Ordering number : ENA1806
FW812
SANYO Semiconductors
DATA SHEET
FW812
Features
• • •
N-Channel Silicon MOSFET
General-Purpose Switching Device Applications
Low ON-resistance 4V drive Composite type with 2 MOSFETs contained in a single package, facilitating high-density mounting
Specifications
Absolute Maximum Ratings at Ta=25°C
Parameter Drain-to-Source Voltage Gate-to-Source Voltage Drain Current (DC) Drain Current (PW=10s) Drain Current (PW≤10μs) Allowable Power Dissipation Total Dissipation Channel Temperature Storage Temperature Symbol VDSS VGSS ID ID IDP PD PT Tch Tstg Duty cycle≤1% Duty cycle≤1% When mounted on ceramic substrate (2000mm2×0.8mm) 1unit, PW≤10s When mounted on ceramic substrate (2000mm2×0.8mm), PW≤10s Conditions Ratings 35 ±20 10 11.5 52 2.3 2.5 150 --55 to +150 Unit V V A A A W W °C °C
Package Dimensions
unit : mm (typ) 7005A-003
5.0 0.8 8 5 0.2 0.3
Product & Package Information
• Package : SOP8 • JEITA, JEDEC : SC-87, SOT96 • Minimum Packing Quantity : 1,000 pcs./reel
Packing Type : TL
Marking
0.1
0.8
1 1.27
4 0.43
1.8 MAX
1.5
1 : Source1 2 : Gate1 3 : Source2 4 : Gate2 5 : Drain2 6 : Drain2 7 : Drain1 8 : Drain1 SANYO : SOP8
W812
TL
6.0
4.4
LOT No.
Electrical Connection
8 7 6 5
0.7
1
2
3
4
http://semicon.sanyo.com/en/network
81110PA TK IM TC-00002270 No. A1806-1/4
FW812
Electrical Characteristics at Ta=25°C
Parameter Drain-to-Source Breakdown Voltage Zero-Gate Voltage Drain Current Gate-to-Source Leakage Current Cutoff Voltage Forward Transfer Admittance Static Drain-to-Source On-State Resistance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-ON Delay Time Rise Time Turn-OFF Delay Time Fall Time Total Gate Charge Gate-to-Source Charge Gate-to-Drain “Miller” Charge Diode Forward Voltage Symbol V(BR)DSS IDSS IGSS VGS(off) | yfs | RDS(on)1 RDS(on)2 RDS(on)3 Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd VSD Conditions ID=1mA, VGS=0V VDS=35V, VGS=0V VGS=±16V, VDS=0V VDS=10V, ID=1mA VDS=10V, ID=10A ID=10A, VGS=10V ID=5A, VGS=4.5V ID=5A, VGS=4V VDS=20V, f=1MHz VDS=20V, f=1MHz VDS=20V, f=1MHz See specified Test Circuit. See specified Test Circuit. See specified Test Circuit. See specified Test Circuit. VDS=20V, VGS=10V, ID=10A VDS=20V, VGS=10V, ID=10A VDS=20V, VGS=10V, ID=10A IS=10A, VGS=0V Ratings min 35 1 ±10 1.2 5.2 13 21 27 960 130 80 13.5 46.6 57.0 38.9 19 3.9 3.8 0.85 1.2 17 30 38 2.6 typ max Unit V μA μA V S mΩ mΩ mΩ pF pF pF ns ns ns ns nC nC nC V
Switching Time Test Circuit
10V 0V VIN VDD=20V ID=10A RL=2.0Ω D VOUT
VIN PW=10μs D.C.≤1% G
FW812 P.G 50Ω S
14.0V 10.0V
10 9 8
ID -- VDS
6.0V 4.5V
16 14 12 10 8 6 4 2 0
ID -- VGS
VDS=10V
4.0
V
Drain Current, ID -- A
7 6 5 4 3 2 1 0 0
3.5V
Drain Current, ID -- A
Ta=7 5°
1 2
C
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
25 °C
VGS=3.0V
--25° C
3
0
4 IT15794
Drain-to-Source Voltage, VDS -- V
IT15793
Gate-to-Source Voltage, VGS -- V
No. A1806-2/4
FW812
80
RDS(on) -- VGS
Ta=25°C
ID=5A Static Drain-to-Source On-State Resistance, RDS(on) -- mΩ 10A
50
RDS(on) -- Ta
Static Drain-to-Source On-State Resistance, RDS(on) -- mΩ
70 60 50 40 30 20 10 0 0 2 4 6 8 10 12 14 16
40
30
20
I =5A 4.0V, D V GS= =5A V, I D =4.5 VGS =10A V, I D =10.0 VGS
10
0 --60
--40
--20
0
20
40
60
80
100
120
140
160
Gate-to-Source Voltage, VGS -- V
10
| yfs | -- ID
C 25°
IT15891 3 2 10 7 5
Ambient Temperature, Ta -- °C
IS -- VSD
IT15796
Forward Transfer Admittance, | yfs | -- S
7 5 3 2
VDS=10V
VGS=0V
Source Current, IS -- A
7 5 3 2 0.1 0.01
3 2 0.1 7 5 3 2
2
3
5 7 0.1
2
3
5 7 1.0
2
3
Drain Current, ID -- A
2
SW Time -- ID
5 7 10 2 IT15797
0.01 0.2
0.4
Ta= 75
1.0
0.6
--25° C
0.8
25° C
°C
Ta
-2 =-
C 5° °C 75
3 2 1.0 7 5
1.0
1.2 IT15798
3
Ciss, Coss, Crss -- VDS
Diode Forward Voltage, VSD -- V
Switching Time, SW Time -- ns
100 7 5 3 2
VDD=20V VGS=10V Ciss, Coss, Crss -- pF
td(off)
f=1MHz
2
1000 7 5 3 2
Ciss
tf
td(on)
10 7 5 3 0.1
tr
Coss
100 7
Crss
0 5 10 15 20 25 30 35 IT15800
2
3
5
7
1.0
2
3
5
7
10
2 IT15892
5
Drain Current, ID -- A
10 9
VGS -- Qg
Drain-to-Source Voltage, VDS -- V
100 7 5 3 2
ASO
Gate-to-Source Voltage, VGS -- V
VDS=20V ID=10A Drain Current, ID -- A
IDP=52A (PW≤10μs)
10
ID=10A
10
DC
10 s
10
1m s
8 7 6 5 4 3 2 1 0 0 2 4 6 8 10 12 14 16 18 20
0μ s
10 μs
10 7 5 3 2 1.0 7 5 3 2 0.1 7 5 3 2
0m
ms
s
op
era
tio n
Operation in this area is limited by RDS(on). Ta=25°C Single pulse When mounted on ceramic substrate (2000mm2×0.8mm) 1unit
23 5 7 0.1 23 5 7 1.0 23 5 7 10 23 57
0.01 0.01
Total Gate Charge, Qg -- nC
IT15801
Drain-to-Source Voltage, VDS -- V
IT15802
No. A1806-3/4
FW812
When mounted on ceramic substrate (2000mm2×0.8mm), PW≤10s Allowable Power Dissipation(FET1), PD -- W
3.0
PD -- Ta
Allowable Power Dissipation, PD -- W
2.4 2.3 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 0.2 0.4
PD (FET1) -- PD (FET2)
When mounted on ceramic substrate (2000mm2×0.8mm), PW≤10s
2.5 2.3 2.0
To t
1.5
al
di
1u
ss
ip
nit
ati
on
1.0
0.5
0
0
20
40
60
80
100
120
140
160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
Ambient Temperature, Ta -- °C
IT15803
Allowable Power Dissipation(FET2), PD -- W IT15804
Note on usage : Since the FW812 is a MOSFET product, please avoid using this device in the vicinity of highly charged objects.
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This catalog provides information as of August, 2010. Specifications and information herein are subject to change without notice.
PS No. A1806-4/4