STR-X6757N

Power IC for Quasi-Resonant Type Switching Power Supply with High Efficiency and Low Noise in Full Load Range STR-X6757N Sep. 2013 ◆ Package ◆ General description Package name: TO-3PF-7L The STR- X6757N is power IC for quasi-resonant type switching power supply, incorporating a power MOSFET and a controller IC. The product achieves high efficiency and low noise power supply systems by the quasi-resonant operation and the bottom-skip quasi-resonant operation. es ig ◆ Specification 500V(MIN), 0.36Ω(MAX) ew D MOSFET rN ◆Application Switching power supplies for  LCD-TVs, PDP-TVs, CRT-TVs and Digital consumer equipment  Home appliances  OA equipments  Industry machines  Communication devices ec o m ◆ Typical application circuit m en de d fo  Multi operation mode The operation mode switching according to load conditions achieves the optimal high efficiency and low noise power supply systems across the full load range.  Current mode control  Built-in PWM oscillator The PWM operates with the minimum frequency of around 22kHz, until the quasi-resonant signal becomes valid, reduces the stress on components at startup and load-shorted.  Built-in soft start function  Step-drive function, reducing switching noise  Input compensation at overcurrent The function reduces the distortion of overcurrent operation point to AC input voltage change by adding three components.  Avalanche energy guaranteed by two chips structure (Simplification of surge absorbing circuit)  Protection functions Overcurrent protection (OCP); Pulse-by-pulse Overload protection (OLP); latched shutdown Overvoltage protection (OVP); latched shutdown ns ◆ Features +B R ErrAmp S1 ot P N GND Standby ON/OFF D VCC 1 D 4 LowB S2 STR-X6700 Reg:ErrAmp：SANKEN　SE　Series Sanken linear regulator IC, etc. 6 SI：SANKEN　Linear Regulator IC FB 2 3 GND 7 5 OCP /BD Standby Out GND Cont. S Reg SI RX SS /OLP CX ROCP Sanken Electric Co., Ltd. 1/11 Power IC for Quasi-Resonant Type Switching Power Supply with High Efficiency and Low Noise in Full Load Range STR-X6757N Sep. 2013 Absolute maximum ratings Pin Symbol Ratings Unit Remark Drain Current 1−2 IDpeak(1) 18 A Single pulse Maximum Switching Current 1−2 IDMAX(2) 18 A Ta=-20 to +125°C Avalanche Energy 1−2 EAS(3) 326 mJ Control Power Supply Voltage 4−3 VCC 35 SS/OLP pin Voltage 5−3 VSSOLP −0.5～6.0 es ig  The polarity value for current specifies a sink as "+," and a source as "−," referencing the IC.  Unless otherwise specified, TA = 25 °C FB pin Inflowing Current 6−3 IFB 10 FB pin Voltage 6−3 VFB OCP/BD pin Voltage 7−3 VOCPBD MOS FET Power Dissipation 1−2 PD1(4) Channel Temperature (1) Single pulse ns VDD= 30V, L=50mH ILpeak=3.53A V mA −0.5～9.0 V −1.5～5.0 V 44 W By infinite radiator 2.8 W No radiator 0.8 W Defined by VCC×ICC Refer to recommended operating temperature rN ew D V − TF −20～+125 °C − TOP −20～+125 °C − Tstg −40～+125 °C − Tch +150 °C en m Storage Temperature m Operating Ambient Temperature PD2(5) de 4−3 fo Control Power Dissipation (MIC) Operating Inner Flame Temperature d Item Within IFB control Refer to MOS FET A.S.O. curve Regarding the maximum switching current The maximum switching current is drain current IC determined by inner drive voltage and MOS FET Vth. (3) Refer to MOS FET Tch-EAS curve (4) Refer to MOS FET Ta-PD1 curve N ot R ec o (2) Sanken Electric Co., Ltd. 2/11 Power IC for Quasi-Resonant Type Switching Power Supply with High Efficiency and Low Noise in Full Load Range STR-X6757N Sep. 2013 Electrical characteristics Electrical characteristics for control part  The polarity value for current specifies a sink as "+," and a source as "−," referencing the IC.  Unless otherwise specified, TA = 25 °C, VCC = 20V 7−3 7−3 Protection Operation Maximum ON time OLP operation threshold voltage V V mA µA kHz V µA V VOCPBD(BS2) −0.485 −0.435 −0.385 V −0.995 −0.940 −0.895 V rN −0.720 −0.665 −0.605 VOCPBD(LIM) 7−3 IOCPBD −250 −100 −40 µA 7−3 VOCPBD(TH1) 0.28 0.40 0.52 V 7−3 VOCPBD(TH2) 0.67 0.80 0.93 V 6−3 6−3 VFB(OFF) IFB(ON) 1.32 600 1.45 1000 1.58 1400 V µA 4−3 VCC(S) 10.3 11.2 12.1 V 4−3 VCC(SK) 1.10 1.35 1.65 V 4−3 ICC(S) − 20 56 µA 6−3 IFB(S) − 4 14 µA 6−3 VFB(S) 0.55 1.10 1.50 V 1−2 tON(MIN) 0.55 1.00 1.35 µs 1−2 5−3 tON(MAX) VSSOLP(OLP) 27.5 4.0 32.5 4.9 39.0 5.8 µs V ISSOLP(OLP) VCC(OVP) ICC(H) −16 25.5 − −11 27.7 45 −6 29.9 140 µA V µA VCC(La.OFF) 6.0 7.2 8.5 V de m m N ot R ec o Stand-by Operation Stand-by operation start voltage Stand-by operation start voltage interval Stand-by non-operation circuit current FB pin sink current (stand-by operation) FB pin threshold voltage (stand-by operation) Minimum ON time 19.9 10.6 6 100 25 1.4 −390 ns VOCPBD(BS1) 18.2 9.7 − − 22 1.2 −550 Unit es ig 7−3 16.3 8.8 − − 19 1.1 −710 D VCC(ON) VCC(OFF) ICC(ON) ICC(OFF) fOSC VSSOLP(SS) ISSOLP(SS) Ratings TYP MAX ew 4−3 4−3 4−3 4−3 1−2 5−3 5−3 MIN fo Symbol en Power supply Start-up Operation Operation start power supply voltage Operation stop power supply voltage Circuit current in operation Circuit current in non-operation Oscillation frequency Soft start operating stop voltage Soft start operating charging current Normal Operation Bottom-skip operation threshold voltage 1 Bottom-skip operation threshold voltage 2 Overcurrent detection threshold voltage OCP/BD pin source current Quasi-resonant operation threshold voltage 1 Quasi-resonant operation threshold voltage 2 FB pin threshold voltage FB pin sink current (Normal operation) Pin d Item Charge current in OLP operation 5−3 OVP operation power supply voltage 4−3 Latch circuit holding current * 4−3 Latch circuit releasing power supply 4−3 voltage * *Latch circuit refers to operation during OVP and OLP. Sanken Electric Co., Ltd. 3/11 Remark Power IC for Quasi-Resonant Type Switching Power Supply with High Efficiency and Low Noise in Full Load Range STR-X6757N Sep. 2013 Electrical characteristics for MOSFET part  Unless otherwise specified, TA = 25 °C, Ratings TYP M A X Pin Symbol Drain-to-Source voltage 1−2 VDSS 650 − − V Drain leak current 1−2 IDSS − − 300 µA ON resistance 1−2 RDS(ON) − − 0.62 Ω Switching time 1−2 tf − − 500 ns − θch−F − − 1.09 Unit °C/W N ot R ec o m m en de d fo rN ew D es ig Thermal resistance MIN Sanken Electric Co., Ltd. 4/11 Remark ns Item ChanneltoInternalframe Power IC for Quasi-Resonant Type Switching Power Supply with High Efficiency and Low Noise in Full Load Range STR-X6757N N ot R ec o m m en de d fo rN ew D es ig ns Sep. 2013 Sanken Electric Co., Ltd. 5/11 Power IC for Quasi-Resonant Type Switching Power Supply with High Efficiency and Low Noise in Full Load Range STR-X6757N N ot R ec o m m en de d fo rN ew D es ig ns Sep. 2013 Sanken Electric Co., Ltd. 6/11 Power IC for Quasi-Resonant Type Switching Power Supply with High Efficiency and Low Noise in Full Load Range STR-X6757N Sep. 2013 Block diagram ４ VCC ＋ Reg& Iconst － S S es ig S R OSC MaxON rN BSD － ＋ BD Bottom Selector ＋ － OCP/BD SS/OLP Counter ７ ５ m en de d Soft Start FB ６ ＋ － － ＋ OCP fo ＋ － OLP ３ ew Q GND ２ D FB R Q S １ Delay Q ns Start Stop Burst OVP R Burst Control D DRIVE Reg Protection latch m Pin function description Symbol 1 D Drain pin MOSFET drain S Source MOSFET source R ec o Pin number N ot 2 Description Function 3 GND Ground pin Ground 4 VCC Power supply pin Input for power supply for control circuit 5 SS/OLP 6 FB 7 OCP/BD Softstart/ overload protection pin Feedback pin OCP input/ Bottom detection pin Sanken Electric Co., Ltd. 7/11 Input for set delay for overload detection and softstart operation Input for constant voltage control and intermittent mode oscillation control signals Input for overcurrent detection and bottom detection signals Power IC for Quasi-Resonant Type Switching Power Supply with High Efficiency and Low Noise in Full Load Range STR-X6757N Sep. 2013 Typical application circuit +B ErrAmp S1 VCC D 4 ew S2 Cont. rN FB 7 GND 5 OCP /BD RX SS /OLP fo S 3 CX N ot R ec o m m en de d ROCP Sanken Electric Co., Ltd. 8/11 GND Standby ON/OFF LowB Reg SI ErrAmp：SANKEN　SE　Series Reg: Sanken linear regulator IC, etc. SI：SANKEN　Linear Regulator IC 6 2 D D 1 es ig ns P Standby Out GND Power IC for Quasi-Resonant Type Switching Power Supply with High Efficiency and Low Noise in Full Load Range STR-X6757N Sep. 2013 Package 3.45±0.2 ns 3.35±0.1 （根元寸法） between roots +0.2 +0.2 +0.2 5-0.65-0.1 0.55 -0.1 rN +0.2 2-0.83-0.1 4xP1.27±0.1=(5.08) （根元寸法） between roots 3.6 ±0.5 （先端寸法） between tips 3 4 5 6 7 0.5 0.5 平面状態図 Planar state m Note 1) 2 m 1 en de d 15.6±0.2 4.3±0.5 （先端寸法） between tips fo 2xP2.54±0.1=(5.08) （根元寸法） between roots ew 0.75 1.89-0.1 R-end (5.8) +0.2 D (2-R1) 1.33-0.1 es ig b SK 3 3.3 a 12.5±0.5 STR 6.7±0.5 23±0.3 φ3.2 6 ±0.2 2 ±0.2 Gate burr ゲートバリ 5.5±0.2 5.5±0.2 ec o part shows the point gate burr (height 0.3 max) occurred R Pin material: Cu Pin treatment: Ni plating and solder dip Product weight (approximate): 6.0g ot Dimensions in millimeters a. Part number b. Lot number X6757N 1st letter：The Last digit of year 2nd letter：Month Jan. to Sep. Arabic number Oct. O Nov. N Dec. D N 3rd & 4th letter：day 01-31 Arabic numbers Sanken Electric Co., Ltd. 9/11 Power IC for Quasi-Resonant Type Switching Power Supply with High Efficiency and Low Noise in Full Load Range STR-X6757N Sep. 2013 OPERATING PRECAUTIONS ns In the case that you use Sanken products or design your products by using Sanken products, the reliability largely depends on the degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general, derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. For these stresses, instantaneous values, maximum values and minimum values must be taken into consideration. In addition, it should be noted that since power devices or IC’s including power devices have large self-heating value, the degree of derating of junction temperature affects the reliability significantly. es ig Because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. ew D Cautions for Storage  Ensure that storage conditions comply with the standard temperature (5 to 35°C) and the standard relative humidity (around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity.  Avoid locations where dust or harmful gases are present and avoid direct sunlight.  Reinspect for rust on leads and solderability of the products that have been stored for a long time. rN Cautions for Testing and Handling When tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between the product pins, and wrong connections. Ensure all test parameters are within the ratings specified by Sanken for the products. m m en de d fo Remarks About Using Silicone Grease with a Heatsink  When silicone grease is used in mounting the products on a heatsink, it shall be applied evenly and thinly. If more silicone grease than required is applied, it may produce excess stress.  Volatile-type silicone greases may crack after long periods of time, resulting in reduced heat radiation effect. Silicone greases with low consistency (hard grease) may cause cracks in the mold resin when screwing the products to a heatsink. Our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the product life, are indicated below: Type Suppliers G746 Shin-Etsu Chemical Co., Ltd. YG6260 Momentive Performance Materials Inc. SC102 Dow Corning Toray Co., Ltd. N ot R ec o Cautions for Mounting to a Heatsink  When the flatness around the screw hole is insufficient, such as when mounting the products to a heatsink that has an extruded (burred) screw hole, the products can be damaged, even with a lower than recommended screw torque. For mounting the products, the mounting surface flatness should be 0.05mm or less.  Please select suitable screws for the product shape. Do not use a flat-head machine screw because of the stress to the products. Self-tapping screws are not recommended. When using self-tapping screws, the screw may enter the hole diagonally, not vertically, depending on the conditions of hole before threading or the work situation. That may stress the products and may cause failures.  Recommended screw torque: 0.588 to 0.785 N･m (6 to 8 kgf･cm).  For tightening screws, if a tightening tool (such as a driver) hits the products, the package may crack, and internal stress fractures may occur, which shorten the lifetime of the electrical elements and can cause catastrophic failure. Tightening with an air driver makes a substantial impact. In addition, a screw torque higher than the set torque can be applied and the package may be damaged. Therefore, an electric driver is recommended. When the package is tightened at two or more places, first pre-tighten with a lower torque at all places, then tighten with the specified torque. When using a power driver, torque control is mandatory. Soldering  When soldering the products, please be sure to minimize the working time, within the following limits: • 260 ± 5 °C 10 ± 1 s (Flow, 2 times) • 380 ± 10 °C 3.5 ± 0.5 s (Soldering iron, 1 time)  Soldering should be at a distance of at least 1.5 mm from the body of the products. Sanken Electric Co., Ltd. 10/11 Power IC for Quasi-Resonant Type Switching Power Supply with High Efficiency and Low Noise in Full Load Range STR-X6757N Sep. 2013 ns Electrostatic Discharge  When handling the products, the operator must be grounded. Grounded wrist straps worn should have at least 1MΩ of resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator.  Workbenches where the products are handled should be grounded and be provided with conductive table and floor mats.  When using measuring equipment such as a curve tracer, the equipment should be grounded.  When soldering the products, the head of soldering irons or the solder bath must be grounded in order to prevent leak voltages generated by them from being applied to the products.  The products should always be stored and transported in Sanken shipping containers or conductive containers, or be wrapped in aluminum foil. IMPORTANT NOTES es ig  The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the latest revision of the document before use. rN ew D  Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or any other rights of Sanken or any third party which may result from its use. Unless otherwise agreed in writing by Sanken, Sanken makes no warranties of any kind, whether express or implied, as to the products, including product merchantability, and fitness for a particular purpose and special environment, and the information, including its accuracy, usefulness, and reliability, included in this document. fo  Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction. m m en de d  Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales representative to discuss, prior to the use of the products herein. The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited. R ec o  When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility.  Anti radioactive ray design is not considered for the products listed herein. N ot  Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken’s distribution network.  The contents in this document must not be transcribed or copied without Sanken’s written consent. Sanken Electric Co., Ltd. 11/11