For Non-Isolated
Off-Line PWM Controllers with Integrated Power MOSFET
STR5A464x Series
Data Sheet
Description
The STR5A464x Series is power ICs for switching
power supplies, incorporating a MOSFET and a current
mode PWM controller IC for non-isolated Buck converter
and Inverting converter topologies.
The operation mode is automatically changed, in
response to load, to the fixed switching frequency, to the
switching frequency control, and to the burst oscillation
mode. Thus the power efficiency is improved.
The product achieves high cost-performance power
supply systems with few external components.
Package
DIP8
FB
1
8
S/GND
VCC
2
7
S/GND
6
S/GND
5
S/GND
D/ST
4
SOIC8
Features
●
●
●
●
●
●
●
●
●
●
●
●
Pb-free (RoHS compliant)
Buck Converter
Inverting Converter
Current Mode PWM Control
Automatically Switch the Operation Mode According
to the Load
Heavy Load: 60 kHz (typ.) Fixed Switching Frequency
Mode
Medium Load: Green Mode, 23 kHz (typ.) to 60 kHz
(typ.)
Light Load: Burst Oscillation Mode
No Current Detection Resistor Required
(Built-in Current Sensing MOSFET)
Built-in Startup Function
Built-in Error Amplifier
Random Switching Function
Leading Edge Blanking Function
Soft Start Function
Protections
Overload Protection (OLP): Auto-restart
Overvoltage Protection (OVP): Auto-restart
Thermal Shutdown with Hysteresis (TSD): Auto-restart
R3
R1
U1
D1
VCC
S/GND
FB
S/GND
1
S/GND
FR1
DR1
L1
D/ST
C3
C4
VOUT
6
L2
(+)
5
STR5A464S
VAC
C1
C2
S/GND
FB
2
7
S/GND
6
S/GND
5
S/GND
D/ST
4
Not to scale
Selection Guide
● Electrical Characteristics
fOSC(AVG) = 60 kHz (typ.)
VD/ST = 700V (max.)
Part Number
STR5A464D
STR5A464S
RDS(ON)
(max.)
IDLIM
(typ.)
13.6 Ω
0.41 A
Package
DIP8
SOIC8
Recommended Operating Condition
Buck
Inverting
Converter
Converter
AC 85 V to AC 265 V
Applications
D2
S/GND
4
8
8
7
2
1
Input Voltage
D/ST Input
≥ 40 V
Voltage
Output Voltage
> 11 V
> – 27.5 V
Range*
< 27.5 V
< – 11 V
*Add a zener diode or a regulator to VCC pin when
target output voltage is high.
Typical Application
(Buck Convertor, STR5A464S)
R2
VCC
D3
C5
R4
(-)
● White Goods
● Auxiliary Power Supply
(lighting Equipment with Microcomputer, etc.)
● Power Supply for Motor Control (actuator, etc.)
● Telecommunication Equipment
(Convertible from 48 VDC to 15 VDC)
● Other SMPS
STR5A464x-DSE Rev.3.7
SANKEN ELECTRIC CO., LTD.
Nov. 10, 2023
https://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO., LTD. 2013
1
STR5A464x Series
Contents
Description ------------------------------------------------------------------------------------------------------ 1
Contents --------------------------------------------------------------------------------------------------------- 2
1. Absolute Maximum Ratings----------------------------------------------------------------------------- 3
2. Electrical Characteristics -------------------------------------------------------------------------------- 4
3. Mechanical Characteristics ----------------------------------------------------------------------------- 5
4. Performance Curves -------------------------------------------------------------------------------------- 5
5. Block Diagram --------------------------------------------------------------------------------------------- 6
6. Pin Configuration Definitions--------------------------------------------------------------------------- 6
7. Typical Application --------------------------------------------------------------------------------------- 7
8. Physical Dimensions -------------------------------------------------------------------------------------- 8
9. Marking Diagram --------------------------------------------------------------------------------------- 10
10. Operational Description ------------------------------------------------------------------------------- 11
10.1 Startup Operation of IC ------------------------------------------------------------------------- 11
10.2 Undervoltage Lockout (UVLO) ---------------------------------------------------------------- 11
10.3 Power Supply Startup and Soft Start Function --------------------------------------------- 11
10.4 Constant Voltage (CV) Control----------------------------------------------------------------- 12
10.4.1 Buck Converter Operation ---------------------------------------------------------------- 13
10.4.2 Inverting Converter Operation ----------------------------------------------------------- 13
10.5 Leading Edge Blanking Function -------------------------------------------------------------- 14
10.6 Random Switching Function -------------------------------------------------------------------- 14
10.7 Operation Mode ----------------------------------------------------------------------------------- 14
10.8 Overload Protection (OLP)---------------------------------------------------------------------- 15
10.9 Overvoltage Protection (OVP) ------------------------------------------------------------------ 15
10.10 Thermal Shutdown (TSD) ----------------------------------------------------------------------- 15
11. Design Notes ---------------------------------------------------------------------------------------------- 16
11.1 External Components ---------------------------------------------------------------------------- 16
11.1.1 Input and Output Electrolytic Capacitor ----------------------------------------------- 16
11.1.2 Inductor --------------------------------------------------------------------------------------- 16
11.1.3 VCC Pin Peripheral Circuit --------------------------------------------------------------- 16
11.1.4 FB Pin Peripheral Circuit ----------------------------------------------------------------- 16
11.1.5 Freewheeling Diode ------------------------------------------------------------------------- 17
11.1.6 Bleeder Resistance -------------------------------------------------------------------------- 17
11.2 D/ST Pin--------------------------------------------------------------------------------------------- 17
11.3 PCB Trace Layout -------------------------------------------------------------------------------- 17
12. Pattern Layout Example (Buck Converter) -------------------------------------------------------- 19
13. Design Example ------------------------------------------------------------------------------------------ 21
Important Notes ---------------------------------------------------------------------------------------------- 23
STR5A464x-DSE Rev.3.7
SANKEN ELECTRIC CO., LTD.
Nov. 10, 2023
https://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO., LTD. 2013
2
STR5A464x Series
1.
Absolute Maximum Ratings
The polarity value for current specifies a sink as "+," and a source as "−," referencing the IC. Unless otherwise specified,
TA = 25 °C, all S/GND pins (5 pin to 8pin) are shorted.
The pin number of SOIC8 package products is shown in bracket.
Parameter
Symbol
Test Conditions
Pins
Rating
Units
Remarks
1–5
FB Pin Voltage
VFB
− 0.3 to 7
V
(2 – 5)
2–5
VCC Pin Voltage
VCC
−0.3 to 32
V
(1 – 5)
D/ST Pin Voltage
VD/ST
4–5
−0.3 to 700
V
Drain Peak Current
Maximum Switching Current(1)
(1)
(2)
IDP
Single pulse,
Within 500 ns pulse
width,
VD/ST ≤ 400 V
4–5
IDMAX
Negative: Within 2
μs pulse width
4–5
(2)
―
1.7
−0.2 to 0.97
−0.2 to 0.91
1.55
A
A
MOSFET Power Dissipation
PD1
Operating Ambient Temperature
TOP
―
−40 to 125
°C
Storage Temperature
TSTG
―
−40 to 125
°C
Junction Temperature
TJ
―
150
°C
1.51
W
STR5A464D
STR5A464S
STR5A464D
STR5A464S
See MOS FET Ta-PD curve.
When embedding this hybrid IC onto the printed circuit board (cupper area in a 15mm×15mm)
STR5A464x-DSE Rev.3.7
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Nov. 10, 2023
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© SANKEN ELECTRIC CO., LTD. 2013
3
STR5A464x Series
2.
Electrical Characteristics
The polarity value for current specifies a sink as "+," and a source as "−," referencing the IC. Unless otherwise specified,
TA = 25 °C, all S/GND pins (5 pin to 8pin) are shorted.
The pin number of SOIC8 package products is shown in bracket.
Parameter
Symbol Test Conditions Pins
Min. Typ. Max. Units Remarks
Power Supply Startup Operation
2–5
Operation Start Voltage
VCC(ON)
13.6 15.0
16.6
V
(1 – 5)
2–5
Operation Stop Voltage
VCC(OFF)
7.3
8.0
8.7
V
(1 – 5)
2–5
VCC = 12 V
Circuit Current in Operation
ICC(ON)
―
―
2.0
mA
(1 – 5)
Startup Circuit Operation
VCC = 13.5 V
VST(ON)
4–5
19
29
39
V
Voltage
2–5
VCC = 13.5 V
Startup Current
ICC(ST)
−2.7 −1.5
−0.5
mA
VD/ST = 100 V
(1 – 5)
PWM Operation
Average PWM Switching
fOSC(AVG) VFB= 2.44 V
4–5
53
60
67
kHz
Frequency
Switching Frequency
Δf
4–5
―
2.8
―
kHz
Modulation Deviation
1–5
Feedback Reference Voltage
VFB(REF)
2.44 2.50
2.56
V
(2 – 5)
1–5
VFB = 2.3 V
Feedback Current(1)
IFB(OP)
−2.4 −0.8
―
μA
(2 – 5)
1–5
Minimum Sampling Time
tFBMS
―
―
2.5
μs
(2 – 5)
Standby Drain Current
IDSTB
4–5
―
50
―
mA
Standby Operation Cycle
tSTBOP
4–5
530
740
940
μs
Maximum ON Duty
DMAX
4–5
50
57
64
%
Protection
Leading Edge Blanking Time(1)
tBW
―
―
230
―
ns
Drain Current Limit
IDLIM
4–5
0.37 0.41
0.45
A
2–5
OVP Threshold Voltage
VCC(OVP)
27.5 29.3
31.3
V
(1 – 5)
VFB= 0 V
OLP Delay Time at Startup
tOLP
4–5
―
72
―
ms
Standby Blanking Time at
VFB= 2.6 V
tSTB(INH)
4–5
3.5
5.2
6.8
ms
Startup
Thermal Shutdown Operating
TJ(TSD)
―
135
―
―
°C
Temperature(1)
Thermal Shutdown Hysteresis(1)
TJ(TSD)HYS
―
―
70
―
°C
Power MOSFET
TJ = 125 °C
Drain Leakage Current(1)
IDSS
4–5
―
―
50
µA
On Resistance
Switching Time
Thermal Characteristics
Thermal Resistance Junction to
Case(1)(2)
(1)
(2)
RDS(ON)
tf
θJ-C
VD/ST = 560 V
ID = 41 mA
4–5
4–5
―
―
11.0
―
13.6
250
Ω
ns
―
―
―
―
―
15
16
°C/W
STR5A464D
STR5A464S
Design assurance
Case temperature (TC) measured at the center of the case top surface
STR5A464x-DSE Rev.3.7
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Nov. 10, 2023
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4
STR5A464x Series
3.
Mechanical Characteristics
Parameter
Conditions
Package Weight
4.
Min.
Typ.
Max.
Unit
Remarks
—
0.51
—
g
STR5A464D
—
0.078
—
g
STR5A464S
Performance Curves
● STR5A464D
Ambient Temperature versus
Power Dissipation Curve
Power Dissipation, PD (W)
1.25
1.00
0.75
0.50
0.25
10
Transient Thermal Resistance
θJ-C (°C /W)
PD_STR5A464D_R1
PD = 1.55 W
1.50
0.00
0
25
50
75
100
125
TR_STR5A464D_R1
Transient Thermal Resistance Curve
1.75
1
0.1
0.01
150
1μ
10μ
Ambient Temperature, TA (°C )
100μ
1m
10m
100m
10m
100m
Time (s)
● STR5A464S
Ambient Temperature versus
Power Dissipation Curve
1.00
0.75
0.50
0.25
0.00
1
0.1
0.01
0
25
50
75
100
125 150
TR_STR5A464S_R1
Power Dissipation, PD (W)
1.25
10
Transient Thermal Resistance
θJ-C (°C /W)
PD = 1.51 W
1.50
Transient Thermal Resistance Curve
PD_STR5A464S_R1
1.75
1μ
10μ
Ambient Temperature, TA (°C )
STR5A464x-DSE Rev.3.7
SANKEN ELECTRIC CO., LTD.
Nov. 10, 2023
https://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO., LTD. 2013
100μ
1m
Time (s)
5
STR5A464x Series
5.
Block Diagram
The pin number of SOIC8 package products is shown in bracket.
2
(1)
VCC
STARTUP
D/ST
4
UVLO
OVP
REG
PROTECTION
TSD
DRV
PWM
OSC
S Q
R
OCP
1
(2)
FB
S/H
E/A
Feedback
Control
VFB(REF)
6.
LEB
S/GND
5, 6, 7, 8
Pin Configuration Definitions
● DIP8
FB
1
VCC
2
D/ST
Pin
Name
Descriptions
8
S/GND
1
FB
7
S/GND
2
VCC
6
S/GND
3
―
Constant voltage control signal input
Power supply voltage input for control part
and overvoltage protection (OVP) signal input
(Pin removed)
4
D/ST
5 to 8
S/GND
Pin
Name
1
VCC
MOSFET drain and startup current input
4
5
1
8
S/GND
2
7
S/GND
2
FB
Descriptions
Power supply voltage input for control part
and overvoltage protection (OVP) signal input
Constant voltage control signal input
6
S/GND
3
―
(Pin removed)
4
D/ST
5
S/GND
5 to 8
S/GND
S/GND
MOSFET source and ground
● SOIC8
VCC
FB
D/ST
4
MOSFET drain and startup current input
MOSFET source and ground
STR5A464x-DSE Rev.3.7
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© SANKEN ELECTRIC CO., LTD. 2013
6
STR5A464x Series
7.
Typical Application
Figure 7-1 and Figure 7-2 are the SOIC8 circuit example circuits of the buck and inverting converters.
To enhance the heat dissipation, the wide pattern layout of the S/GND pin (5 through 8 pin) is recommended.
When the absolute value of the output voltage | VOUT | is 27.5 V or more, add a Zenner diode DZ1 connected to D1 in
serial as shown in Figure 7-3. Using the maximum on-duty of 50 % in the steady state operation, the condition of |VOUT|
is shown below:
| VOUT | : 11V < |VOUT | − VDZ1 < 27.5V
| VOUT | according to the input voltage:
For buck topology, | VOUT | ≤ 0.5 × input voltage
For inverting topology, | VOUT | ≤ input voltage
R2
D1
U1
VCC
S/GND
FB
S/GND
1
DR1
R1
8
C4
C3
D2
7
2
FR1
R3
S/GND
L1
L2
6
VOUT
(+)
S/GND
D/ST
5
4
STR5A464S
VAC
C1
C2
D3
C5
R4
(-)
Figure 7-1. Buck Converter
R2
D1
U1
VCC
S/GND
FB
S/GND
1
DR1
R1
8
C4
C3
D2
7
2
FR1
R3
S/GND
L1
6
VOUT
(-)
D3
D/ST
S/GND
4
5
STR5A464S
VAC
C1
C2
L2
C5
R4
(+)
Figure 7-2. Inverting Converter
VCC
S/GND
Figure 7-3. Increasing the Absolute Value of |VOUT|
STR5A464x-DSE Rev.3.7
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Nov. 10, 2023
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7
STR5A464x Series
8.
Physical Dimensions
● DIP8
9.4±0.3
5
1
4
6.5 ±0.2
8
1.52+0.3
-0.05
7.6 TYP
3.3 ±0.2
4.2±0.3
3.4 ±0.1
7.5±0.5
1.0+0.3
-0.05
0.2 +0.
5
1
-0.
05
2.54 TYP
０～１５°
０～１５°
0.89 TYP
0.5±0.1
NOTES:
– All dimensions in millimeters
– Pb-free (RoHS compliant)
– When soldering the products, it is required to minimize the working time within the following limits:
Flow: 260 °C / 10 s, 1 time
Soldering Iron: 350 °C / 3.5 s, 1 time
Soldering should be at a distance of at least 1.5 mm from the body of the product.
STR5A464x-DSE Rev.3.7
SANKEN ELECTRIC CO., LTD.
Nov. 10, 2023
https://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO., LTD. 2013
8
STR5A464x Series
● SOIC8
NOTES:
– All dimensions in millimeters
– Pb-free (RoHS compliant)
– When soldering the products, it is required to minimize the working time within the following limits:
Flow: 260 °C / 10 s, 1 time
Soldering Iron: 350 °C / 3.5 s, 1 time
● SOIC8 Land Pattern Example
1.6
3.8
1.27
0.61
Unit: mm
STR5A464x-DSE Rev.3.7
SANKEN ELECTRIC CO., LTD.
Nov. 10, 2023
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© SANKEN ELECTRIC CO., LTD. 2013
9
STR5A464x Series
9.
Marking Diagram
● DIP8
8
5A464D
Specific Device Code (See Table 9-1)
S KY MD
1
Lot Number:
Y is the last digit of the year of manufacture (0 to 9)
M is the month of the year (1 to 9, O, N, or D)
D is the period of days represented by:
1: the first 10 days of the month (1st to 10th)
2: the second 10 days of the month (11th to 20th)
3: the last 10–11 days of the month (21st to 31st)
Sanken Control Number
● SOIC8
8
5A464S
Specific Device Code (See Table 9-1)
S KY MD
1
Y is the last digit of the year of manufacture (0 to 9)
M is the month of the year (1 to 9, O, N, or D)
D is the period of days represented by:
1: the first 10 days of the month (1st to 10th)
2: the second 10 days of the month (11th to 20th)
3: the last 10–11 days of the month (21st to 31st)
Sanken Control Number
Table 9-1. Specific Device Code
Specific Device Code
Part Number
5A464D
STR5A464D
5A464S
STR5A464S
STR5A464x-DSE Rev.3.7
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10
STR5A464x Series
10. Operational Description
All of the parameter values used in these descriptions
are typical values, unless they are specified as minimum
or maximum. With regard to current direction, "+"
indicates sink current (toward the IC) and "–" indicates
source current (from the IC).
In Section 8, the pin number of SOIC8 package
products is shown in bracket.
The common items of Buck converter and Inverting are
desribed by using Buck conveter.
Figure 10-1).
The voltage between VCC pin and S/GND pin in the
steady state operation is calculated as follows, where VFD1,
VFD2 and VFD3 are the forward voltage of D1, D2 and D3
respectively:
VCC = VOUT + VFD3 − (VFD1 + VFD2 )
(2)
10.2 Undervoltage Lockout (UVLO)
Figure 10-2 shows the relationship of VCC pin voltage
and the circuit current, ICC. When VCC pin voltage
increases to VCC(ON) = 15.0 V, the control circuit starts
switching operation and the circuit current, ICC, increases.
When VCC pin voltage decreases to VCC(OFF) = 8.0 V, the
control circuit stops its operation by the Undervoltage
Lockout (UVLO) circuit, and reverts to the state before
startup.
10.1 Startup Operation of IC
Figure 10-1 shows the circuit around VCC pin.
ISTRTUP
Contro1
VCC 2(1)
D/ST
C2
S/GND
L2
5~8
C5
R4
Stop
VIN
Circuit current, ICC
Start
VOUT
(＋)
4
(－)
Figure 10-1. VCC Pin Peripheral Circuit in Buck
Converter
The IC incorporates the startup circuit. The circuit is
connected to D/ST pin. When D/ST pin voltage reaches
the Startup Circuit Operation Voltage VST(ON) = 29 V, the
startup circuit starts operation.
During the startup process, the constant current,
ICC(ST) = −1.5 mA, charges C4 at VCC pin. When VCC
pin voltage increases to VCC(ON) = 15.0 V, the control
circuit starts switching operation.
After switching operation begins, the startup circuit
turns off automatically so that its current consumption
becomes zero.
The approximate startup time tSTART is calculated as
follows:
t START = C4 ×
VCC(ON) − VCC(INT)
|ICC(ST) |
(s)
(1)
where,
tSTART is the startup time of IC (s),
VCC(INT) is the initial voltage on VCC pin (V).
When the internal power MOSFET turns off, the output
voltage, VOUT, charges C4 through D1 and D2 (see to
VCC（OFF）
VCC pin
VCC（ON） voltage
Figure 10-2. Relationship between
VCC Pin Voltage and ICC
10.3 Power Supply Startup and Soft Start
Function
The soft start function reduces the voltage and the
current stress of the internal power MOSFET and the
freewheeling diode, D3.
Figure 10-3 shows the startup waveforms. After the IC
starts, during the Standby Blanking Time at Startup,
tSTB(INH), the burst oscillation mode is disabled to operate
the soft start.
The IC activates the soft start circuitry during the
startup period. The soft start time is fixed to about 5.2 ms.
During the soft start period, the overcurrent threshold is
increased step-wisely (7 steps). The IC operates switching
operation by the frequency responding to FB pin voltage
until the output reaches the setting voltage.
Here, the tLIM is defined as the period until FB pin
voltage reaches 1.6 V after the IC starts. When the tLIM
reaches the OLP Delay Time at Startup, tOLP, of 72 ms and
more, the IC stops switching operation. Thus, it is
STR5A464x-DSE Rev.3.7
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STR5A464x Series
necessary to adjust the value of output electrolytic
capacitor, C5 so that the tLIM is less than tOLP.
If VCC pin voltage reaches VCC(OFF) and a startup
failure occurs as shown in Figure 10-4, increase C4 value
or decrease C5 value. Since the larger capacitance causes
the longer startup time of IC, it is necessary to check and
adjust the startup process based on actual operation in the
application.
Since the leading edge blanking function (see Section
10.5) is disabled during the soft start period, the on-time
may be less than the Leading Edge Blanking Time
(tBW = 230 ns).
VCC pin
voltage
sampled FB pin voltage on pulse by pulse basis at the
point of tFBFS = 2.5 μs (max.) after turning off the internal
power MOSFET. The VROCP is the voltage value of the
built-in drain current sense resistor. The IC controls so
that the peak voltage of VROCP is close to VSC by
comparing them at the internal FB comparator (see Figure
10-5 and Figure 10-6).
U1
Startup of IC
Normal opertion
Startup of SMPS
tSTART
4
D/ST
Feedback
Control
E/A
FB comp VSC
+ S/H
+
PWM
Control
VROCP
ROCP
VCC(ON)
VCC(OFF)
R2
1(2)
FB
D2
R1
L2
VOUT
(＋)
5~8
S/GND
ILON
C2
R3
D3
C5
tSTB(INH)
R4
(－)
Time
Soft start period,
fixed to approximately 5.2 ms
for STR5A464
D/ST pin
current, ID
Figure 10-5. FB Pin Peripheral Circuit in Buck
Converter
Time
FB pin voltage
VFB(REF)
tLIM < tOLP
-
VSC
+
VROCP
FB comparator Voltage on both side of ROCP
1.6V
Time
Drain current,
ION
Figure 10-3. Startup Waveforms
VCC pin
voltage
Startup success
IC starts operation
Target operating
voltage
VCC(ON)
Increase with rising of
output voltage
VCC(OFF)
Startup failure
Time
Startup time of IC, tSTART
Figure 10-4. VCC Pin Voltage during Startup Period
10.4 Constant Voltage (CV) Control
The constant voltage (CV) control for power supply
output adopts the peak-current-mode control method
which enhances the response speed and the stable
operation.
The target voltage, VSC, is made from the voltage value
Figure 10-6. Drain Current ID and FB Comparator
in Steady State Operation
● Decreasing Load
When the output load decreases, the FB pin voltage
increases in response to the increase of the output
voltage. Since VSC which is the output voltage of
internal error amplifier becomes low, the peak value of
VROCP is controlled to become low, and the peak of the
drain current decreases. This control prevents the
output voltage from increasing.
● Increasing Load
When the output load increases, the control circuit
operates the reverse of the former operations. Since
VSC becomes high, the peak drain current increases.
This control prevents the output voltage from
decreasing.
STR5A464x-DSE Rev.3.7
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12
STR5A464x Series
10.4.1 Buck Converter Operation
Figure 10-7 shows the output current path in the Buck
converter. Figure 10-8 shows the operational waveforms.
Contro1
VCC 2(1)
FB 1(2)
VROC P
ROCP
4
C2
VIN
L2
5~8
D/ST
S/GND
ILON
(MOSFET on)
ILOFF
(MOSFET off)
C5
VOUT
(＋)
R4
(－)
2) PWM Off-Time Period
When the internal power MOSFET turns off, the back
electromotive force occurs in the inductor, L2, the
freewheeling diode, D3, is forward biased and turns
on. Thus, the ILOFF current flows as shown in Figure
10-7.
As shown in Figure 10-8, after the average switching
period, 1⁄fOSC(AVG) ), the power MOSFET turns on
again, and the event moves to the previous 1).
The output current is equal to the average inductor
current of L2.
10.4.2 Inverting Converter Operation
Figure 10-9 shows the output current path in the
Inverting converter. Figure 10-10 shows the operational
waveforms.
Figure 10-7. Output Current Path in Buck Converter
VCC
2(1)
FB
1(2)
Contro1
VL
MOSFET
ON
OFF
ON
VIN-VRON-VOUT
VROC P
ROCP
0
4
t
-(VOUT+VFD3)
VOUT
(－)
5~8
D/ST
S/GND
C2
IL
VIN
ILON
(MOSFET on)
t
ILOFF
(MOSFET off)
C5
R4
L2
(＋)
ILON
t
ILOFF
Figure 10-9. Output Current Path in Inverting
Converter
t
1/fOSC(AVG)
Figure 10-8. Operational Waveforms in Buck
Converter
MOSFET
ON
OFF
VL
VIN-VRON
t
0
In the Buck converter, the PWM control is described in
the following.
1) PWM On-Time Period
When the internal power MOSFET turns on, the ILON
current flows as shown in Figure 10-7, and the
inductor, L2, stores some energy.
Since the ILON flows through the internal sense resistor,
ROCP, the voltage of ROCP is detected as the current
detection voltage, VROCP.
FB pin voltage is the voltage divided C3 voltage by
voltage dividing resistors, and the target voltage, VSC,
is given by FB pin voltage.
When VROCP reaches VSC, the power MOSFET turns
off.
ON
-(VOUT+VFD3)
IL
t
ILON
t
ILOFF
t
1/fOSC(AVG)
Figure 10-10.
STR5A464x-DSE Rev.3.7
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Operational Waveforms in Inverting
Converter
13
STR5A464x Series
In the Inverting converter, the PWM control is
described in the following.
1) PWM On-Time Period
When the internal power MOSFET turns on, the ILON
current flows as shown in
Figure 10-9, and the inductor, L2, stores some energy.
Since the ILON flows through the internal sense resistor,
ROCP, the voltage of ROCP is detected as the current
detection voltage, VROCP. FB pin voltage is the voltage
divided C3 voltage by voltage dividing resistors, and
the target voltage, VSC, is given by FB pin voltage.
When VROCP reaches VSC, the power MOSFET turns
off.
2) PWM Off-Time Period
When the internal power MOSFET turns off, the back
electromotive force occurs in the inductor, L2, the
freewheeling diode, D3, is forward biased and turns
on. Thus, the ILOFF current flows as shown in
Figure 10-9. As shown in Figure 10-10, after the
average switching period, 1⁄fOSC(AVG) , the power
MOSFET turns on again, and the event moves to the
previous 1).
The output current is equal to the average current of
ILOFF of L2.
10.5 Leading Edge Blanking Function
The constant voltage control for power supply output
adopts the peak-current-mode control method. The peak
drain current is detected by the internal sense resistor,
ROCP. Just in turning on the internal power MOSFET, the
steep surge current would occur.
If the overcurrent protection (OCP) responds to the
voltage caused by that surge current, the power MOSFET
may be turned off.
To prevent that response, the OCP detection is disabled
during Leading Edge Blanking (tBW = 230 ns) just after
the power MOSFET turns on.
function reduces the conduction noise compared with
other products without this function, and simplifies noise
filtering of the input lines of power supply.
10.7 Operation Mode
As shown in Figure 10-12, when the output power is
decreasing, together with the decrease of the drain current
ID of the internal power MOSFET, the operation mode is
automatically changed to the fixed switching frequency
mode (60 kHz), to the green mode controlled the
switching frequency (23 kHz to 60 kHz), and to the burst
oscillation mode controlled by an internal oscillator. In
the green mode, the number of switching is reduced. In
the burst oscillation mode, the switching operation is
stopped during a constant period. Thus, the switching loss
is reduced, and the power efficiency is improved.
When the output power becomes light and the drain
current decreases to the Standby Drain Current, IDSTB, the
burst oscillation mode is getting started. Figure 10-13
shows the drain current waveforms of point A and B in
Figure 10-12. The burst period of burst oscillation mode
is the Standby Operation Cycle, tSTBOP = 740 μs. In the
burst period, the number of minimum switching times is
reduced up to one.
Since the oscillator for setting burst oscillation cycle
and the oscillator for setting the switching oscillation
frequency are not synchronized each other, the first
switching frequency in the burst period may be raised.
Switching
Frequency,
fOSC
Fixed switching frequency
60kHz
B
About
23kHz
Burst
oscillation mode
Green mode
tSTBOP = 740 µs
PO
Figure 10-12.
tBW
ROCP voltage
A
Output power
Switching Frequency in Response to
Output Power
Point A
ID
Time
Surge pulse voltage width at turning on
Figure 10-11.
Point B
ID
Leading Edge Blanking
tSTBOP
Time
10.6 Random Switching Function
The switching frequency is randomly modulated by
superposing the modulating frequency on fOSC(AVG). This
Figure 10-13. Switching Waveform
at Burst Oscillation Mode
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STR5A464x Series
10.8 Overload Protection (OLP)
When the drain current, ID, reaches the Drain Current
Limit, IDLIM, the internal power MOSFET turns off.
Figure 10-14 shows the characteristic of output voltage
and current.
The output voltage decreases in the overload state, and
FB pin voltage also decreases. When the period keeping
FB pin voltage less than 1.6 V continues during the OLP
Delay Time at Startup (tOLP = 72 ms), the overload
protection (OLP) is activated, and the IC stops switching
operation. Thus, VCC pin voltage decreases to VCC(OFF),
and the control circuit stops operation. After that, the
startup circuit is activated, VCC pin voltage increases to
VCC(ON) by the startup current, and the control circuit
operates again. Thus, the intermittent operation by UVLO
is repeated in the OLP state (see Figure 10-15). This
intermittent operation reduces the stress of parts including
the power MOSFET and the freewheeling diode. In
addition, this operation reduces power consumption
because the switching period in this intermittent operation
is much shorter than the oscillation stop period. When the
abnormal condition is removed, the IC returns to normal
operation automatically.
Output voltage,
VOUT
CV mode
Output current, IOUT
Figure 10-14.
Overload Characteristics
Non-switching interval
VOUT(OVP) = VCC(OVP) + VFD1 + VFD2 − VFD3
(3)
where,
VOUT(OVP) is voltage of between VOUT(+) and VOUT(−),
VFD1 is the forward voltage of D1 in Figure 10-1,
VFD2 is the forward voltage of D2, and
VFD3 is the forward voltage of D3.
10.10 Thermal Shutdown (TSD)
Figure 10-16 shows the thermal shutdown (TSD)
operational waveforms.
When the junction temperature of the IC control circuit
increases to TJ(TSD) = 135 °C (min.) or more, the TSD is
activated, and the IC stops switching operation. The TSD
has a temperature hysteresis. When VCC pin voltage
decreases to about 9.4 V during the TJ >
(TJ(TSD)−TJ(TSD)HYS), the startup circuit supplies startup
current to VCC pin to keep the VCC pin voltage >
VCC(OFF).
While the junction temperature is TJ(TSD)−TJ(TSD)HYS or
less, the startup circuit stops the startup current supply.
Then, VCC pin voltage decreases to VCC(OFF) or less, and
the control circuit stops operation. After that, the startup
circuit is activated, VCC pin voltage increases to VCC(ON)
by the startup current, and the control circuit operates
again. The intermittent operation by TSD and UVLO is
repeated in the TSD state.
After the fault condition is removed, the IC returns to
normal operation automatically.
Junction temperature,
Tj
VCC pin voltage
VCC(ON)
TSD is active
Return
to normal operation
Tj(TSD)
VCC(OFF)
Drain current,
ID
intermittent operation by UVLO.
When the abnormal condition is removed, the IC
returns to normal operation automatically.
The approximate value of output voltage VOUT(OVP) in
the OVP condition is calculated by using Equation (3).
Tj(TSD)−Tj(TSD)HYS
tOLP
tOLP
ON
Bias Assist Function
OFF
OFF
VCC pin voltage
Figure 10-15.
VCC(ON)
VCC(BIAS)
VCC(OFF)
OLP Operational Waveform
10.9 Overvoltage Protection (OVP)
When the voltage between VCC pin and S/GND pin
increases to VCC(OVP) = 29.3 V or more, the overvoltage
protection (OVP) is activated and the IC stops switching
operation. The intermittent operation by UVLO is
repeated in the OVP state. See Section 10.8 about the
Drain current,
ID
Figure 10-16.
STR5A464x-DSE Rev.3.7
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TSD Operational Waveforms
15
STR5A464x Series
11. Design Notes
11.1.2 Inductor
11.1 External Components
Take care to use properly rated, including derating as
necessary, and proper type of components.
Figure 11-1 shows the peripheral circuit of IC in Buck
converter. The pin number of SOIC8 package products in
the circuits is shown in bracket.
R2
R3
R1
U1
D1
VCC
S/GND
FB
S/GND
1 (2)
7
2 (1)
S/GND
FR1
DR1
L1
D/ST
4
VAC
C1
C2
8
C3
C4
D2
VOUT
6
L2
(+)
S/GND
5
D3
C5
R4
Apply proper design margin to core temperature rise by
core loss and copper loss.
The inductor should be designed so that the inductor
current does not saturate. The inductance should be the
minimum considered a negative tolerance of inductance
and a decline of DC superposition characteristics.
The on-time must be longer than the Leading Edge
Blanking Time to control the output voltage constantly.
In the universal input voltage design, the on-time is
easy to become short in the condition of maximum AC
input voltage and light load. Be careful not to choose too
small value for the inductance (The recommended value
is 600 μH or more).
Refer to the following design example of how to the
inductor setting of the buck converter.
● DEE0012 Design Example Using STR5A464S: 3 W
(15 V, 0.2 A) Offline Buck Converter
https://www.semicon.sankenele.co.jp/common/pdf/designexample/dee0012.pdf
(-)
11.1.3 VCC Pin Peripheral Circuit
Figure 11-1. Peripheral Circuit of IC in Buck
Converter
The reference value of C4 in Figure 11-1 is generally
10 to 47 μF. See Section 10.1 about the startup time.
11.1.1 Input and Output Electrolytic
Capacitor
11.1.4 FB Pin Peripheral Circuit
Apply proper derating to ripple current, voltage, and
temperature rise.
The value of output electrolytic capacitor, C5, should
be fulfilled the following conditions:
- The specification of output ripple
- Enough shorter output voltage rising time in startup
than the OLP Delay Time at Startup, tOLP = 72 ms.
- Low impedance types, designed for switch mode
power supplies, is recommended.
The ESR of C5 should be set in the range of
Equation (4).
ZCO <
∆VOR
ILRP
(4)
As shown in Figure 11-1, FB pin is input the voltage
divided the voltage between VOUT(+) and S/GND pin by
resistors.
C3 is the smoothing capacitor. The value of C3
depends on the value of output electrical capacitor, C5.
Usually the value of C3 is 0.068 μF to 0.47 μF. When C3
value is set larger, the line regulation becomes better,
however, the dynamic response of the output voltage
becomes worse. Be careful of that value.
The voltage dividing resistor of R1, R2 and R3 is
determined by the reference voltage, VFB(REF) = 2.50 V,
the output voltage, VOUT, and so on. The following
Equation (5) shows the relationship of them.
The target value of R1 is about 5.6 kΩ to 10 kΩ. R2
and R3 should be adjusted in actual operation condition.
The VF of D2 and D3 affects the output voltage. Thus,
the diodes of low VF should be selected.
where,
ZCO is the ESR of electrolytic capacitor at the operation
frequency (Since the ESR in general catalogs is mostly
measured at 100 kHz, check the frequency
characteristic.),
ΔVOR is the output ripple voltage specification, and
ILRP is the ripple current of inductor.
STR5A464x-DSE Rev.3.7
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STR5A464x Series
11.3 PCB Trace Layout
R1 + R2 + R3
|VOUT | ≅ VFB(REF) ×
+ VFD2 − VFD3
R1
⇒ R2 + R3 = (
|VOUT |−VFD2 + VFD3
− 1)
VFB(REF)
× R1
(5)
1) Main Circuit Trace Layout
This is the main trace containing switching currents,
and thus it should be as wide trace and small loop as
possible.
where,
VFD2 is the forward voltage of D2, and
VFD3 is the forward voltage of D3.
11.1.5 Freewheeling Diode
D3 in Figure 11-1 is the freewheeling diode.
When the internal power MOSFET turns on, the
recovery current flows through D3. The current affects
power loss and noise much. The VF affects the output
voltage. Thus, the diode of fast recovery and low VF
should be selected.
11.1.6 Bleeder Resistance
For light load application, the bleeder resistor, R4, in
Figure 11-1 should be connected to both ends of output
capacitor, C5, to prevent the increase of output voltage.
The value of R4 should be satisfied with Equation (6),
and should be adjusted in actual operation condition.
R4 ≤
|VOUT |
3mA
Since the PCB circuit trace design and the component
layout significantly affects operation, EMI noise, and
power dissipation, the high frequency PCB trace should
be low impedance with small loop and wide trace. In
addition, the ground traces affect radiated EMI noise, and
wide, short traces should be taken into account. Figure
11-2 and Figure 11-3 show the circuit design example.
(6)
11.2 D/ST Pin
When the D/ST pin voltage and the current exceed the
Absolute Maximum Ratings, the internal power
MOSFET connected to D/ST pin would be permanently
damaged. The D/ST pin voltage should be less than 630 V
which is the derating value of 90% for the Absolute
Maximum Ratings, 700 V, in all condition of actual
operation, and the parameters of transformer and
components value should be selected based on actual
operation in the application.
In addition, the D/ST pin voltage should be less than
560 V in the steady state operation.
2) Freewheeling Loop Layout
This is the trace for the current of freewheeling diode,
D3, and thus it should be as wide trace and small loop
as possible.
3) Control Ground Trace Layout
Since the operation of IC may be affected from the
large current of the main trace that flows in control
ground trace, the control ground trace should be
separated from main trace and connected at single
point grounding.
4) VCC Trace Layout
This is the trace for supplying power to the IC, and
thus it should be as small loop as possible. If C4 and
the IC are distant from each other, placing a capacitor
such as film capacitor Cf (about 0.1 μF to 1.0 μF)
close to the VCC pin and the S/GND pin is
recommended.
5) FB Trace Layout
The divided voltage by R2+R3 and R1 of output
voltage is input to the FB pin.
To increase the detection accuracy, R3 and R1 should
be connected to the bottom of C3 and the S/GND pin,
respectively. The trace between R1, R2 and the FB
pin should be as short as possible.
6) Thermal Considerations
Since the internal power MOSFET has a positive
thermal coefficient of RDS(ON), consider it in thermal
design.
Since the copper area under the IC and the S/GND pin
trace act as a heatsink, its traces should be as wide as
possible.
STR5A464x-DSE Rev.3.7
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17
STR5A464x Series
(6) Trace of S/GND pin should be wide
for heat release
D1
D2
(4) Loop of the power supply should be small
R3
(5) The trace between
R1, R2 and FB pin
should be as short as
possible.
R2
1
8
S/GND
FB
C3
C4
2
7
S/GND
VCC
R1
6
S/GND
4
VOUT
(＋)
5
D/ST
S/GND
L2
U1
C5
D3
C2
R4
(－)
(2) Freewheeling loop trace should be
wide trace and small loop
(1)Main trace should be wide
trace and small loop
(3) Control ground trace should be
connected at a single point
Figure 11-2. Peripheral Circuit Example Around IC for Buck Converter (DIP8)
(6) Trace of S/GND pin should be wide
for heat release
D1
D2
(4) Loop of the power supply should be small
R3
(5) The trace between
R1, R2 and FB pin
should be as short as
possible.
R2
1
FB
S/GND
VCC
S/GND
8
C3
C4
2
R1
7
6
S/GND
4
VOUT
(－)
D3
5
D/ST
S/GND
U1
C2
C5
R4
L2
(＋)
(1)Main trace should be wide
trace and small loop
(2) Freewheeling loop trace should be
wide trace and small loop
(3) Control ground trace should be
connected at a single point
Figure 11-3. Peripheral Circuit Example Around IC for Inverting Converter (DIP8)
STR5A464x-DSE Rev.3.7
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18
STR5A464x Series
12. Pattern Layout Example (Buck Converter)
The following show the pattern layout example and the circuit schematic for the buck converter using STR5A464S.
The design example uses only the parts listed in the circuit diagram and the bill of materials.
PCB dimensions: 65 mm × 24 mm
(a) Top View
(b) Bottom View
Figure 12-1. Pattern Layout Example for Buck Converter
STR5A464x-DSE Rev.3.7
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19
STR5A464x Series
R2
D1
U1
VCC
S/GND
FB
S/GND
1
FR1
DR1
L1
R1
8
C4
D2
C3
7
2
P1
R3
S/GND
JP1
D/ST
6
L2
P2
S/GND
4
(+)
5
STR5A464S
C1
C2
D3
C5
R4
P3
(-)
PSA50143 Rev.1.0
Figure 12-2. Circuit Diagram for Buck Converter
STR5A464x-DSE Rev.3.7
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© SANKEN ELECTRIC CO., LTD. 2013
20
STR5A464x Series
13. Design Example
The following show the power supply specification, the circuit schematic, and the bill of materials of the buck converter
reference design.
● Power Supply Specification
IC
Input voltage
Maximum output power
Output voltage
Output current
STR5A464S
85 VAC to 265 VAC
3W
15 V
0.2 A
● Circuit Diagram
R2
D1
U1
VCC
S/GND
FB
S/GND
1
FR1
DR1
L1
R1
8
C4
D2
C3
7
2
P1
R3
S/GND
JP1
D/ST
6
L2
P2
S/GND
4
(+)
5
STR5A464S
C1
C2
D3
C5
R4
P3
(-)
PSA50143 Rev.1.0
Figure 13-1. Circuit Diagram for Buck Converter
STR5A464x-DSE Rev.3.7
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Nov. 10, 2023
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© SANKEN ELECTRIC CO., LTD. 2013
21
STR5A464x Series
● Bill of Materials
Symbol
Part Type
Ratings
Recommended Sanken Parts
C1
Electrolytic capacitor
105 °C, 400 V, 8.2 µF
C2
Electrolytic capacitor
105 °C, 400 V, 8.2 µF
C3
Ceramic capacitor
50 V, 0.22 µF, 2012
C4
Electrolytic capacitor
105 °C, 50 V, 10 µF
C5
Electrolytic capacitor
105 °C, 25 V, 470 µF
General-purpose rectifier diode
1000 V, 1 A
EM1C
D1
Schottky diode
90 V, 1 A
SJPB-D9
D2
Fast recovery diode
500 V, 1 A
SJPD-D5
D3
Fast recovery diode
500 V, 1 A
SJPD-D5
L1
Inductor
1 mH, 0.21 A
L2
Inductor
1 mH, 0.5 A
FR1
Resistor
2 W, 10 Ω
R1
Chip resistor
6.8 kΩ, 1/8 W, 1608
R2
Chip resistor
33 kΩ, 1/8 W, 1608
R3
Chip resistor
1.8 kΩ, 1/8 W, 1608
R4
Chip resistor
6.8 kΩ, 1/8 W, 1608
U1
PWM offline converter IC
700 V, 13.6 Ω
JP1
Jumper wire
Plated wire (φ = 0.6, P = 5 mm)
P1
250 V
P2
Connector
Connector
P3
Connector
50 V
―
PCB
PSA50143 Rev.1.0
DR1
STR5A464S
50 V
STR5A464x-DSE Rev.3.7
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22
STR5A464x Series
Important Notes
● All data, illustrations, graphs, tables and any other information included in this document (the “Information”) as to Sanken’s products
listed herein (the “Sanken Products”) are current as of the date this document is issued. The Information is subject to any change
without notice due to improvement of the Sanken Products, etc. Please make sure to confirm with a Sanken sales representative that
the contents set forth in this document reflect the latest revisions before use.
● The Sanken Products are intended for use as components of general purpose electronic equipment or apparatus (such as home
appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Prior to use of the Sanken Products, please
put your signature, or affix your name and seal, on the specification documents of the Sanken Products and return them to Sanken.
When considering use of the Sanken Products for any applications that require higher reliability (such as transportation equipment
and its control systems, traffic signal control systems or equipment, disaster/crime alarm systems, various safety devices, etc.), you
must contact a Sanken sales representative to discuss the suitability of such use and put your signature, or affix your name and seal,
on the specification documents of the Sanken Products and return them to Sanken, prior to the use of the Sanken Products. The
Sanken Products are not intended for use in any applications that require extremely high reliability such as: aerospace equipment;
nuclear power control systems; and medical equipment or systems, whose failure or malfunction may result in death or serious injury
to people, i.e., medical devices in Class III or a higher class as defined by relevant laws of Japan (collectively, the “Specific
Applications”). Sanken assumes no liability or responsibility whatsoever for any and all damages and losses that may be suffered by
you, users or any third party, resulting from the use of the Sanken Products in the Specific Applications or in manner not in
compliance with the instructions set forth herein.
● In the event of using the Sanken Products by either (i) combining other products or materials or both therewith or (ii) physically,
chemically or otherwise processing or treating or both the same, you must duly consider all possible risks that may result from all
such uses in advance and proceed therewith at your own responsibility.
● Although Sanken is making efforts to enhance the quality and reliability of its products, it is impossible to completely avoid the
occurrence of any failure or defect or both in semiconductor products at a certain rate. You must take, at your own responsibility,
preventative measures including using a sufficient safety design and confirming safety of any equipment or systems in/for which the
Sanken Products are used, upon due consideration of a failure occurrence rate and derating, etc., in order not to cause any human
injury or death, fire accident or social harm which may result from any failure or malfunction of the Sanken Products. Please refer
to the relevant specification documents and Sanken’s official website in relation to derating.
● No anti-radioactive ray design has been adopted for the Sanken Products.
● The circuit constant, operation examples, circuit examples, pattern layout examples, design examples, recommended examples, all
information and evaluation results based thereon, etc., described in this document are presented for the sole purpose of reference of
use of the Sanken Products.
● Sanken assumes no responsibility whatsoever for any and all damages and losses that may be suffered by you, users or any third
party, or any possible infringement of any and all property rights including intellectual property rights and any other rights of you,
users or any third party, resulting from the Information.
● No information in this document can be transcribed or copied or both without Sanken’s prior written consent.
● Regarding the Information, no license, express, implied or otherwise, is granted hereby under any intellectual property rights and
any other rights of Sanken.
● Unless otherwise agreed in writing between Sanken and you, Sanken makes no warranty of any kind, whether express or implied,
including, without limitation, any warranty (i) as to the quality or performance of the Sanken Products (such as implied warranty of
merchantability, and implied warranty of fitness for a particular purpose or special environment), (ii) that any Sanken Product is
delivered free of claims of third parties by way of infringement or the like, (iii) that may arise from course of performance, course
of dealing or usage of trade, and (iv) as to the Information (including its accuracy, usefulness, and reliability).
● In the event of using the Sanken Products, you must use the same after carefully examining all applicable environmental laws and
regulations that regulate the inclusion or use or both of any particular controlled substances, including, but not limited to, the EU
RoHS Directive, so as to be in strict compliance with such applicable laws and regulations.
● You must not use the Sanken Products or the Information for the purpose of any military applications or use, including but not
limited to the development of weapons of mass destruction. In the event of exporting the Sanken Products or the Information, or
providing them for non-residents, you must comply with all applicable export control laws and regulations in each country including
the U.S. Export Administration Regulations (EAR) and the Foreign Exchange and Foreign Trade Act of Japan, and follow the
procedures required by such applicable laws and regulations.
● Sanken assumes no responsibility for any troubles, which may occur during the transportation of the Sanken Products including the
falling thereof, out of Sanken’s distribution network.
● Although Sanken has prepared this document with its due care to pursue the accuracy thereof, Sanken does not warrant that it is
error free and Sanken assumes no liability whatsoever for any and all damages and losses which may be suffered by you resulting
from any possible errors or omissions in connection with the Information.
● Please refer to our official website in relation to general instructions and directions for using the Sanken Products, and refer to the
relevant specification documents in relation to particular precautions when using the Sanken Products.
● All rights and title in and to any specific trademark or tradename belong to Sanken and such original right holder(s).
DSGN-CEZ-16003
STR5A464x-DSE Rev.3.7
SANKEN ELECTRIC CO., LTD.
Nov. 10, 2023
https://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO., LTD. 2013
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