LB1947VC

Ordering number : ENA2035 Monolithic Digital IC LB1947VC Overview PWM Current Control Type Forward/Reverse Motor Driver The LB1947VC is a PWM current control type forward/reverse motor driver IC. The IC is optimal for use in driving brushed DC motors for printers. Features • PWM current control (fixed OFF time) • Selectable current decay pattern (FAST, SLOW, and MIX DECAY modes) • Simultaneous ON prevention function (feed-through current prevention) • Built-in thermal shutdown circuit • Built-in noise canceler Specifications Parameter Absolute Maximum Ratings at Ta = 25°C Symbol VBB max IO peak IO max VCC max VIN VE max VREF Pd max Topr Tstg Independent IC tw ≤ 20μs Conditions Ratings 50 2.25 2.0 7.0 -0.3 to VCC 1.1 -0.3 to VCC 1.3 -20 to +85 -55 to +150 Unit V A A V V V V W °C °C Maximum motor supply voltage Output peak current Output continuous current Logic supply voltage Logic input voltage range Emitter output voltage Reference voltage Allowable power dissipation Operating temperature Storage temperature Caution 1) Absolute maximum ratings represent the value which cannot be exceeded for any length of time. Caution 2) Even when the device is used within the range of absolute maximum ratings, as a result of continuous usage under high temperature, high current, high voltage, or drastic temperature change, the reliability of the IC may be degraded. Please contact us for the further details. Any and all SANYO Semiconductor Co.,Ltd. products described or contained herein are, with regard to "standard application", intended for the use as general electronics equipment. The products mentioned herein shall not be intended for use for any "special application" (medical equipment whose purpose is to sustain life, aerospace instrument, nuclear control device, burning appliances, transportation machine, traffic signal system, safety equipment etc.) that shall require extremely high level of reliability and can directly threaten human lives in case of failure or malfunction of the product or may cause harm to human bodies, nor shall they grant any guarantee thereof. If you should intend to use our products for new introduction or other application different from current conditions on the usage of automotive device, communication device, office equipment, industrial equipment etc. , please consult with us about usage condition (temperature, operation time etc.) prior to the intended use. If there is no consultation or inquiry before the intended use, our customer shall be solely responsible for the use. Specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer's products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer ' s products or equipment. 32112 SY 20120312-S00003 No.A2035-1/11 LB1947VC Allowable Operating Ranges at Ta = 25°C Parameter Motor supply voltage Logic supply voltage Reference voltage Symbol VBB VCC VREF Conditions Ratings 10 to 45 4.75 to 5.25 0 to VCC-2 Unit V V V Electrical Characteristics at Ta = 25°C, VCC = 5V Ratings Parameter Output Block Output stage supply current IBB ON IBB BR IBB OFF IBB wt Output saturation voltage VOsat1 VOsat2 VOsat3 VOsat4 Output leak current IO1(leak) IO2(leak) Output sustain voltage Logic Block Logic supply current ICC ON ICC BR ICC OFF ICC wt Logic pin input voltage (ST, IN1, IN2, VI) Logic pin input current (ST, IN1, IN2, VI) Sensing voltage Sensing voltage 25H Sensing voltage 25L Sensing voltage 15H Sensing voltage 15L Sensing voltage 05H Sensing voltage 05L Reference current CR pin current MD pin input voltage VINH VINL IINH IINL VE VEH25 VEL25 VEH15 VEL15 VEH05 VEL05 Iref ICR VMDH VMDM VMDL MD pin input current IMDH IMDL Thermal shutdown temperature TSD VI = High, VREF = 2.5V VI = Low, VREF = 2.5V VI = High, VREF = 1.5V VI = Low, VREF = 1.5V VI = High, VREF = 0.5V VI = Low, VREF = 0.5V VREF = 1.0V CR = 1.0V High level voltage Middle level voltage Low level voltage MD = VCC-0.5V, CR = 1.0V MD = 0.4V, CR = 2.0V Design guarantee value* -1.0 -5.0 170 IN1: High, IN2: Low, ST: High IN1: Low, IN2: High, ST: High IN1: Low, IN2: Low, ST: High ST: Low High level voltage Low level voltage VIN = 5V VIN = 0.8V 60 6 0 0.970 0.483 0.385 0.190 0.190 0.092 -0.5 -1.56 VCC-0.3 0.3VCC VCC-1.0 .0.4 +1.0 -1.3 1.0 0.5 0.4 0.2 0.2 0.1 90 10 11 11 11 1.0 2 0.8 120 13 1.1 1.030 0.513 0.410 0.210 0.210 0.108 +0.5 -1.04 16 16 16 2 21 21 21 3.0 mA mA mA mA V V μA μA V V V V V V V μA mA V V V μA μA °C VSUS No-load state, Forward No-load state, Brake No-load state, Output off No-load state, Standby mode IO = +1.0A, Sink IO = +2.0A, Sink IO = -1.0A, Source IO = -2.0A, Source VO = VBB, Sink VO = 0V, Source L = 3.9mH, IO = 2.0A, Design guarantee value* -50 50 1.2 1.6 1.8 2.1 0.4 0.2 0.2 0.6 0.4 0.4 1.0 0.8 0.8 0.1 1.5 1.9 2.2 2.4 50 mA mA mA mA V V V V μA μA V Symbol Conditions min typ max Unit * Design guarantee value, Do not measurement. No.A2035-2/11 LB1947VC Package Dimensions unit : mm (typ) 3336 21.6 (20.0) (11.0) (R1.75) HEAT SPREADER 3.0 (8.6) 17.9 (14.55) (11.0) (9.05) 3.35 0.4 1 (1.91) 1.27 0.7 15 2.54 2.54 SANYO : HZIP15 2.0 Pd max -- Ta Allowable power dissipation, Pd max -- W 1.6 1.2 0.8 0.4 0 -20 0 20 40 12.4 60 80 85 100 Ambient temperature, Ta -- C Pin Assignment LB1947VC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Top view OUTA OUTA ST VREF VI E VBB IN1 IN2 MD GND NC VCC NC CR No.A2035-3/11 LB1947VC Block Diagram OUTA 3 OUTA 1 VBB 7 MD 14 IN1 9 IN2 10 ST 6 VI 4 Control logic circuit 8 VCC VREF 12 Current select circuit One-shot multiblanking time Thermal shutdown circuit UVLO GND 15 13 CR 2 E Truth Table IN1 H H H H H H H H H H H H L L L L L L X IN2 L L L L L L H H H H H H H H H H H L X ST H H H H H H H H H H H H H H H H H H L or OPEN VI H H H L L L H H H L L L H H L L X X X MD L M H L M H L M H L M H L M L M H X X OUTA H H H H H H L L L L L L L L L L L OFF OFF OUTA L L L L L L H H H H H H L L L L L OFF OFF Operating mode Forward, 2/5 times, FAST Forward, 2/5 times, MIX Forward, 2/5 times, SLOW Forward, 1/5 times, FAST Forward, 1/5 times, MIX Forward, 1/5 times, SLOW Reverse, 2/5 times, FAST Reverse, 2/5 times, MIX Reverse, 2/5 times, SLOW Reverse, 1/5 times, FAST Reverse, 1/5 times, MIX Reverse, 1/5 times, SLOW Brake, 2/5 times, FAST Brake, 2/5 times, MIX Brake, 1/5 times, FAST Brake, 1/5 times, MIX Brake, no current limiting Output OFF Standby mode (circuit OFF) Except for MD pin, Low at input OPEN. MD M: determined by external voltage. No.A2035-4/11 LB1947VC Pin Function Pin No. 1 3 2 4 Pin name OUTA OUTA E VI Sense voltage control pin. High: sense voltage is 2/5 of VREF Low: sense voltage is 1/5 of VREF High: circuit operation ON Low: standby mode 9 IN1 High: rotation mode Low: brake mode 10 IN2 High: reverse mode Low: forward mode 7 8 12 VBB VCC VREF Motor power supply voltage. Logic power supply voltage. Output current setting reference pin. Setting range: 0 to (VCC−2V) VCC 50kΩ VCC 100μA Function Output pin. Equivalent circuit 6 ST 4 VI 40kΩ 3s 1s 12 VREF 13 14 CR MD Oscillator with self-excitation. Current attenuation switching pin. Low : FAST DECAY High: SLOW DECAY M : MIX DECAY M is set by external power supply voltage. Range : 1.1 to 4.0V 15 5, 11 GND NC Ground pin No connect No.A2035-5/11 LB1947VC Sample Application Circuits 1. Forward/reverse motor with current limiter 24V M *Schottky barrier type for external diodes. OUTA 3 MD IN1 IN2 ST VI 1 VBB 7 VCC OUTA 14 9 10 6 4 Control logic circuit 8 5V VREF 12 Current select circuit One-shot multiblanking time Thermal shutdown circuit UVLO GND 15 13 CR 2 E RE Limiter current setting method IN1 H H L L − IN2 L H H L − ST H H H H L OUTA H L L OFF OFF I = VREF/ (5 × RE) OUTA L H L OFF OFF Mode Forward Reverse Brake Output OFF Standby mode No.A2035-6/11 LB1947VC 2. Forward/reverse motor 24V M *Schottky barrier type for external diodes. OUTA 3 MD IN1 IN2 ST VI 1 VBB 7 VCC OUTA 14 9 10 6 4 Control logic circuit 8 5V VREF 12 Current select circuit One-shot multiblanking time Thermal shutdown circuit UVLO GND 15 13 CR 2 E IN1 H H L L − IN2 L H H L − ST H H H H L OUTA H L L OFF OFF OUTA L H L OFF OFF Mode Forward Reverse Brake Output OFF Standby mode No.A2035-7/11 LB1947VC 3. PWM current control forward/reverse motor (MIX DECAY) 24V M *Schottky barrier type for external diodes. OUTA 3 MD IN1 IN2 ST VI 1 VBB 7 VCC OUTA 14 9 10 6 4 Control logic circuit 8 5V VREF 12 Current select circuit One-shot multiblanking time Thermal shutdown circuit UVLO GND 15 13 CR 2 E RE No.A2035-8/11 LB1947VC Notes on Usage 1. VREF pin Because the VREF pin serves for input of the set current reference voltage, precautions against noise must be taken. 2. GND pin The ground circuit for this IC must be designed so as to allow for high-current switching. Blocks where high current flows must use low-impedance patterns and must be removed from small-signal lines. Especially the ground connection for the sensing resistor RE at pin E, and the ground connection for the Schottky barrier diodes should be in close proximity to the IC ground. The capacitors between VCC and ground, and VBB and ground should be placed close to the VCC and VBB pins, respectively. 3. CR pin setting (Switching off time, Noise cancel time) The noise cancel time (Tn) and the switching off time (Toff) are set by the following expressions: Noise cancel time: Tn ≈ C × R × ln {(1.0 − RI) / (4.0 − RI) [sec] CR charge current: 1.3mA Switching off time: Toff ≈ −C × R × ln (1.0 / 4.8) [sec] Internal configuration at CR pin VCC line One-shot multi-blanking time circuit CR C:680pF CR constant range: R = 4.7k to 100kΩ C = 330pF to 2200pF No.A2035-9/11 LB1947VC Heat sink attachment Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to the outer environment and dissipating that heat. a. Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be applied to the heat sink or tabs. b. Heat sink attachment · Use flat-head screws to attach heat sinks. · Use also washer to protect the package. · Use tightening torques in the ranges 39-59Ncm(4-6kgcm) . · If tapping screws are used, do not use screws with a diameter larger than the holes in the semiconductor device itself. · Do not make gap, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. · Take care a position of via hole . · Do not allow dirt, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. · Verify that there are no press burrs or screw-hole burrs on the heat sink. · Warping in heat sinks and printed circuit boards must be no more than 0.05 mm between screw holes, for either concave or convex warping. · Twisting must be limited to under 0.05 mm. · Heat sink and semiconductor device are mounted in parallel. Take care of electric or compressed air drivers · The speed of these torque wrenches should never exceed 700 rpm, and should typically be about 400 rpm. Binding head machine screw Countersunk head mashine screw Heat sink gap Via hole c. Silicone grease · Spread the silicone grease evenly when mounting heat sinks. · Sanyo recommends YG-6260 (Momentive Performance Materials Japan LLC) Mount · First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board. · When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin doesn't hang. When mounting the semiconductor device to the heat sink using jigs, etc., · Take care not to allow the device to ride onto the jig or positioning dowel. · Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device. Heat sink screw holes · Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used. · When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used. A hole diameter about 15% larger than the diameter of the screw is desirable. · When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about 15% smaller than the diameter of the screw is desirable. There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not recommended because of possible displacement due to fluctuation of the spring force with time or vibration. d. e. f. g. No.A2035-10/11 LB1947VC SANYO Semiconductor Co.,Ltd. assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein. SANYO Semiconductor Co.,Ltd. strives to supply high-quality high-reliability products, however, any and all semiconductor products fail or malfunction with some probability. It is possible that these probabilistic failures or malfunction could give rise to accidents or events that could endanger human lives, trouble that could give rise to smoke or fire, or accidents that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design. In the event that any or all SANYO Semiconductor Co.,Ltd. products described or contained herein are controlled under any of applicable local export control laws and regulations, such products may require the export license from the authorities concerned in accordance with the above law. No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written consent of SANYO Semiconductor Co.,Ltd. Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification" for the SANYO Semiconductor Co.,Ltd. product that you intend to use. Upon using the technical information or products described herein, neither warranty nor license shall be granted with regard to intellectual property rights or any other rights of SANYO Semiconductor Co.,Ltd. or any third party. SANYO Semiconductor Co.,Ltd. shall not be liable for any claim or suits with regard to a third party's intellctual property rights which has resulted from the use of the technical information and products mentioned above. This catalog provides information as of March, 2012. Specifications and information herein are subject to change without notice. PS No.A2035-11/11