TRIAC( ISOLATED TYPE )
TMG8C60F
UL;E76102 M) ( TMG8C40/60F are isolated mold triac suitable for wide range of applications like copier, microwave oven, solid state switch, motor control, light and heater control.
● IT RMS) (
1 .± . 50 03
8A ● High surge capability 88A ● Full molded isolated type
3.± . 0 03
1 .± . 00 03
45 02 .± . 28 02 .± .
3.± . 85 03 6 03 .± . Solder Dip
26 02 .± . 07 ± . . 01 5 5
T1 G
1 .± . 40 05
07 ± . . 01 5 5 1 2 3 25 ± . . 02 4 5 50 ± . . 05 8
1T . 1 2. T 2 3 Gate .
T2
Unit:A
■Maximum Ratings
Symbol VDRM Symbol IT RMS) ( ITSM It
2
(Tj=25℃ unless otherwise specified)
Item Repetitive Peak Off-State Voltage Item R.M.S. On-State Current Surge On-State Current It
2
Ratings TMG8C40F 400 Conditions Tc=89℃ One cycle, 50Hz/60Hz, peak, non-repetitive TMG8C60F 600 Ratings 8 80/88 32 5 0.5 2 10 A.C.1 minute 1500 −40 to +125 −40 to +125 2
Unit V Unit A A A2S W W A V V ℃ ℃ g
PGM
( PG AV)
Peak Gate Power Dissipation Average Gate Power Dissipation Peak Gate Current Peak Gate Voltage Isolation Breakdown Voltage(R.M.S.) Operating Junction Temperature Storage Temperature Mass
IGM VGM VISO Tj Tstg
■Electrical Characteristics
Symbol IDRM VTM + I GT1
− I GT1 + I GT3 − I GT3 + V GT1
Item Reptitive Peak Off-State Current Peak On-State Voltage 1 2 3 4 1 2 3 4 Non-Trigger Gate Voltage
Critical Rate of Rise off-State Voltage at commutation
Conditions VD=VDRM, Single phase, half wave, Tj=125℃ IT=12A, Inst. measurement
Ratings Min. Typ. Max. 2 1.4 30 30 ― 30 1.5 1.5 ― 1.5 0.2 10 15
Unit mA V
Gate Trigger Current
VD=6V,RL=10Ω
mA
V GT1
+ V GT3 − V GT3
−
Gate Trigger Voltage
VD=6V,RL=10Ω
V
VGD 〔dv/dt〕 c IH
Tj=125℃,VD=1 2VDRM / Tj=125℃, di/dt〕=−4A/ms,VD=2 3VDRM 〔 c / Junction to case
V V/ s μ mA 3.7 ℃/W
Holding Current
Rth j-c) Thermal Impedance (
3
TMG8C60F
2 11 0
Gate Characteristics
Peak Forward Gate Voltage (10V)
12 0
Pe ak
On-State Voltage
5
te Po
On-State Current (A)
Gate Voltage (V)
Ga
5 2
Gate Distribution
100 5 2
Po we (0 r . 5W
Peak Gate Current 2 ( A)
Av er ag eG ate
we ( r
2 11 0 5 2 10 0 5
T= 5 j2 ℃ T =1 5 j 2℃
5W
)
)
Maximum gate Voltage that will not trigger any unit
11 0
2
5
12 0
2
5
13 0
2
5
05 .
10 .
15 .
20 .
25 .
30 .
35 .
Gate Current (mA)
On-State Voltage (V)
9
θ1 0 =8゜ θ1 0 =5゜ θ1 0 =2゜
2
8 7 6 5 4 3 2 1 0 0 1 2 3
360
。
θ9 ゜ =0
: Conduction Angle
θ6 ゜ =0 θ3 ゜ =0
Allowable Case Temperature (℃)
1 0
On State Current vs. Maximum Power Dissipation
10 3 10 2 10 1 10 0
On State Current vs. Allowable Case Temperature
Power Dissipation (W)
θ3 ゜ =0 θ6 ゜ =0 θ9 ゜ =0
2
9 0 0 0
360
。
θ1 0 =2゜ θ1 0 =5゜ θ1 0 =8゜
: Conduction Angle
4
5
6
7
8
9
1 0
1
2
3
4
5
6
7
8
9
1 0
RMS On-State Current (A)
RMS On-State Current (A)
10 0
Surge On-State Current Rating (Non-Repetitive)
1 0
3
Gate trigger voltage vs. Junction temperature
Surge On-State Current (A)
8 0 6 0
6 HZ 0
Tj=25℃ start
VGT (t℃) ×100 (%) VGT 2 ℃) (5
5 2
V+GT1 1+) ( V−GT1 1−) ( V−GT3 3−) (
12 0 5 2
4 0
5 HZ 0
2 0 0 10 0
2
5
11 0
2
5
12 0
11 0 −0 5
0
5 0
10 0
10 5
Time (cycles) Transient Thermal Impedance θ (℃/W) j-c
Junction Temp. Tj (℃)
1 0
3
Gate trigger current vs. Junction temperature
11 0 5 2 10 0 5 2
Transient Thermal Impedance
IGT (t℃) ×100 (%) IGT 2 ℃) (5
5 2
I+GT1 1+) ( I−GT1 1−) ( I−GT3 3−) (
12 0 5 2
Junction to case
11 0 −0 5
0
5 0
10 0
10 5
1 −1 0 1 −2 2 0
5 1 −1 2 0
Junction Temp. Tj (℃)
Time t sec) (
5 10 2 0
5 11 2 0
5 12 0
4
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