LV5694P

Ordering number : ENA2017 Monolithic Linear IC LV5694P Overview For Car Audio Systems Multi-Power Supply System IC LV5694P is a power supply IC suitable for USB/CD receiver system for car audio system.This IC enables drastic reduction of power dissipation compared to the existing model.This IC integrates 5 systems of regulator output, 2 systems of high side power switch, overcurrent protector, overvoltage protector and overheat protector (the package is HZIP15J). Features • Low consumption current: 50µA (typ, only VDD output is in operation) • 5 systems of regulator output VDD for microcontroller: output voltage: 5.0V/3.3V (always ON), maximum output current: 300mA For SWD5V: output voltage: 5V, maximum output current: 500mA For CD: output voltage: 7.6V/8.1V, maximum output current: 2000mA For illumination: output voltage: 9.0V, maximum output current: 500mA For audio: output voltage: 8.45V, maximum output current: 800mA • 2 lines of high side switch with interlock VCC AMP: Maximum output current: 500mA, voltage difference between input and output: 0.5V ANT: Maximum output current: 350mA, voltage difference between input and output: 0.5V • Overcurrent protector • Overvoltage protector: Typ 36V (All outputs are turned off) • Overheat protector: Typ 175°C • PchLDMOS is used in power output block (Warning) The protector functions only improve the IC’s tolerance and they do not guarantee the safety of the IC if used under the conditions out of safety range or ratings. Use of the IC such as use under over current protection range or thermal shutdown state may degrade the IC’s reliability and eventually damage the IC. Any and all SANYO Semiconductor Co.,Ltd. products described or contained herein are, with regard to "standard application", intended for the use as general electronics equipment. The products mentioned herein shall not be intended for use for any "special application" (medical equipment whose purpose is to sustain life, aerospace instrument, nuclear control device, burning appliances, transportation machine, traffic signal system, safety equipment etc.) that shall require extremely high level of reliability and can directly threaten human lives in case of failure or malfunction of the product or may cause harm to human bodies, nor shall they grant any guarantee thereof. If you should intend to use our products for new introduction or other application different from current conditions on the usage of automotive device, communication device, office equipment, industrial equipment etc. , please consult with us about usage condition (temperature, operation time etc.) prior to the intended use. If there is no consultation or inquiry before the intended use, our customer shall be solely responsible for the use. Specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer's products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer ' s products or equipment. 30712 SY 20120203-S00001No.A2017-1/13 LV5694P Specifications Absolute Maximum Ratings at Ta = 25°C Parameter Power supply voltage Power dissipation Conditions VCC max Pd max IC unit At using Al heat sink At infinity heat sink Peak voltage Junction temperature Operating temperature Storage temperature VCC peak Tj max Topr Tstg Regarding Bias wave, refer to below the pulse. Ta ≤ 25°C Conditions Ratings 36 1.5 5.6 32.5 50 150 -40 to +85 -55 to +150 Unit V W W W V °C °C °C Recommended Operating range at Ta = 25°C Parameter Power supply voltage rating 1 Power supply voltage rating 2 Power supply voltage rating 3 Power supply voltage rating 4 Conditions VDD output ON, SWD output ON ILM output ON Audio output ON, CD output ON ANT output ON, AMP output ON Ratings 7 to 16 10.8 to 16 10 to 16 7.5 to 16 Unit V V V V * VCC1 should be as follows: VCC1>VCC-0.7V Electrical Characteristics at Ta = 25°C, VCC = VCC1=14.4V (*2) Parameter VCC1 input voltage Current drain CTRL1/2/3 Input Low input voltage Middle1 input voltage Middle2 input voltage High input voltage Input impedance IKCD/IKVDD Input Low input voltage High input voltage VDD output (5V/3.3V) Output voltage VO11 VO12 Output current Line regulation Load regulation Dropout voltage 1 Dropout voltage 2 Ripple rejection Short circuit current IO1 ΔVOLN1 ΔVOLD1 VDROP1 VDROP1’ RREJ1 IS1 VO3 IO3 ΔVOLN3 ΔVOLD3 VDROP3 VDROP3’ RREJ3 IS3 IO1 = 200mA, IKVDD=VCC1 IO1 = 200mA, IKVDD=GND VO11 ≥ 4.70V, VO12 ≥ 3.10V 7.5V < VCC1 < 16V, IO1 = 200mA 1mA < IO1 < 200mA IO1 = 200mA (VDD output 5V) IO1 = 100mA (VDD output 5V) f = 120Hz, IO1 = 200mA VO11, VO12 = 0 IO3 = 650mA VO3 ≥ 8.0V 10V < VCC < 16V, IO3 = 650mA 1mA < IO3 < 650mA IO3 = 650mA IO3 = 200mA f = 120Hz, IO3 = 650mA VO3 = 0 40 120 30 50 4.75 3.16 300 30 70 0.8 0.4 40 150 340 100 150 1.6 0.8 5.0 3.3 5.25 3.45 V V mA mV mV V V dB mA VIL2 VIH2 IKCD IKVDD VCC-0.7V VCC1-0.7V 0.7 V V VIL1 VIM1 VIM2 VIH1 RIH1 0.9 1.85 2.95 280 1.18 2.10 3.29 400 0.3 1.45 2.4 5.5 520 V V V V kΩ Symbol VCC1 ICC VDD no load, CTRL1/2/3 = ⎡L/L/L⎦ Conditions Ratings min VCC-0.7V 50 typ max 16 100 Unit V μA AUDIO (8.45V) Output ; CTRL2 = ⎡M1 or H⎦ AUDIO output voltage 1 AUDIO output current Line regulation Load regulation Dropout voltage 1 Dropout voltage 2 Ripple rejection Short circuit current 8.16 800 30 100 0.7 0.2 50 250 550 90 200 1.2 0.35 8.45 8.7 V mA mV mV V V dB mA Continued on next page. No.A2017-2/13 LV5694P Continued from preceding page. Parameter ILM (9V) Output ; CTRL1 = ⎡M1 or H⎦ ILM output voltage ILM output current Line regulation Load regulation Dropout voltage 1 Dropout voltage 2 Ripple rejection Short circuit current AMP_HS-SW; CTRL3 = ⎡M2 or H⎦ Output voltage Output current Short circuit current ANT_HS-SW; CTRL3 = ⎡M1 or H⎦ Output voltage Output current Short circuit current SWD5V; CTRL2 = ⎡M2 or H⎦ SWD output voltage SWD output current Line regulation Load regulation Dropout voltage Ripple rejection Short circuit current VO7 IO7 ΔVOLN7 ΔVOLD7 VDROP7 RREJ7 IS7 VO81 VO82 CD output current Line regulation Load regulation Dropout voltage 1 Dropout voltage 2 Ripple rejection IO8 ΔVOLN8 ΔVOLD8 VDROP8 VDROP8’ RREJ8 IO7 = 350mA VO7 ≥ 4.7V 10V < VCC < 16V, IO7 = 350mA 1mA < IO7 < 350mA IO7 = 350mA f = 120Hz, IO7 = 350mA VO7 = 0 IO8 = 1300mA, IKCD=GND IO8 = 1300mA, IKCD=VCC VO81 ≥ 7.1V, VO82 ≥ 7.5V 10.5V < VCC < 16V, IO8 = 1300mA 10mA < IO8 < 1300mA IO8 = 1300mA IO8 = 350mA f = 120Hz, IO8 = 1300mA 40 40 100 4.75 500 30 70 0.8 50 200 450 70 150 1.6 5.0 5.25 V mA mV mV V dB mA VO6 IO6 IS6 IO6 = 500mA VO6 ≤ VCC-1.0 VO6 = 0 350 100 200 450 VCC-0.5 VCC-1.0 V mA mA VO5 IO5 IS5 IO5 = 500mA VO5 ≤ VCC-1.0 VO5 = 0 500 120 250 500 VCC-0.5 VCC-1.0 V mA mA VO4 IO4 ΔVOLN4 ΔVOLD4 VDROP4 VDROP4’ RREJ4 IS4 IO4 = 350mA VO4 ≥ 8.6V 10.8V < VCC < 16V, IO4 = 350mA 1mA < IO4 < 350mA IO4 = 350mA IO4 = 200mA f = 120Hz, IO4 = 350mA VO4 = 0 40 100 8.7 500 40 70 1.0 0.3 50 200 400 100 150 1.5 0.6 9.0 9.3 V mA mV mV V V dB mA Symbol Conditions Ratings min typ max Unit CD(7.6/8.1V output); CTRL1 = ⎡M2 or H⎦ CD output voltage 7.2 7.7 2000 40 70 1.3 0.35 50 100 200 1.5 0.7 7.6 8.1 8.0 8.5 V V mA mV mV V V dB Short circuit current IS8 VO81 = 0, VO82 = 0 300 550 1000 mA *2: The entire specification has been defined based on the tests performed under the conditions where Tj and Ta (=25°C) are almost equal. There tests were performed with pulse load to minimize the increase of junction temperature (Tj). No.A2017-3/13 LV5694P Package Dimensions unit : mm (typ) 3395 21.6 (20.0) (15.8) HEAT SINK HEAT SPREADER 3.0 • Allowable power dissipation derating curve Pd max -- Ta 8 7 6 5.6 5 4 3 2 1.5 1 0 Allowable power dissipation, Pd max -- W Aluminum heat sink mounting conditions tightening torque : 39N⋅cm, using silicone grease Aluminum heat sink (50 × 50 × 1.5mm3) when using (R1.75) 17.9 (14.55) (11.0) (9.05) (9.6) 12.4 Independent IC 1 (1.91) 1.27 0.7 15 2.54 2.54 3.35 0.4 0 20 40 60 80 100 120 140 150 160 Ambient temperature, Ta -- °C SANYO : HZIP15J • Waveform applied during surge test 50V 90% 10% 16V 5msec 100msec No.A2017-4/13 LV5694P CTRL Pin Output Truth Table (each output is controllable by 4-value input) CTRL1 L L H H CTRL2 L H L H CTRL3 L M1 M2 H AMP OFF OFF ON ON ANT OFF ON OFF ON Microcontroller INAMP INANT CTRL3 CTRL2 L M1 M2 H SWD5V OFF OFF ON ON AUDIO OFF ON OFF ON CTRL1 L M1 M2 H CD OFF OFF ON ON ILM OFF ON OFF ON (Warning) Usage of CTRL pin When CTRL pin transits between L and M2, since it passes M1, ILM/AUDIO/ANT is turned on for a moment. Likewise, when CTRL pin transits between H and M1, since it passes M2, ILM/AUDIO/ANT is turned off for a moment. To avoid operation failure by the above factors, please refer to (1) and (2) as shown below for precaution. • Do not connect parasitic capacitor to CTRL as much as possible. • If use of capacitor for CTRL is required, keep the resistance value as low as possible. (Recommendation level: 2.2kΩ / 3.9kΩ) • Make sure that the output load capacitor has enough marjin against the voltage fluctuation due to instantaneous ON/OFF. (1) The time until a reaction occurs in output after shifting from CTRL ON to OFF (typ) OFF → ON time CTRL1 → ILM CTRL2 → AUDIO CTRL3 → ANT 27°C 0.95μs 1.33μs 2.86μs Due to quality fluctuation of the ICs in manufacturing process, the above-mentioned time can be shortened by 10 to 20%. (2) The time until output starts to react after shifting from CTRL ON→OFF control (typ): All output: 200ns to 300ns No.A2017-5/13 LV5694P Block Diagram VCC AMP out AMP-SW(VCC -0.5V) 500mA Start up Over Voltage Protection Vref ANT out ANT-SW(VCC -0.5V) 350mA + ILM output (9V) 500mA + CTRL1 CTRL2 CTRL3 OUTPUT Control + AUDIO output (8.45V) 800mA SWD output (5V) 500mA Thermal Shut Down GND + CD output (7.6/8.1V) 2000mA VCC1(VDD supply input) VCC + VDD output (5.7V) 300mA IKVDD:VDD(3.3/5.0V)change pin IKVDD=VCC1:5.0V IKVDD=GND:3.3V IKVDD:CD(7.6/8.1V)change pin IKCD=VCC:8.1V IKCD=GND:7.6V No.A2017-6/13 LV5694P Pin Function Pin No. 1 Pin name ILM ILM output pin ON when CTRL1 = M1, H 9V/0.5A Description Equivalent Circuit 15 VCC 1 2 2 3 GND CD GND pin CD output pin ON when CTRL1 = M2, H 8.1V/2A (IKCD=VCC) 7.6V/2A (IKCD=GND) GND 15 VCC 3 2 4 6 8 CTRL1 CTRL2 CTRL3 CTRL1/2/3 input pin Four value input GND 15 VCC 4 6 8 2 5 AUDIO AUDIO output pin ON when CTRL2 = M1, H 8.45V/0.8A GND VCC 15 5 2 7 SWD SWD output pin ON when CTRL2 = M2, H 5V/0.5A GND VCC 15 7 2 GND Continued on next page. No.A2017-7/13 LV5694P Continued from preceding page. Pin No. 9 Pin name ANT ANT output pin ON when CTRL3 = M1, H VCC-0.5V/350mA Description Equivalent Circuit 15 VCC 11 9 2 10 IKCD CD voltage reshuffling control input pin GND 15 VCC 10 2 11 AMP AMP output pin ON when CTRL2 = M2, H VCC-0.5V/500mA GND 15 VCC 11 2 12 IKVDD VDD voltage reshuffling control input pin VCC1/GND GND 15 VCC 5V 12 2 13 VDD VDD output pin 5.0V/0.3A (IKVDD = VCC1) 3.3V/0.3A (IKVDD = GND) GND 15 VCC 13 2 14 15 VCC1 VCC VDD power supply pin Power supply pin GND VCC 15 14 VCC1 2 GND No.A2017-8/13 LV5694P Timing Chart 36V VCC (15PIN) 36V VCC1 (14PIN) 5.8V VDD output (13PIN) H CTRL1 input (4PIN) M2 L M1 H CTRL2 input (6PIN) M2 M1 L H CTRL3 input (8PIN) M2 L M1 ILM output (1PIN) CD output (3PIN) AUDIO output (5PIN) SWD output (7PIN) ANT output (9PIN) AMP output (11PIN) *Usage condition: Use under typical value. No.A2017-9/13 LV5694P Applied circuit example CTRL1 CTRL2 CTRL3 IKVDD AUDIO AMP VDD VCC1 IKCD GND ILM 2 CD 4 6 DSP 8 ANT 10 C9 + C10 + 12 14 1 3 5 7 9 11 13 C12 + D4 R2 VDD C14 + C11 VCC 15 D6 C16 + C13 C15 CTRL1 C2 + C1 C4 + C3 C6 + C5 CTRL2 C8 + C7 CTRL3 D2 R1 D3 D5 ILM CD AUDIO DSP ANT AMP D1 VCC Peripheral parts list Name of part C2, C4, C6, C8, C12 C1, C3, C5, C7, C11 C14, C16 C13, C15 C9, C10 R1, R2 D1 D2, D3, D4, D5 D6 Description Output stabilization capacitor Output stabilization capacitor Power supply bypass capacitor Oscillation prevention capacitor AMP/ANT output stabilization capacitor Resistance for protection Diode for prevention of backflow Diode for internal element protection Diode for internal element protection SANYO SB1003M3 SANYO SB1003M3 When a minus number surge is applied Recommended value 10μF or more* 0.22μF or more* 100μF or more 0.22μF or more 2.2μF or more 10 to 100kΩ Meeting the specifications of the rush electric current in a true use state Remarks Electrolytic capacitor Ceramic capacitor These capacitors must be placed near the VCC and GND pins. * : Make sure that the capacitors of the output pins are 10μF or higher and meets the condition of ESR is 0.001 to 10Ω (ceramic capacitor alone can be used.), in which voltage/ temperature fluctuation and unit differences are taken into consideration. Moreover, RF characteristics of electrolytic capacitor should be sufficient. No.A2017-10/13 LV5694P Caution for implementing LV5694P to a system board The package of LV5694P is HZIP15J which has some metal exposures other than connection pins and heatsink as shown in the diagram below. The electrical potentials of (2) and (3) are the same as those of pin 15 and pin 1, respectively. (2) (=pin 15) is the VCC pin and (3) (=pin 1) is the ILM (regulator) output pin. When you implement the IC to the set board, make sure that the bolts and the heatsink are out of touch from (2) and (3). If the metal exposures touch the bolts which has the same electrical potential with GND, GND short occurs in ILM output and VCC. The exposures of (1) are connected to heatsink which has the same electrical potential with substrate of the IC chip (GND). Therefore, (1) and GND electrical potential of the set board can connect each other. • HZIP15J outline Heat-sink 1 Same potential 2 15PIN Same potential 1PIN 3 Same potential Heat-sink 1 Same potential Heat-sink side 1 Heat-sink Same potential Heat-sink side :Metal exposure :Metal exposure • Frame diagram (LV5694P) *In the system power supply other than LV5694P, pin assignment may differ. Metal exposure 1 Metal exposure 3 Metal exposure 2 Metal exposure 1 LV5694 Metal exposure 1 Metal exposure 1 1PIN 15PIN PS No.A2017-11/13 LV5694P HZIP15J Heat sink attachment Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to the outer environment and dissipating that heat. a. Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be applied to the heat sink or tabs. b. Heat sink attachment · Use flat-head screws to attach heat sinks. · Use also washer to protect the package. · Use tightening torques in the ranges 39-59Ncm(4-6kgcm) . · If tapping screws are used, do not use screws with a diameter larger than the holes in the semiconductor device itself. · Do not make gap, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. · Take care a position of via hole . · Do not allow dirt, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. · Verify that there are no press burrs or screw-hole burrs on the heat sink. · Warping in heat sinks and printed circuit boards must be no more than 0.05 mm between screw holes, for either concave or convex warping. · Twisting must be limited to under 0.05 mm. · Heat sink and semiconductor device are mounted in parallel. Take care of electric or compressed air drivers · The speed of these torque wrenches should never exceed 700 rpm, and should typically be about 400 rpm. Binding head machine screw Countersunk head mashine screw Heat sink gap Via hole c. Silicone grease · Spread the silicone grease evenly when mounting heat sinks. · Sanyo recommends YG-6260 (Momentive Performance Materials Japan LLC) Mount · First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board. · When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin doesn't hang. When mounting the semiconductor device to the heat sink using jigs, etc., · Take care not to allow the device to ride onto the jig or positioning dowel. · Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device. Heat sink screw holes · Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used. · When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used. A hole diameter about 15% larger than the diameter of the screw is desirable. · When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about 15% smaller than the diameter of the screw is desirable. There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not recommended because of possible displacement due to fluctuation of the spring force with time or vibration. d. e. f. g. PS No.A2017-12/13 LV5694P SANYO Semiconductor Co.,Ltd. assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein. SANYO Semiconductor Co.,Ltd. strives to supply high-quality high-reliability products, however, any and all semiconductor products fail or malfunction with some probability. It is possible that these probabilistic failures or malfunction could give rise to accidents or events that could endanger human lives, trouble that could give rise to smoke or fire, or accidents that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design. In the event that any or all SANYO Semiconductor Co.,Ltd. products described or contained herein are controlled under any of applicable local export control laws and regulations, such products may require the export license from the authorities concerned in accordance with the above law. No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written consent of SANYO Semiconductor Co.,Ltd. Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification" for the SANYO Semiconductor Co.,Ltd. product that you intend to use. Upon using the technical information or products described herein, neither warranty nor license shall be granted with regard to intellectual property rights or any other rights of SANYO Semiconductor Co.,Ltd. or any third party. SANYO Semiconductor Co.,Ltd. shall not be liable for any claim or suits with regard to a third party's intellctual property rights which has resulted from the use of the technical information and products mentioned above. This catalog provides information as of March, 2012. Specifications and information herein are subject to change without notice. PS No.A2017-13/13