and Sanken assumes no liability whatsoever for any and all damages and losses which may be suffered by you resulting from any possible errors or omissions in connection with the contents included herein. ● Please refer to the relevant specification documents in relation to particular precautions when using the Sanken Products, and refer to our official website in relation to general instructions and directions for using the Sanken Products. ● All rights and title in and to any specific trademark or tradename belong to Sanken or such original right holder(s). DSGN-CEZ-16002 SLA/SMA6820MH-DSE Rev.2.0 SANKEN ELECTRIC CO., LTD. Dec. 12, 2016 http://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2013 18