LV5692P

Ordering number : ENA1876B LV5692P Overview Monolithic Linear IC For Car Audio Systems Multi-Power Supply System IC LV5692P is a multiple voltage regulator for car audio system, which allows reduction of quiescent current. This IC has 5 systems of voltage regulator pre-driver for P-FET which generates USB power and a high side switch for external devices. The following protection circuits are integrated: over current protector, overvoltage protector and Thermal Shut Down. This IC is suitable for use in car audio with USB port. Features • Five channel regulator and one channel P-FET pre-driver (for USB-power) For VDD: VOUT is 3.3V, IOmax is 300mA For DSP: VOUT is 3.3V, IOmax is 300mA For CD: VOUT is 8.0V, IOmax is 1300mA For illumination: VOUT is 8.4V, IOmax is 500mA For audio systems: VOUT is 8.4V, IOmax is 500mA For USB (controller), VOUT is flexible (configurable with external resistor), IOmax is 1000mA • High side switch: Voltage difference between input and output is 0.5V, IOmax is 500mA • Over current protector • Overvoltage protector (Without VDD-OUT) Clamp voltage is 21V (typical) • Thermal Shut down 175ºC (typical) • Quiescent current 50μA (Typ. when only VDD is in operation) (Warning) The protector functions only improve the IC’s tolerance and they do not guarantee the safety of the IC if used under the conditions out of safety range or ratings. Use of the IC such as use under over current protection range or thermal shutdown state may degrade the IC’s reliability and eventually damage the IC. Any and all SANYO Semiconductor Co.,Ltd. products described or contained herein are, with regard to "standard application", intended for the use as general electronics equipment. The products mentioned herein shall not be intended for use for any "special application" (medical equipment whose purpose is to sustain life, aerospace instrument, nuclear control device, burning appliances, transportation machine, traffic signal system, safety equipment etc.) that shall require extremely high level of reliability and can directly threaten human lives in case of failure or malfunction of the product or may cause harm to human bodies, nor shall they grant any guarantee thereof. If you should intend to use our products for new introduction or other application different from current conditions on the usage of automotive device, communication device, office equipment, industrial equipment etc. , please consult with us about usage condition (temperature, operation time etc.) prior to the intended use. If there is no consultation or inquiry before the intended use, our customer shall be solely responsible for the use. Specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer's products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer ' s products or equipment. O2611 SY 20111018-S00001/D2210 SY 20101208-S00002/N2410 SY 20101102-S00003 No.A1876-1/14 LV5692P Specifications Absolute Maximum Ratings at Ta = 25°C Parameter Power supply voltage Power dissipation Conditions VCC max Pd max IC unit At using Al heat sink At infinity heat sink Peak voltage Junction temperature Operating temperature Storage temperature VCC peak Tj max Topr Tstg Regarding Bias wave, refer to below the pulse. Ta ≤ 25°C Conditions Ratings 36 1.5 5.6 32.5 50 150 -40 to +85 -55 to +150 Unit V W W W V °C °C °C Recommended Operating range at Ta = 25°C Parameter Power supply voltage rating 1 Power supply voltage rating 2 Power supply voltage rating 3 Conditions VDD output ON, DSP output ON ILM output ON Audio output ON, CD output ON Ratings 7 to 16 10.8 to 16 10 to 16 Unit V V V * VCC1 should be as follows: VCC1>VCC-0.7V Electrical Characteristics at Ta = 25°C, VCC = VCC1=14.4V Ratings Parameter Current drain CTRL1 Input Low input voltage Middle input voltage High input voltage Input impedance CTRL2 Input Low input voltage Middle1 input voltage Middle2 input voltage High input voltage Input impedance CTRL3 input. Low input voltage High input voltage Input impedance VDD3.3V output Output voltage Output current Line regulation Load regulation Ripple rejection VO1 IO1 ΔVOLN1 ΔVOLD1 RREJ1 IO1 = 200mA VO1 ≥ 3.1V 7.5V < VCC1 < 16V, IO1 = 200mA 1mA < IO1 < 200mA f = 120Hz, IO1 = 200mA 30 3.16 300 30 70 40 100 150 3.3 3.45 V mA mV mV dB VIL3 VIH3 RIH3 0 2.5 280 400 0.3 5.5 520 V V kΩ VIL2 VIM12 VIM22 VIH2 RIH2 0 0.8 1.9 2.9 280 1.06 2.13 3.2 400 0.3 1.4 2.4 5.5 520 V V V V kΩ VIL1 VIM1 VIH1 RIH1 0 1.1 2.5 280 400 1.65 0.3 2.1 5.5 520 V V V kΩ Symbol ICC Conditions min VDD no load, CTRL1/2/3 = ⎡L/L/L⎦ typ 50 max 100 μA Unit USB output: CTRL3 = ⎡H⎦ (When external power FET SANYO 2SJ650, it external resists 27kΩ, and 9.1kΩ is set) USB output voltage USB output current Line regulation Load regulation Dropout voltage Ripple rejection VO2 IO2 ΔVOLN2 ΔVOLD2 VDROP2 RREJ1 IO2 = 1000mA VO2 ≥ 4.75V 10V < VCC < 16V, IO2 = 1000mA 10mA < IO2 < 1000mA IO2 = 1000mA f = 120Hz, IO2 = 1000mA 40 4.75 1000 50 100 1.0 50 90 150 1.5 5 5.25 V mA mV mV V dB Continued on next page. No.A1876-2/14 LV5692P Continued from preceding page. Ratings Parameter Symbol Conditions min AUDIO (8.4V) Output ; CTRL1 = ⎡M or H⎦ AUDIO output voltage 1 AUDIO output current Line regulation Load regulation Dropout voltage 1 Dropout voltage 2 Ripple rejection VO3 IO3 ΔVOLN3 ΔVOLD3 VDROP3 VDROP3’ RREJ3 IO3 = 400mA VO3 ≥ 8.0V 10V < VCC < 16V, IO3 = 400mA 1mA < IO3 < 400mA IO3 = 400mA IO3 = 200mA f = 120Hz, IO3 = 400mA 40 8.0 500 30 70 0.4 0.2 50 90 150 0.8 0.4 8.4 8.8 V mA mV mV V V dB typ max Unit ILM (8.4V) Output ; CTRL2 = ⎡M1 or H⎦ ILM output voltage ILM output current Line regulation Load regulation Dropout voltage 1 Dropout voltage 2 Ripple rejection AMP_HS-SW; CTRL2 = ⎡M2 or H⎦ Output voltage Output current VO5 IO5 IO5 = 500mA VO5 ≤ VCC-1.0 VCC-1.0 350 VCC-0.5 V mA VO4 IO4 ΔVOLN4 ΔVOLD4 VDROP4 VDROP4’ RREJ4 10.8V < VCC < 16V, IO4 = 400mA 1mA < IO4 < 400mA IO4 = 400mA IO4 = 200mA f = 120Hz, IO4 = 400mA 40 IO4 = 400mA 8.0 500 30 70 1.0 0.7 50 90 150 1.5 1.05 8.4 8.8 V mA mV mV V V dB DSP(3.3V output); CTRL1 = ⎡M or H⎦ DSP output voltage DSP output current Line regulation Load regulation Ripple rejection CD(8.0V output); CTRL1 = ⎡H⎦ CD output voltage CD output current Line regulation Load regulation Dropout voltage Ripple rejection VO8 IO8 ΔVOLN8 ΔVOLD8 VDROP8 RREJ8 10.5V < VCC < 16V, IO8 = 1000mA 10mA < IO8 < 1000mA IO8 = 1000mA f = 120Hz, IO8 = 1000mA 40 IO8 = 1000mA 7.6 1300 50 100 1.0 50 100 200 1.5 8.0 8.4 V mA mV mV V dB VO7 IO7 ΔVOLN7 ΔVOLD7 RREJ7 10V < VCC < 16V, IO7 = 200mA 1mA < IO7 < 200mA f = 120Hz, IO7 = 200mA 40 IO7 = 200mA 3.1 300 30 70 50 90 150 3.3 3.5 V mA mV mV dB Package Dimensions unit : mm (typ) 3395 21.6 (20.0) (15.8) HEAT SINK HEAT SPREADER 3.0 • Allowable power dissipation derating curve Pd max -- Ta 8 7 6 5.6 5 4 3 2 1.5 1 0 0 20 40 60 80 100 120 140 150 160 Allowable power dissipation, Pd max -- W Aluminum heat sink mounting conditions tightening torque : 39N⋅cm, using silicone grease Aluminum heat sink (50 × 50 × 1.5mm3) when using (R1.75) 17.9 (14.55) (11.0) (9.05) (9.6) 12.4 Independent IC 3.35 0.4 1 (1.91) 1.27 0.7 15 2.54 2.54 Ambient temperature, Ta -- °C SANYO : HZIP15J No.A1876-3/14 LV5692P • Waveform applied during surge test 50V 90% 10% 16V 5msec 100msec CTRL Pin Output Truth Table CTRL1 L M H CD OFF OFF ON DSP OFF ON ON AUDIO OFF ON ON CTRL3 L H USB OFF ON CTRL2 L M1 M2 H EXT OFF OFF ON ON ILM OFF ON OFF ON Example of CTRL2 application circuit EXT ILM 0V 3.3V 0V 3.3V CTRL2 0V 1.06V 2.13V 3.20V EXT CTRL2 0V 0V 3.3V 3.3V ILM note) The control terminal is input 3.3V correspondence. Please set it by the input resistance at 5V input. No.A1876-4/14 LV5692P Block Diagram VCC EXT out Over Voltage Protection AMP_HS-SW(VCC-1V) 500mA Start up Vref + ILM output (8.4V) 500mA + CTRL1 OUTPUT CTRL2 Control CTRL3 + Ilim AUDIO output (8.4V) 500mA Recommendation FET:2SJ650 USB output (5V) 1000mA Thermal Shut Down + CD output (8V) 1300mA VCC1 VCC GND + VDD output (3.3V) 300mA + DSP output (3.3) 300mA No.A1876-5/14 LV5692P Pin Function Pin No. 1 Pin name ILM ILM output pin ON when CTRL2 = M1, H 8.4V/0.5A Description Equivalent Circuit 15 VCC 1 2 2 3 GND CD GND pin CD output pin ON when CTRL1 = H 8.0V/1.3A GND 15 VCC 3 2 4 CTRL1 CTRL1 input pin Three value input GND 15 VCC 4 2 5 AUDIO AUDIO output pin ON when CTRL1 = M, H 8.4V/0.5A GND 15 VCC 5 2 GND Continued on next page. No.A1876-6/14 LV5692P Continued from preceding page. Pin No. 6 Pin name CTRL2 CTRL2 input pin Four-value input Description Equivalent Circuit 15 VCC 6 2 7 DSP DSP output pin ON when CTRL1 = M, H 3.3V/0.3A GND 15 VCC 7 2 8 CTRL3 CTRL3 input pin Two-value input GND VCC 15 8 2 9 FB USB-FB pin 1.26V GND 15 VCC 9 2 GND Continued on next page. No.A1876-7/14 LV5692P Continued from preceding page. Pin No. 10 Pin name USBGT 12.0V Description Pch-FET gate connect pin Equivalent Circuit 15 VCC 10 2 11 EXT EXT output pin ON when CTRL2 = M2, H VCC-0.5V/500mA GND VCC 15 11 2 12 RSNS USB current detection resistance connection pin 14.3V GND VCC 15 12 2 13 VDD VDD output pin 3.3V/0.3A GND 15 VCC 13 2 14 15 VCC1 VCC VDD power supply pin Power supply pin GND VCC 15 14 VCC1 2 GND No.A1876-8/14 LV5692P Timing Chart 21V VCC (15PIN) 21V VCC1 (14PIN) 4.5V VDD output (13PIN) CTRL1 input (4PIN) CTRL2 input (6PIN) CTRL3 input (8PIN) AUDIO output (5PIN) DSP output (7PIN) CD output (3PIN) ILM output (1PIN) EXT output (11PIN) USB output (FET-OUT) No.A1876-9/14 LV5692P Recommended Operation Circuit CTRL2 USBGT CTRL1 CTRL3 RSNS AUDIO VDD VCC1 14 GND ILM DSP 2 CD 4 6 8 FB 10 C14 + 12 1 3 5 7 9 11 13 C16 + D2 D3 15 C15 C20 + C19 CTRL1 C2 + C1 C4 + C3 C6 + C5 CTRL2 C8 + C7 CTRL3 C12 C13 R1 R2 EXT USB R3 C18 + VDD C17 D1 ILM CD AUDIO DSP C11 C10 + VCC VCC Remarks Peripheral parts list Name of part C2, C4, C6, C8, C11, C16 C1, C3, C5, C7, C10, C15 C12, C13 C18, C20 C17, C19 C14 R1, R2 R3 M1 D1 D2, D3 Description Output stabilization capacitor Output stabilization capacitor Capacity for phase amends Power supply bypass capacitor Oscillation prevention capacitor EXT output stabilization capacitor Resistor for ILM voltage adjustment Resistor for AUDIO voltage setting USB output Pch-FET Diode for prevention of backflow Diode for internal element protection SANYO SB1003M3 Recommended value 10μF or more* 0.22μF or more* C12=1000pF (C13=0pF: TBD) 100μF or more 0.22μF or more 2.2μF or more R1/R2=9.1kΩ/27kΩ for 5.0V 0.1Ω for Ipeak=3A SANYO 2SJ650 A resistor with resistance accuracy as low as less than ±1% must be used. Panasonic ERJB1CFR10U(Reference) These capacitors must be placed near the VCC and GND pins. Electrolytic capacitor Ceramic capacitor Ceramic capacitor note)The circuit diagram and the values are only tentative which are subject to change. * : Make sure that the capacitors of the output pins are 10μF or higher and ESR is 10Ω or lower in total and temperature characteristics and accuracy are taken into consideration. Also the E-cap should have good high frequency characteristics. • USB output voltage setting method Formula for USB voltage calculation VCC RSNS USBGT 12 10 USB R2 1.26[V] R1 × R2 + 1.26[V] R2 (USB-1.26) R1 = 1.26 USB = Please design so that the ratio of R1 and R2 may fill the above-mentioned expression for the set USB voltage. R2 (5.0-1.26) 2.968 R1 = 1.26 R2 27kΩ R1 = 9.1kΩ 2.967 1.26V 9 R1 The FB voltage is determined by the internal band gap voltage of the IC (typ = 1.26V) USB = 1.26V × 2.967 + 1.26V EXT 4.998V No.A1876-10/14 LV5692P • How to set USB overcurrent limit value (OCP) OCP of the USB works when the voltage of RSNS is under VCC-0.3V. The peak current value of OCP is calculated as follws: Ipeak(A) =0.3/R3. (ex.) R3=0.1Ω → Ipeak=3A Output voltage • Since this IC does not detect the heat generation of the external FET, keep the temperature of the FET as low as possible so as not to exceed the eatings. • Recommended FET: SANYO 2SJ650. (note)The above values were obtained under typcal conditions. The values may fluctuate in manufacturing processes due to external resistor and IC variation. Outout current Ipeak • Warning The internal circuit of USBGT and RSNS consist of components that support 5V. Do not bias 7V or above between VCC and these pins to prevent the IC from destruction. Caution for implementing LV5692P to a system board The package of LV5692P is HZIP15J which has some metal exposures other than connection pins and heatsink as shown in the diagram below. The electrical potentials of (2) and (3) are the same as those of pin 15 and pin 1, respectively. (2) (=pin 15) is the VCC pin and (3) (=pin 1) is the ILM (regulator) output pin. When you implement the IC to the set board, make sure that the bolts and the heatsink are out of touch from (2) and (3). If the metal exposures touch the bolts which has the same electrical potential with GND, GND short occurs in ILM output and VCC. The exposures of (1) are connected to heatsink which has the same electrical potential with substrate of the IC chip (GND). Therefore, (1) and GND electrical potential of the set board can connect each other. • HZIP15J outline Heat-sink 1 Same potential 2 15PIN Same potential 1PIN 3 Same potential Heat-sink 1 Same potential Heat-sink side 1 Heat-sink Same potential Heat-sink side :Metal exposure :Metal exposure PS No.A1876-11/14 LV5692P • Frame diagram (LV5692P) *In the system power supply other than LV5692P, pin assignment may differ. Metal exposure 1 Metal exposure 3 Metal exposure 2 Metal exposure 1 LV5692 Metal exposure 1 Metal exposure 1 1PIN 15PIN PS No.A1876-12/14 LV5692P HZIP15J Heat sink attachment Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to the outer environment and dissipating that heat. a. Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be applied to the heat sink or tabs. b. Heat sink attachment · Use flat-head screws to attach heat sinks. · Use also washer to protect the package. · Use tightening torques in the ranges 39-59Ncm(4-6kgcm) . · If tapping screws are used, do not use screws with a diameter larger than the holes in the semiconductor device itself. · Do not make gap, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. · Take care a position of via hole . · Do not allow dirt, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. · Verify that there are no press burrs or screw-hole burrs on the heat sink. · Warping in heat sinks and printed circuit boards must be no more than 0.05 mm between screw holes, for either concave or convex warping. · Twisting must be limited to under 0.05 mm. · Heat sink and semiconductor device are mounted in parallel. Take care of electric or compressed air drivers · The speed of these torque wrenches should never exceed 700 rpm, and should typically be about 400 rpm. Binding head machine screw Countersunk head mashine screw Heat sink gap Via hole c. Silicone grease · Spread the silicone grease evenly when mounting heat sinks. · Sanyo recommends YG-6260 (Momentive Performance Materials Japan LLC) Mount · First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board. · When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin doesn't hang. When mounting the semiconductor device to the heat sink using jigs, etc., · Take care not to allow the device to ride onto the jig or positioning dowel. · Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device. Heat sink screw holes · Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used. · When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used. A hole diameter about 15% larger than the diameter of the screw is desirable. · When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about 15% smaller than the diameter of the screw is desirable. There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not recommended because of possible displacement due to fluctuation of the spring force with time or vibration. d. e. f. g. PS No.A1876-13/14 LV5692P SANYO Semiconductor Co.,Ltd. assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein. SANYO Semiconductor Co.,Ltd. strives to supply high-quality high-reliability products, however, any and all semiconductor products fail or malfunction with some probability. It is possible that these probabilistic failures or malfunction could give rise to accidents or events that could endanger human lives, trouble that could give rise to smoke or fire, or accidents that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design. In the event that any or all SANYO Semiconductor Co.,Ltd. products described or contained herein are controlled under any of applicable local export control laws and regulations, such products may require the export license from the authorities concerned in accordance with the above law. No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written consent of SANYO Semiconductor Co.,Ltd. Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification" for the SANYO Semiconductor Co.,Ltd. product that you intend to use. Upon using the technical information or products described herein, neither warranty nor license shall be granted with regard to intellectual property rights or any other rights of SANYO Semiconductor Co.,Ltd. or any third party. SANYO Semiconductor Co.,Ltd. shall not be liable for any claim or suits with regard to a third party's intellctual property rights which has resulted from the use of the technical information and products mentioned above. This catalog provides information as of October, 2011. Specifications and information herein are subject to change without notice. PS No.A1876-14/14