LV56831P

Ordering number : ENA1983 Monolithic Linear IC LV56831P Overview For Car Audio Systems Multi Voltage Regulator IC The LV56831P has 4 system regulator, VDD 5V(3.3V), AUDIO(8.5V), AMP remote(12V) and REG(3.3V/5V select). About protection circuits, it has Over-current-protection, Over-voltage-protection and Thermal-shut-down. AMP remote and REG supply is independent terminal from VCC., Features • 4 system regulator VDD(LCD micon) : VOUT 5.0V(3.3V), IO max 300mA, reverse current prevention. Audio : VOUT 8.5V, IO max 400mA AMP remote : VOUT 12V, IO max 500mA REG3.3/5V : VOUT 3.3V(5V), IO max 500mA • Over-current-protection • Over-voltage-protection: Typ 21V(except VDD) • Applied Pch-LDMOS for output stages. • Thermal-shut-down Typ 175ºC (Warning)The protector functions only improve the IC’s tolerance and they do not guarantee the safety of the IC if used under the conditions out of safety range or ratings. Use of the IC such as use under overcurrent protection range or thermal shut down state may degrade the IC’s reliability and eventually damage the IC. Specifications Absolute Maximum Ratings at Ta = 25°C Parameter Supply voltage Allowable Power dissipation Conditions VCC max Pd max (*Ta ≤ 25°C) IC unit With Al heatsink(50×50×1.5mm3) Infinite heat rediation Peak supply voltage Operating ambient temperature Storage temperature Junction temperature VCC peak Topr Tstg Tj max See below pulse wave. Conditions Ratings 36 1.3 5.3 26 50 -40 to +85 -55 to +150 150 Unit V W W W V °C °C °C Any and all SANYO Semiconductor Co.,Ltd. products described or contained herein are, with regard to "standard application", intended for the use as general electronics equipment. The products mentioned herein shall not be intended for use for any "special application" (medical equipment whose purpose is to sustain life, aerospace instrument, nuclear control device, burning appliances, transportation machine, traffic signal system, safety equipment etc.) that shall require extremely high level of reliability and can directly threaten human lives in case of failure or malfunction of the product or may cause harm to human bodies, nor shall they grant any guarantee thereof. If you should intend to use our products for new introduction or other application different from current conditions on the usage of automotive device, communication device, office equipment, industrial equipment etc. , please consult with us about usage condition (temperature, operation time etc.) prior to the intended use. If there is no consultation or inquiry before the intended use, our customer shall be solely responsible for the use. Specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer's products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer ' s products or equipment. O2611 SY 20111014-S00007 No.A1983-1/7 LV56831P Peak voltage testing pulse wave 50V 90% 10% 16V 5msec 100msec Recommended Operating condition at Ta = 25°C Parameter Power supply voltage rating 1 Power supply voltage rating 2 Power supply voltage rating 3 Power supply voltage rating 4 VDD output(5V/3.3V) REG output(5V3.3V): VCC=VCC1 AUDIO output AMP remote output: VCC=VCC1 Conditions Ratings 7 to 16 7 to 16 11 to 16 13 to 16 Unit V V V V Electrical Characteristics at Ta = 25°C, VCC = VCC1 =14.4V (*1) Ratings Parameter Quiescent current AUDIO_EN Input Low input voltage High input voltage Input impedance AMP_EN Input Low input voltage High input voltage Input impedance REG_EN input Low input voltage High input voltage Input impedance VIL3 VIH3 RIH3 0 2.0 280 400 0.5 5.5 520 V V kΩ VIL2 VIH2 RIH2 0 2.0 280 400 0.5 5.5 520 V V kΩ VIL1 VIH1 RIH1 0 2.0 280 400 0.5 5.5 520 V V kΩ Symbol ICC Conditions min VDD no load, ALL EN terminal = ⎡L⎦ typ 50 max 100 μA Unit VDD (5V/3.3V)output(reverse current prevention diode implemented) VDD output voltage 1 VDD output current 1 VDD output voltage 2 VDD output current 2 Line regulation Load regulation Dropout voltage 1 VCC ripple rejection VDD reverse current VO11 IO11 VO12 IO12 ΔVOLN1 ΔVOLD1 VDROP1 RREJ1 IREV IO11 = 200mA, IKVDD is connected to 5PIN. VO11 ≥ 4.7V IO12 = 200mA, IKVDD=GND VO12 ≥ 3.1V 7V < VCC < 16V, IO1 = 200mA 1mA < IO11, IO12 < 200mA IO1 = 200mA (implemented diode) f=120Hz, IO1=200mA VO11=5.0V, VCC=0V 40(*2) 4.75 300 3.13 300 50 80 1.5 50(*2) 10 100 100 150 2.5 3.3 3.47 5.0 5.25 V mA V mA mV mV V dB μA AMP remote output ; AMP_EN = High USB output voltage 1 USB output current 1 Line regulation Load regulation Dropout voltage 1 VCC1 ripple rejection VO2 IO2 ΔVOLN2 ΔVOLD2 VDROP2 RREJ2 IO2 = 400mA VO2 ≥ 11.3V 13V < VCC1 < 16V, IO2 = 400mA 10mA < IO2 < 400mA IO2 = 400mA f=120Hz, IO2=400mA 40(*2) 11.4 500 50 80 0.4 50(*2) 100 160 0.8 12 12.6 V mA mV mV V dB Continued on next page. No.A1983-2/7 LV56831P Continued from preceding page. Ratings Parameter AUDIO output ; AUDIO_EN = High AUDIO output voltage AUDIO output current Line regulation Load regulation Dropout voltage VCC ripple rejection VO3 IO3 ΔVOLN3 ΔVOLD3 VDROP3 RREJ3 IO3 = 300mA VO3 ≥ 8V 10V < VCC < 16V, IO3 = 300mA 1mA < IO3 < 300mA IO3 = 300mA f = 120Hz, IO3=300mA 40(*2) 8.1 400 30 70 0.6 50(*2) 100 140 1.05 8.5 8.9 V μA mV mV V dB Symbol Conditions min typ max Unit REG (3.3V/5V) Output ; REG_EN = High REG output voltage 1 REG output current 1 REG output voltage 2 REG output current 2 Line regulation Load regulation Dropout voltage VO41 IO41 VO42 IO42 ΔVOLN4 ΔVOLD4 VDROP4 IO41 = 400mA, IKREG is connected to 10PIN. VO41 ≥ 4.7V IO42 = 400mA, IKREG=GND VO42 ≥ 3.1V 7V < VCC1 < 16V, IO4 = 400mA 1mA < IO4 < 400mA IO4 = 400mA 4.75 500 3.13 500 30 80 1.0 100 150 1.5 3.3 3.47 5 5.25 V mA V mA mV mV V VCC1 ripple rejection RREJ4 f = 120Hz, IO4=400mA 40(*2) 50(*2) dB *1: The entire specification has been defined based on the tests performed under the conditions where Tj and Ta(=25°C) are almost equal. There tests were performed with pulse load to minimize the increase of junction temperature(Tj). *2 : design certification Package Dimensions unit : mm (typ) 3336 21.6 (20.0) (11.0) (R1.75) HEAT SPREADER 3.0 (8.6) 17.9 (14.55) (11.0) (9.05) 3.35 0.4 1 (1.91) 1.27 0.7 15 2.54 2.54 SANYO : HZIP15 Pin assignment AUDIO_EN 2 4 6 8 10 12 14 1 3 5 7 9 11 13 15 REG3.3V/5V REG_EN AMP_EN LV56831P IKVDD (NC) AUDIO VCC VCC 1 (NC) VDD 12.4 AMP12V IKREG (NC) GND No.A1983-3/7 LV56831P Allowable power dissipation derating curve 8 Pd max -- Ta Allowable power dissipation, Pd max - W 7 6 5.3 5 Al heat sink (50 × 50 × 1.5mm3) 4 3 2 1.3 1 0 0 25 50 75 100 125 150 IC unit (a) IC unit(HZIP15) (b) With Al heatsink(50×50×1.5mm3) Al heatsink mounting conditions Tightening torque: 39N·cm, using silicone grease Ambient temperature, Ta - C Block Diagram B+ VCC + 8 OverVoltage Protection Start up Vref + AUDIO(8.5V) 3 + 400mA + 5 VDD(5V/3.3V) + 300mA IKVDD: VDD(3.3/5.0V) select IKVDD=5PIN(VDD :5.0V) IKVDD=GND: 3.3V VCC1 + ex.) DC-DC AUDIO_EN 2 OUTPUT REG_EN 10 Control AMP_EN 12 + 6 9 13 AMP remote(12V) + 500mA Thermal Shut Down GND 14 + 11 IKREG: REG(3.3/5V) select IKREG=10PIN(REG_EN): 5V IKREG=GND: 3.3V 15 REG(3.3V/5V) + 500mA No.A1983-4/7 LV56831P Pin Function Pin No. 1 2 Pin name N.C. AUDIO_EN AUDIO output CTRL Description Equivalent Circuit - 8 VCC 2 14 3 AUDIO AUDIO output when AUDIO_EN = High, ON 8.5V/0.4A GND 8 VCC 3 14 4 5 N.C. VDD VDD output 5.0V, 3.3V/0.3A - GND 8 VCC 5 14 6 IKVDD VDD output voltage select OPEN : VDD = 5.0V GND : VDD = 3.3V GND 8 VCC 6 14 7 8 N.C. VCC VCC - GND 8 VCC 9 9 VCC1 VCC1 14 GND Continued on next page. No.A1983-5/7 LV56831P Continued from preceding page. Pin No. 10 Pin name REG_EN REG output CTRL Description Equivalent Circuit 8 VCC1 10 14 11 IKREG REG output voltage select OPEN : REG = 3.3V GND : REG = 5.0V GND VCC1 8 11 14 12 AMP_EN AMP output CTRL GND 8 VCC1 12 14 13 AMP AMP output when AMP_EN = High, ON 12V, 0.5A GND 8 VCC1 13 14 14 15 GND REG GND REG output when REG_EN = High, ON 5.0V, 3.3V/0.5A GND 8 VCC1 15 14 GND No.A1983-6/7 LV56831P Timing Chart 21V VCC (8PIN) VCC1 (9PIN) VDD (5PIN) AMP_EN (12PIN) AMP (13PIN) AUDIO_EN (2PIN) AUDIO (3PIN) REG_EN (10PIN) REG (15PIN) No.A1983-7/7 LV56831P HZIP15 Heat sink attachment Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to the outer environment and dissipating that heat. a. Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be applied to the heat sink or tabs. b. Heat sink attachment · Use flat-head screws to attach heat sinks. · Use also washer to protect the package. · Use tightening torques in the ranges 39-59Ncm(4-6kgcm) . · If tapping screws are used, do not use screws with a diameter larger than the holes in the semiconductor device itself. · Do not make gap, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. · Take care a position of via hole . · Do not allow dirt, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. · Verify that there are no press burrs or screw-hole burrs on the heat sink. · Warping in heat sinks and printed circuit boards must be no more than 0.05 mm between screw holes, for either concave or convex warping. · Twisting must be limited to under 0.05 mm. · Heat sink and semiconductor device are mounted in parallel. Take care of electric or compressed air drivers · The speed of these torque wrenches should never exceed 700 rpm, and should typically be about 400 rpm. Binding head machine screw Countersunk head mashine screw Heat sink gap Via hole c. Silicone grease · Spread the silicone grease evenly when mounting heat sinks. · Sanyo recommends YG-6260 (Momentive Performance Materials Japan LLC) Mount · First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board. · When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin doesn't hang. When mounting the semiconductor device to the heat sink using jigs, etc., · Take care not to allow the device to ride onto the jig or positioning dowel. · Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device. Heat sink screw holes · Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used. · When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used. A hole diameter about 15% larger than the diameter of the screw is desirable. · When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about 15% smaller than the diameter of the screw is desirable. There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not recommended because of possible displacement due to fluctuation of the spring force with time or vibration. d. e. f. g. No.A1983-8/7 LV56831P SANYO Semiconductor Co.,Ltd. assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein. SANYO Semiconductor Co.,Ltd. strives to supply high-quality high-reliability products, however, any and all semiconductor products fail or malfunction with some probability. It is possible that these probabilistic failures or malfunction could give rise to accidents or events that could endanger human lives, trouble that could give rise to smoke or fire, or accidents that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design. In the event that any or all SANYO Semiconductor Co.,Ltd. products described or contained herein are controlled under any of applicable local export control laws and regulations, such products may require the export license from the authorities concerned in accordance with the above law. No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written consent of SANYO Semiconductor Co.,Ltd. Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification" for the SANYO Semiconductor Co.,Ltd. product that you intend to use. Upon using the technical information or products described herein, neither warranty nor license shall be granted with regard to intellectual property rights or any other rights of SANYO Semiconductor Co.,Ltd. or any third party. SANYO Semiconductor Co.,Ltd. shall not be liable for any claim or suits with regard to a third party's intellctual property rights which has resulted from the use of the technical information and products mentioned above. This catalog provides information as of October, 2011. Specifications and information herein are subject to change without notice. PS No.A1983-9/9