LV56801P

Ordering number : ENA1901A Monolithic Linear IC LV56801P Overview For Car Audio Systems Multi-Power Supply System IC The LV56801P is a multi-power supply system IC that provides four regulator outputs and two high side switches as well as a number of protection functions including overcurrent protection, overvoltage protection and overheat protection. It is an optimal power supply IC for car audio and car entertainment systems and similar products. Features • Four regulator output systems For microcontroller: 3.3V output voltage, 200mA maximum output current For CD drive: 8.0V output voltage, 1300mA maximum output current For illumination: 8 to 12V output voltage (output can be set with external resistors), 300mA maximum output current For audio systems: 8 to 9V output voltage (output voltage can be set with external resistors), 300mA maximum output current • Two VCC-linked high side switch systems EXT: 350mA maximum output current, 0.5V voltage difference between input and output. ANT: 300mA maximum output current, 0.5V voltage difference between input and output. • Two VDD 3.3V-linked high side switch systems SW5V: 200mA maximum output current, 0.25V voltage difference between input and output. ACC (accessory voltage detection output): 100mA maximum output current, 0.25V voltage difference between input and output. • Overcurrent protection function • Overvoltage protection function, typ 21V (excluding VDD 3.3V output) • Overheat protection function, typ 175ºC • On-chip accessory voltage detection circuit • P-channel LDMOS used for power output block CAUTION) The protection functions are provided in order to improve the ability of the ICs to withstand breakdown, and they are not intended to guarantee safety when used under conditions outside the safe operating area or rated operating conditions. Use of the ICs under any conditions exceeding the safe operating area or above the IOmax, and especially use in overcurrent protection areas or under conditions in which they are subject to thermal protection, may reduce their reliability and result in permanent breakdown. Any and all SANYO Semiconductor Co.,Ltd. products described or contained herein are, with regard to "standard application", intended for the use as general electronics equipment. The products mentioned herein shall not be intended for use for any "special application" (medical equipment whose purpose is to sustain life, aerospace instrument, nuclear control device, burning appliances, transportation machine, traffic signal system, safety equipment etc.) that shall require extremely high level of reliability and can directly threaten human lives in case of failure or malfunction of the product or may cause harm to human bodies, nor shall they grant any guarantee thereof. If you should intend to use our products for new introduction or other application different from current conditions on the usage of automotive device, communication device, office equipment, industrial equipment etc. , please consult with us about usage condition (temperature, operation time etc.) prior to the intended use. If there is no consultation or inquiry before the intended use, our customer shall be solely responsible for the use. Specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer's products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer ' s products or equipment. O2611 SY 20111014-S00003/D2210 SY 20101201-S00007 No.A1901-1/14 LV56801P Specifications Absolute Maximum Ratings at Ta = 25°C Parameter Supply voltage Peak supply voltage Allowable Power dissipation Conditions VCC max VCC peak Pd max See below for the waveform applied. Independent IC Al heat sink * With an infinity heat sink Junction temperature Operating ambient temperature Storage temperature Tj max Topr Tstg Ta ≤ 25°C Conditions Ratings 36 50 1.5 5.6 32.5 150 -40 to +85 -55 to +150 Unit V V W W W °C °C °C * : When the Aluminum heat sink (50mm × 50mm × 1.5mm) is used Allowable Operating range at Ta = 25°C Parameter Operating supply voltage 1 Operating supply voltage 2 Conditions VDD output, SW output, ACC output ILM output at 10V ILM output at 8V Operating supply voltage 3 Operating supply voltage 4 Audio output at 9V CD output (CD output current = 1.3A) CD output (CD output current ≤ 1A) Ratings 7.5 to 16 12 to 16 10 to 16 10 to 16 10.5 to 16 10 to 16 Unit V V V V V V Electrical Characteristics at Ta = 25°C, VCC = 14.4V *: All the specifications are defined based on the tests that Tj is almost equal to Ta (=25°C). To suppress the rise of Tj in the junction temperature as much as possible, it tests by the pulse loading. Ratings Parameter Current drain CTRL1 Input Low input voltage M1 input voltage M2 input voltage High input voltage Input impedance CTRL2 Input Low input voltage M input voltage High input voltage Input impedance VDD 3.3V Output *1 Output voltage 1 Output voltage 2 Output total current Line regulation Load regulation Dropout voltage 1 Dropout voltage 2 Dropout voltage 3 Ripple rejection CD Output ; CTRL2 = ⎡H⎦ Output voltage VO2 IO2 = 1000mA 7.6 8.0 8.4 V VO1 VO1’ Ito1 ΔVOLN1 ΔVOLD1 VDROP1 VDROP1’ VDROP1” RREJ1 VIL2 VIM2 VIH2 RIH2 0 1.1 2.5 350 1.65 3.3 500 0.5 2.1 5.5 650 V V V kΩ VIL1 VIM11 VIM21 VIH1 RIH1 0 0.8 1.9 2.9 350 1.1 2.2 3.3 500 0.5 1.4 2.5 5.5 650 V V V V kΩ Symbol ICC Conditions min VDD no load, CTRL1/2 = ⎡L/L⎦, ACC = 0V typ 400 max 800 μA Unit The VDD 3.3V output supplies the output currents of SW 3.3V and ACC 3.3V. IO1 = 200mA, IO7, IO8 = 0A IO1 = 200mA, IO7 = 200mA, IO8 = 100mA VO1 ≥ 3.13V, Ito1 = IO1+IO7+IO8 7.5V < VCC < 16V, IO1 = 200mA *2 1mA < IO1 < 200mA *2 IO1 = 200mA *2 IO1 = 100mA *2 IO1+IO7+IO8 = 500mA f = 120Hz, IO1 = 200mA *2 40 3.13 3.13 500 30 70 1.0 0.7 2.5 50 90 150 1.5 1.05 3.75 3.3 3.3 3.47 3.47 V V mA mV mV V V V dB *1 : The VDD 3.3V output also supplies the output currents of SW 3.3V and ACC 3.3V. Therefore, the current supply capability of the VDD 3.3V output and its other electrical characteristics are affected by the output statuses of SW 3.3V and ACC 3.3V. *2 : SW 3.3V and ACC 3.3V are not subject to a load. Continued on next page. No.A1901-2/14 LV56801P Continued from preceding page. Ratings Parameter Output current Line regulation Load regulation Dropout voltage 1 Dropout voltage 2 Ripple rejection Symbol IO2 ΔVOLN2 ΔVOLD2 VDROP2 VDROP2’ RREJ2 VO2 ≥ 7.6V 10.5V < VCC < 16V, IO2 = 1000mA 10mA < IO2 < 1000mA IO2 = 1000mA IO2 = 500mA f = 120Hz, IO2 = 1000mA 40 Conditions min 1300 50 100 1.0 0.5 50 100 200 1.5 0.75 typ max mA mV mV V V dB Unit AUDIO (8-9V) Output ; CTRL2 = ⎡M⎦ AUDIO_F pin voltage AUDIO_F pin inflow current AUDIO output voltage 1 AUDIO output voltage 2 AUDIO output voltage 3 AUDIO output current Line regulation Load regulation Dropout voltage 1 Dropout voltage 2 Ripple rejection VI 3 IIN3 VO3 VO3’ VO3” IO3 ΔVOLN3 ΔVOLD3 VDROP3 VDROP3’ RREJ3 10V < VCC < 16V, IO3 = 200mA 1mA < IO3 < 200mA IO3 = 200mA IO3 = 100mA f = 120Hz, IO3 = 200mA 40 IO3 = 200mA, R2 = 30kΩ, R3 = 5.6kΩ *3 IO3 = 200mA, R2 = 27kΩ, R3 = 4.7kΩ *3 IO3 = 200mA, R2 = 24kΩ, R3 = 3.9kΩ *3 1.222 -1 7.65 8.13 8.6 300 30 70 0.3 0.15 50 90 150 0.45 0.23 8.0 8.5 9.0 1.260 1.298 1 8.35 8.87 9.4 V μA V V V mA mV mV V V dB ILM (8-12V) Output ; CTRL1 = ⎡M1⎦ ILM_F pin voltage ILM output voltage 1 ILM output voltage 2 ILM output voltage 3 ILM output current Line regulation Load regulation Dropout voltage 1 Dropout voltage 2 Ripple rejection Remoto (EXT) ; CTRL1 = ⎡M2⎦ Output voltage Output current ANT remoto ; CTRL1 = ⎡H⎦ Output voltage Output current SW 3.3V Output ; CTRL2 = ⎡M⎦ Output voltage 1 Output voltage 2 Output voltage 3 Output current VO7 VO7’ VO7’’ IO7 IO7 = 1mA, IO1, IO8 = 0A *5 IO7 = 80mA, IO1, IO8 = 0A *5 IO7 = 200mA, IO1, IO8 = 0A *5 VO7 ≥ 2.88 VO1-0.1 VO1-0.22 VO1-0.55 200 VO1 VO1-0.1 VO1-0.25 V V V mA VO6 IO6 IO6 = 300mA VO6 ≥ VCC-1.0 VCC-1.0 300 VCC-0.5 V mA VO5 IO5 IO5 = 350mA VO5 ≥ VCC-1.0 VCC-1.0 350 VCC-0.5 V mA VI4 VO4 VO4’ VO4” IO4 ΔVOLN4 ΔVOLD4 VDROP4 VDROP4’ RREJ4 IO4 = 200mA IO4 = 200mA, R1 = 270kΩ *4 IO4 = 200mA, R1 = 100kΩ *4 R1 = 270kΩ 12V < VCC < 16V, IO4 = 200mA, R1 = 270kΩ 1mA < IO4 < 200mA IO4 = 200mA IO4 = 100mA f = 120Hz, IO4 = 200mA 40 1.222 11.4 8.5 6.8 300 30 70 0.7 0.35 50 90 150 1.05 0.53 1.260 12.0 10.0 8.0 1.298 12.6 11.5 9.2 V V V V mA mV mV V V dB ACC Detection ; ACC Integration 3.3V output ACC detection voltage Hysteresis width Input impedance ACC output voltage 1 ACC output voltage 2 ACC output voltage 3 ACC output voltage VTH8 VHIS8 ZI8 VO8 VO8’ VO8’’ IO8 (Pull-down resistance internal) IO8 = 0.5mA, IO1, IO7 = 0A *5 IO8 = 40mA, IO1, IO7 = 0A *5 IO8 = 100mA, IO1, IO7 = 0A *5 VO8 ≥ 2.88 2.75 0.2 42 VO1-0.1 VO1-0.22 VO1-0.55 100 3.0 0.3 60 VO1 VO1-0.1 VO1-0.25 3.25 0.4 78 V V kΩ V V V mA *3 : When a component with a resistance accuracy of ±1% is used When a component with a resistance accuracy of ±0.5% is used, VO3” is 8.67V ≤ 9.0V ≤ 9.33V. *4 : When a component with a resistance accuracy of ±1% is used The absolute accuracy of the internal resistance is ±15%. *5 : Since the SW 3.3V and ACC 3.3V are output from VDD 3.3V through the SW, the voltage drops by an amount equivalent to the ON resistance of the SW. No.A1901-3/14 LV56801P Package Dimensions unit : mm (typ) 3395 21.6 (20.0) (15.8) HEAT SINK HEAT SPREADER 3.0 • Allowable power dissipation derating curve Pd max -- Ta 8 7 6 5.6 5 4 3 2 1.5 1 0 0 20 40 60 80 100 120 140 150 160 Allowable power dissipation, Pd max -- W Aluminum heat sink mounting conditions tightening torque : 39N⋅cm, using silicone grease Aluminum heat sink (50 × 50 × 1.5mm3) when using (R1.75) 17.9 (14.55) (11.0) (9.05) (9.6) 12.4 Independent IC 3.35 0.4 1 (1.91) 1.27 0.7 15 2.54 2.54 Ambient temperature, Ta -- °C SANYO : HZIP15J • Waveform applied during surge test 50V 90% 10% 16V 5msec 100msec No.A1901-4/14 LV56801P Block Diagram VCC + C1 C2 +B 7 EXT out 15 ANT out Over Voltage Protection Start up Vref + Remote EXT (VCC-0.5V) D1 350mA + C3 D2 ANT Remote (VCC-0.5V) D3 300mA 14 + D4 C4 ILM output (8V to 12V) 300mA + R1 C5 C6 ILM_F AUDIO output (8V to 9V) 300mA + R2 C7 C8 AUDIO_F R3 1 2 + CTRL1 8 (four-value control) CTRL2 6 (three-value control) OUTPUT Control + 5 4 3 CD output (8V) 1300mA + C9 C10 Thermal Shut Down GND 9 + VDD output (3.3V) 200mA 12 + C11 C12 SW output (3.3V) 13 ACC 10 + ACC output (3.3V) Output Current Limit Circuit 11 100mA 200mA Pin Function Pin No. 1 Pin name ILM ILM output pin ON when CTRL1 = M1, M2, H 12.0V/300mA Description Equivalent Circuit 7 VCC 1 2 ILM_F ILM output voltage adjustment pin 59.67kΩ 2 7kΩ 9 GND Continued on next page. No.A1901-5/14 LV56801P Continued from preceding page. Pin No. 3 Pin name CD CD output pin ON when CTRL2 = M, H 8.0V/1.3A Description Equivalent Circuit 7 VCC 3 214kΩ 40kΩ 9 4 AUDIO_F AUIDO output voltage adjustment pin GND VCC 7 5 5 AUDIO AUDIO output pin ON when CTRL2 = M, H 4 9 6 CTRL2 CTRL2 input pin three-value input GND VCC 7 6 500kΩ 9 7 8 VCC CTRL1 Supply terminal CTRL1 input pin four-value input GND 7 VCC 8 500kΩ 9 9 GND GND pin GND Continued on next page. No.A1901-6/14 LV56801P Continued from preceding page. Pin No. 10 Pin name ACC Accessory input Description Equivalent Circuit 7 VCC 10 45kΩ 15kΩ 9 11 ACC3.3V Accessory detection output ON when ACC > 3V GND VCC 7 12 VDD3.3V VDD3.3V output pin 3.3V/200mA 12 371kΩ 11 13 SW3.3V SW3.3V output pin ON when CTRL2 = M, H 13 50kΩ 50kΩ 9 125kΩ GND 14 ANT ANT output pin ON when CTRL1 = H VCC-0.5V/300mA 7 VCC 14 9 15 EXT EXT output pin ON when CTRL1 = M2, H VCC-0.5V/350mA GND 7 VCC 15 9 GND No.A1901-7/14 LV56801P CTRL Pin Output Truth Table CTRL1 L M1 M2 H ANT OFF OFF OFF ON EXT OFF OFF ON ON ILM OFF ON ON ON CTRL2 L M H CD OFF OFF ON AUDIO OFF ON ON SW5 OFF ON ON Timing Chart 21V VCC (Pin 7) VDD3.3V output (Pin 12) CTRL1 input (Pin 8) CTRL2 input (Pin 6) CD output (Pin 3) AUDIO output (Pin 5) ILM output (Pin 1) EXT output (Pin 15) ANT output (Pin 14) SW3.3V output (Pin 13) 3.0V ACC input (Pin 10) 2.7V ACC output (Pin 11) No.A1901-8/14 LV56801P Recommended Operation Circuit AUDIO_F VDD3.3V CTRL2 CTRL1 ILM_F ACC3.3V SW3.3V ACC AUDIO GND VCC ANT 2 4 6 8 10 12 14 1 R1 3 R2 5 7 9 11 13 15 + C4 + C3 D1 D2 CTRL2 C6 + C7 C11 + C12 R3 C9 + C10 CTRL1 C1 + C2 ACC ACC3.3V C13 + C14 SW3.3V D3 D4 ILM CD AUDIO VCC VDD3.3V ANT EXT ILM CD EXT Peripheral parts list Name of part C1 C2 C3 C4 C5, C7, C9, C11 C6, C8, C10, C12 Description Power supply bypass capacitor Oscillation prevention capacitor EXT output stabilization capacitor ANT output stabilization capacitor Output stabilization capacitor Output stabilization capacitor Recommended value 100μF or more 0.22μF or more 2.2μF or more 2.2μF or more 4.7μF or more 0.22μF or more ILM output voltage R1 Resistor for ILM voltage adjustment R1:without = 12.0V :270kΩ = 10.0V :100kΩ = 8.0V AUDIO output voltage R2, R3 Resistor for AUDIO voltage setting R2/R3:30kΩ/5.6kΩ = 8.0V :27kΩ/4.7kΩ = 8.5V :24kΩ/3.9kΩ = 9.0V D1, D2, D3, D4 Diode for internal device breakdown protection A resistor with resistance accuracy as low as less than ±1% must be used. Electrolytic capacitor * Ceramic capacitor * A resistor with resistance accuracy as low as less than ±1% must be used. Remarks These capacitors must be placed near the VCC and GND pins. * : In order to stabilize the regulator outputs, it is recommended that the electrolytic capacitor and ceramic capacitor be connected in parallel. Furthermore, the values listed above do not guarantee stabilization during the overcurrent protection operations of the regulator, so oscillation may occur during an overcurrent protection operation. No.A1901-9/14 LV56801P • ILM output voltage setting method Formula for ILM voltage calculation Z1 = R2 //R3 = ILM R2 ⋅ R3 R2 + R3 1 R2 59.67kΩ 2 ILM = R3 Z1=R2/R3 1.26[V ] × Z1 + 1.26[V ] R1 ILM_F Z1 = (ILM − 1.26) ⋅ R1 1.26 R3 = R2 ⋅ Z 1 R2 − Z 1 1.26V R1 7kΩ Example : ILM = 9V setting method Z1 = (9V − 1.26V )⋅ 7kΩ ≅ 43kΩ 1.26V The ILM_F voltage is determined by the internal band gap voltage of the IC (typ = 1.26V). When R3 = 150k, the ILM output voltage will be as follows: 59.67kΩ ⋅150kΩ Z1′ = ≅ 42.69kΩ 59.67kΩ + 150kΩ ILM = 1.26V × 42.69kΩ + 1.26V ≅ 8.94V 7 kΩ • AUDIO output voltage setting method Formula for AUDIO voltage calculation AUDIO = AUDIO 1.26[V ] × R1 + 1.26[V ] R2 5 R1 ( AUDIO − 1.26) = R2 1.26 R1 1.26V 4 AUDIO_F The circuit must be designed in such a way that the R1:R2 ratio satisfies the formula given above for the AUDIO voltage that has been set. R2 Example : AUDIO = 8.5V setting method R1 (8.5 − 1.26) = ≅ 5.75 R2 1.26 R1 27 kΩ = ≅ 5.74 R2 4.7 kΩ AUDIO = 1.26V × 5.74 + 1.26V ≅ 8.49V The AUDIO_F voltage is determined by the internal band gap voltage of the IC (typ = 1.26V). Note : In the above, the typical values are given in all instances for the values used and, as such, they will vary due to the effects of production-related variations of the IC and external resistors. No.A1901-10/14 LV56801P • CTRL1 Application Circuit Example (1) 3.3V input: R1 = 4.7kΩ, R2 = 10kΩ A B 0V 3.3V 0V 3.3V CTRL1 0V 1.05V 2.23V 3.20V R1 A R2 B 500kΩ CTRL1 0V 0V 3.3V 3.3V • CTRL2 Application Circuit Example (1) 3.3V input: R3 = R4 = 4.7kΩ A B 0V 3.3V 0V 3.3V CTRL2 0V 1.61V 1.61V 3.29V C D R3 R4 CTRL2 0V 0V 3.3V 500kΩ 3.3V Caution for implementing LV56801P to a system board In HZIP15J, the package used in this IC, there are several metal exposure other than the connection pins and heat-sinks as shown in the following diagrams. In the diagrams, the electric potential of 2 and 3 are the same as Pin15 and Pin1, respectively. 2 (=Pin15) is EXT pin and 3 (=Pin1) is ILM output (regulator). When the IC is implemented to the system, make sure that no attachment clamp touches the exposed Pin1/ Pin15. When the exposed Pin1/ Pin15 touch the attachment clamp (same electrical potential as GND), ILM output or VCC enter the same state as time when GND was shorted. The electric potential of the exposed metal connected to heat-sinks 1 is the same as that of sub board of the IC (GND). Therefore, even if the exposed metal and GND of the system board are adjacent to each other, there should be no problem. • HZIP15J external view Heat-sink 1 Same potential 2 15PIN Same potential 1PIN 3 Same potential Heat-sink 1 Same potential Heat-sink side 1 Heat-sink Same potential Heat-sink side :Metal exposure :Metal exposure PS No.A1901-11/14 LV56801P • Frame diagram (LV56801P) *In the system power supply other than LV56801P, pin assignment may differ. Metal exposure 1 Metal exposure 3 Metal exposure 2 Metal exposure 1 LV56801 Metal exposure 1 Metal exposure 1 1PIN 15PIN PS No.A1901-12/14 LV56801P HZIP15J Heat sink attachment Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to the outer environment and dissipating that heat. a. Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be applied to the heat sink or tabs. b. Heat sink attachment · Use flat-head screws to attach heat sinks. · Use also washer to protect the package. · Use tightening torques in the ranges 39-59Ncm(4-6kgcm) . · If tapping screws are used, do not use screws with a diameter larger than the holes in the semiconductor device itself. · Do not make gap, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. · Take care a position of via hole . · Do not allow dirt, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. · Verify that there are no press burrs or screw-hole burrs on the heat sink. · Warping in heat sinks and printed circuit boards must be no more than 0.05 mm between screw holes, for either concave or convex warping. · Twisting must be limited to under 0.05 mm. · Heat sink and semiconductor device are mounted in parallel. Take care of electric or compressed air drivers · The speed of these torque wrenches should never exceed 700 rpm, and should typically be about 400 rpm. Binding head machine screw Countersunk head mashine screw Heat sink gap Via hole c. Silicone grease · Spread the silicone grease evenly when mounting heat sinks. · Sanyo recommends YG-6260 (Momentive Performance Materials Japan LLC) Mount · First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board. · When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin doesn't hang. When mounting the semiconductor device to the heat sink using jigs, etc., · Take care not to allow the device to ride onto the jig or positioning dowel. · Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device. Heat sink screw holes · Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used. · When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used. A hole diameter about 15% larger than the diameter of the screw is desirable. · When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about 15% smaller than the diameter of the screw is desirable. There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not recommended because of possible displacement due to fluctuation of the spring force with time or vibration. d. e. f. g. PS No.A1901-13/14 LV56801P SANYO Semiconductor Co.,Ltd. assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein. SANYO Semiconductor Co.,Ltd. strives to supply high-quality high-reliability products, however, any and all semiconductor products fail or malfunction with some probability. It is possible that these probabilistic failures or malfunction could give rise to accidents or events that could endanger human lives, trouble that could give rise to smoke or fire, or accidents that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design. In the event that any or all SANYO Semiconductor Co.,Ltd. products described or contained herein are controlled under any of applicable local export control laws and regulations, such products may require the export license from the authorities concerned in accordance with the above law. No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written consent of SANYO Semiconductor Co.,Ltd. Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification" for the SANYO Semiconductor Co.,Ltd. product that you intend to use. Upon using the technical information or products described herein, neither warranty nor license shall be granted with regard to intellectual property rights or any other rights of SANYO Semiconductor Co.,Ltd. or any third party. SANYO Semiconductor Co.,Ltd. shall not be liable for any claim or suits with regard to a third party's intellctual property rights which has resulted from the use of the technical information and products mentioned above. This catalog provides information as of December, 2011. Specifications and information herein are subject to change without notice. PS No.A1901-14/14