LV8727

Ordering number : ENA1998 LV8727 Overview Bi-CMOS LSI PWM Current Control Stepping Motor Driver The LV8727 is a PWM current-controlled micro step bipolar stepping motor driver. This driver can do eight ways of micro step resolution of Half, 1/8, 1/16, 1/32, 1/64, 1/128, 1/10, 1/20 Step, and can drive simply by the step input. Features • Single-channel PWM current control stepping motor driver. • Output on-resistance (upper side : 0.25Ω ; lower side : 0.15Ω ; total of upper and lower : 0.4Ω ; Ta = 25°C, IO = 4.0A) • Half, 1/8, 1/16, 1/32, 1/64, 1/128, 1/10, 1/20 Step are selectable. • Advance the excitation step with the only step signal input. • BiCDMOS process IC. • Available forward reverse control. • Thermal shutdown circuit. • IO max=4.0A • Input pull down resistance • With reset pin and enable pin. Specifications Absolute Maximum Ratings at Ta = 25°C Parameter Supply voltage Output current Output peak current Logic input voltage VREF input voltage MO / DOWN pin input voltage Allowable power dissipation Operating temperature Storage temperature Symbol VM max IO max IO peak VIN max VREF max VMO /VDOWN max Pd max Topr Tstg Indipendent IC tw≤10ms, duty 20% Conditions Ratings 50 4 4.6 6 6 6 2.45 -30 to +85 -55 to +150 Unit V A A V V V W °C °C Caution 1) Absolute maximum ratings represent the value which cannot be exceeded for any length of time. Caution 2) Even when the device is used within the range of absolute maximum ratings, as a result of continuous usage under high temperature, high current, high voltage, or drastic temperature change, the reliability of the IC may be degraded. Please contact us for the further details. Any and all SANYO Semiconductor Co.,Ltd. products described or contained herein are, with regard to "standard application", intended for the use as general electronics equipment. The products mentioned herein shall not be intended for use for any "special application" (medical equipment whose purpose is to sustain life, aerospace instrument, nuclear control device, burning appliances, transportation machine, traffic signal system, safety equipment etc.) that shall require extremely high level of reliability and can directly threaten human lives in case of failure or malfunction of the product or may cause harm to human bodies, nor shall they grant any guarantee thereof. If you should intend to use our products for new introduction or other application different from current conditions on the usage of automotive device, communication device, office equipment, industrial equipment etc. , please consult with us about usage condition (temperature, operation time etc.) prior to the intended use. If there is no consultation or inquiry before the intended use, our customer shall be solely responsible for the use. Specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer's products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer ' s products or equipment. N1611 SY 20111019-S00003 No.A1998-1/23 LV8727 Recommendation Operating Ratings at Ta = 25°C Parameter Supply voltage range Logic input voltage VREF input voltage range Symbol VM VIN VREF Conditions Ratings 9 to 45 0 to 5 0 to 3 Unit V V V Electrical Characteristics at Ta = 25°C, VM = 24V, VREF = 1.5V Parameter Standby mode current drain Current drain Thermal shutdown temperature Thermal hysteresis width Logic pin input current Symbol IMst IM TSD ΔTSD IINL IINH Logic high-level input voltage Logic low-level input voltage FDT pin high-level voltage FDT pin middle-level voltage FDT pin low-level voltage Chopping frequency OSC1 pin charge/discharge current Chopping oscillation circuit threshold voltage VREF pin input voltage DOWN output residual voltagr MO pin residual voltage Hold current switching frequency OSC2 pin charge/discharge current Hold current switching frequency threshold voltage Output on-resistance VINH VINL Vfdth Vfdtm Vfdtl Fch Iosc1 Vtup1 Vtdown1 Iref VO1DOWN VO1MO Fdown Iosc2 Vtup2 Vtdown2 Ronu Rond Output leakage current Diode forward voltage Current setting reference voltage IOleak VD VRF IO = 4.0A, high-side ON resistance IO = 4.0A, low-side ON resistance VM = 50V ID = -4.0A VREF = 1.5V, Current ratio 100% 0.485 1 0.5 VREF = 1.5V Idown = 1mA Imo = 1mA Cosc2 = 1500pF 1.12 7 0.8 0.3 Cosc1 = 100pF 70 7 0.8 0.3 -0.5 50 50 1.6 10 1 0.5 0.25 0.15 200 200 2.08 13 1.2 0.7 0.325 0.195 50 1.3 0.515 100 10 1 0.5 3.5 1.1 3.1 0.8 130 13 1.2 0.7 ST = “L” ST = “H”, OE = “H”, no load Design guarantee Design guarantee VIN = 0.8V VIN = 5V 3 30 2.0 0.8 150 Conditions Ratings min typ 70 3.5 180 40 8 50 15 70 max 100 4.9 200 Unit μA mA °C °C μA μA V V V V V kHz μA V V μA mV mV Hz μA V V Ω Ω μA V V No.A1998-2/23 LV8727 Package Dimensions unit : mm (typ) 3236A 29.2 25.6 (22.8) (8.5) ( 2.5) 4.5 (12.3) (5.0) (R1.7) 18.6 max (14.4) (11.0) 21.7 0.4 1 (2.6) (1.0) 0.52 25 3.5 4.0 4.2 2.0 2.0 SANYO : HZIP25 3.0 Pd max - Ta Allowable power dissipation, Pd max - W 2.45 2.0 1.27 1.0 0 —0 3 0 30 60 90 120 Ambient temperature, Ta - C 14.5 No.A1998-3/23 Block Diagram + RF1 OUT1A OUT2B OUT1B VM1 VM2 OUT2A RF2 Regulator 2 PGND1 PGND2 Output pre stage Output pre stage Output pre stage Output pre stage MO DOWN Regulator 1 + VREF + Oscllator TSD OSC1 OSC2 MD1 MD2 MD3 FR STEP RST OE FDT Current select circuit Output control logic + Current select circuit Decay Mode setting circuit LV8727 SGND ST No.A1998-4/23 LV8727 Pin Assignment LV8727 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 VM1 PGND1 OUT1B MD1 RF1 OUT2B PGND2 OUT1A Top view Pin Functions Pin No. 7 8 9 10 11 12 13 Pin Name MD1 MD2 MD3 OE RST FR STEP Pin Functtion Excitation mode switching pin Excitation mode switching pin Excitation mode switching pin Output enable signal input pin Reset signal input pin Forward / Reverse signal input pin Clock pulse signal input pin Internal 5V regulator Equivalent Circuit GND 6 ST Chip enable input pin. Internal 5V regulator GND 1 2 3 4 5 21 22 23 24 25 OUT1B RF1 PGND1 OUT1A VM1 VM2 OUT2B PGND2 RF2 OUT2A Channel 1 OUTB output pin. Channel 1 current-sense resistor connection pin. Channel 1 power GND Channel 1 OUTA output pin. Channel 1 motor supply connect pin Channel 2 motor supply connect pin Channel 2 OUTB output pin. Channel 2 power GND Channel 2 current-sense resistor connection pin. Channel 2 OUTA output pin. 4 25 5 21 1 22 3 23 2 24 GND Continued on next page. No.A1998-5/23 OUT2A OSC1 DOWN VREF MD2 MD3 SGND OSC2 STEP RST VM2 FDT RF2 MO OE FR ST LV8727 Continued from preceding page. Pin No. 19 Pin Name VREF Pin Functtion Constant-current control reference voltage input pin. Internal 5V regulator Equivalent Circuit GND 17 18 DOWN MO Holding current output pin. Position detecting monitor pin. Internal 5V regulator GND 14 15 OSC1 OSC2 Chopping frequency setting capacitor connection pin. Holding current detection time setting capacitor connection pin. Internal 5V regulator GND 16 FDT Decay mode select voltage input Internal 5V regulator GND No.A1998-6/23 LV8727 Reference describing operation (1) Stand-by function When ST pin is at low levels, the IC enters stand-by mode, all logic is reset and output is turned OFF. When ST pin is at high levels, the stand-by mode is released. (2) STEP pin function STEP input advances electrical angle at every nising edge (advances step by step). Input ST Low High High STEP * Standby mode Excitation step proceeds Excitation step is kept Operating mode (3) Excitation setting method Set the excitation setting as shown in the following table by setting MD1 pin, MD2 pin and MD3 pin. Input MD3 Low Low Low Low High High High High MD2 Low Low High High Low Low High High MD1 Low High Low High Low High Low High Mode (Excitation) Half 1/8 1/16 1/32 1/64 1/128 1/10 1/20 Initial position 1ch current 100% 100% 100% 100% 100% 100% 100% 100% 2ch current 0% 0% 0% 0% 0% 0% 0% 0% The initial position is also the default state at start-up and excitation position at counter-reset in each Micro step resolution. (4) MO output pin MO output pin serves as open-drain connection. If MO pin will be in the state of an initial position, it is turned on, and it outputs a Low level. Excitation position Initial position Other initial position MO Low OPEN (5) Output current setting Output current is set shown below by the VREF pin (applied voltage) and a resistance value between RF1(2) pin and GND. IOUT = ( VREF / 3 ) / RF1 (2) resistance * The setting value above is a 100% output current in each excitation mode. (Example) When VREF = 0.9V and RF1 (2) resistance is 0.1Ω, the setting is shown below. IOUT = ( 0.9V / 3 ) / 0.1Ω = 3A No.A1998-7/23 LV8727 (6) Output enable function When the OE pin is set Low, the output is forced OFF and goes to high impedance. However, the internal logic circuits are operating, so the excitation position proceeds when the STP is input. Therefore, when OE pin is returned to High, the output level conforms to the excitation position proceeded by the STEP input. OE L H Operation mode Output: OFF Output: ON OE STEP MO Power save mode 1ch output 0% 2ch output Output is high-impedance (7) Reset function When the RST pin is set Low, the output goes to initial mode and excitation position is fixed in the initial position for STEP pin and FR pin input. MO pin outputs at low levels at the initial position. (Open drain connection) RST H L Operation mode Normal operation Reset state RST STEP MO RESET 1ch output 0% 2ch output Initial state No.A1998-8/23 LV8727 (8) Forward / reverse switching function FR Low High Operating mode Clockwise (CW) Counter-clockwise (CCW) FR CW mode CCW mode CW mode STEP Excitation position (1) (2) (3) (4) (5) (6) (5) (4) (3) (4) (5) 1ch output 2ch output The internal D/A converter proceeds by a bit on the rising edge of the step signal input to the STEP pin. In addition, CW and CCW mode are switched by FR pin setting. In CW mode, the channel 2 current phase is delayed by 90° relative to the channel 1 current. In CCW mode, the channel 2 current phase is advanced by 90° relative to the channel 1 current. (9) DECAY mode setting Current DECAY method is selectable as shown below by applied voltage to the FDT pin. FDT voltage 3.5V to 1.1V to 3.1V or OPEN To 0.8V DECAY method SLOW DECAY MIXED DECAY FAST DECAY (10) Chopping frequency setting function Chopping frequency is set as shown below by a capacitor between OSC1 pin and GND. Fcp = 1 / ( Cosc1 / 10 х 10-6 ) (Hz) (Example) When Cosc1 = 180pF, the chopping frequency is shown below. Fcp = 1 / ( 180 х 10-12 / 10 х 10-6 ) = 55.6(kHz) No.A1998-9/23 LV8727 (11) Output current in each micro step resolution Output current vector locus (one step is normalized to 90 degrees) Half, 1/8, 1/16, 1/32, 1/64, 1/128 Step 100.0 Channel 1 current ratio (%) 66.7 33.3 0.0 0.0 33.3 66.7 100.0 Channel 2 current ratio (%) Current setting ratio in each micro step resolution STEP θ0 θ1 θ2 θ3 θ4 θ5 θ6 θ7 θ8 θ9 θ10 θ11 θ12 θ13 θ14 θ15 θ16 θ17 θ18 θ19 θ20 θ21 θ22 θ23 θ24 θ25 1/128 (%) 1ch 2ch 100 0 100 1 100 2 100 4 100 5 100 6 100 7 100 9 100 10 99 11 99 12 99 13 99 15 99 16 99 17 98 18 98 20 98 21 98 22 97 23 97 24 97 25 96 27 96 28 96 29 95 30 1/64 (%) 1ch 2ch 100 0 100 100 100 100 99 99 99 98 98 97 96 96 2 5 7 10 12 15 17 20 22 24 27 29 96 29 96 29 Continued on next page. 97 24 98 20 98 20 98 20 99 15 100 10 100 10 100 5 1/32 (%) 1ch 2ch 100 0 1ch 100 1/16 (%) 2ch 0 1/8 (%) 1ch 2ch 100 0 Half (%) 1ch 2ch 100 0 No.A1998-10/23 LV8727 Continued from preceding page. STEP θ26 θ27 θ28 θ29 θ30 θ31 θ32 θ33 θ34 θ35 θ36 θ37 θ38 θ39 θ40 θ41 θ42 θ43 θ44 θ45 θ46 θ47 θ48 θ49 θ50 θ51 θ52 θ53 θ54 θ55 θ56 θ57 θ58 θ59 θ60 θ61 θ62 θ63 θ64 θ65 θ66 θ67 θ68 θ69 θ70 θ71 θ72 θ73 θ74 θ75 θ76 θ77 θ78 θ79 θ80 θ81 θ82 θ83 θ84 θ85 θ86 θ87 θ88 θ89 θ90 1/128 (%) 1ch 2ch 95 31 95 33 94 34 94 35 93 36 93 37 92 38 92 39 91 41 91 42 90 43 90 44 89 45 89 46 88 47 88 48 87 49 86 50 86 51 85 52 84 53 84 55 83 56 82 57 82 58 81 59 80 60 80 61 79 62 78 62 77 63 77 64 76 65 75 66 74 67 73 68 72 69 72 70 71 71 70 72 69 72 68 73 67 74 66 75 65 76 64 77 63 77 62 78 62 79 61 80 60 80 59 81 58 82 57 82 56 83 55 84 53 84 52 85 51 86 50 86 49 87 48 88 47 88 46 89 45 89 1/64 (%) 1ch 2ch 95 31 94 93 92 91 90 89 88 87 86 84 83 82 80 79 77 76 74 72 71 69 67 65 63 62 60 58 56 53 51 49 47 45 34 36 38 41 43 45 47 49 51 53 56 58 60 62 63 65 67 69 71 72 74 76 77 79 80 82 83 84 86 87 88 89 Continued on next page. 47 88 47 88 51 86 56 83 56 83 56 83 60 80 63 77 63 77 67 74 71 71 71 71 71 71 71 71 74 67 77 63 77 63 80 60 83 56 83 56 83 56 86 51 88 47 88 47 90 43 92 38 92 38 92 38 1/32 (%) 1ch 2ch 1/16 (%) 1ch 2ch 1/8 (%) 1ch 2ch Halfe (%) 1ch 2ch 94 34 No.A1998-11/23 LV8727 Continued from preceding page. STEP θ91 θ92 θ93 θ94 θ95 θ96 θ97 θ98 θ99 θ100 θ101 θ102 θ103 θ104 θ105 θ106 θ107 θ108 θ109 θ110 θ111 θ112 θ113 θ114 θ115 θ116 θ117 θ118 θ119 θ120 θ121 θ122 θ123 θ124 θ125 θ126 θ127 θ128 1/128 (%) 1ch 2ch 44 90 43 90 42 91 41 91 39 92 38 92 37 93 36 93 35 94 34 94 33 95 31 95 30 95 29 96 28 96 27 96 25 97 24 97 23 97 22 98 21 98 20 98 18 98 17 99 16 99 15 99 13 99 12 99 11 99 10 100 9 100 7 100 6 100 5 100 4 100 2 100 1 100 0 100 1/64 (%) 1ch 2ch 43 41 38 36 34 31 29 27 24 22 20 17 15 12 10 7 5 2 0 90 91 92 93 94 95 96 96 97 98 98 99 99 99 100 100 100 100 100 0 100 0 100 0 100 0 100 5 100 10 100 10 100 15 99 20 98 20 98 20 98 24 97 29 96 29 96 34 94 38 92 38 92 38 92 1/32 (%) 1ch 2ch 43 90 1/16 (%) 1ch 2ch 1/8 (%) 1ch 2ch Half (%) 1ch 2ch No.A1998-12/23 LV8727 Output current vector locus (one step is normalized to 90 degrees) 1/10, 1/20 STEP 100.0 Channel 1 current ratio (%) 66.7 33.3 0.0 0.0 33.3 66.7 100.0 Channel 2 current ratio (%) Current setting ratio in each micro step resolution 1/10, 1/20 STEP STEP θ0 θ1 θ2 θ3 θ4 θ5 θ6 θ7 θ8 θ9 θ10 θ11 θ12 θ13 θ14 θ15 θ16 θ17 θ18 θ19 θ20 1/20 (%) 1ch 2ch 100 0 100 8 99 16 97 23 95 31 92 38 89 45 85 52 81 59 76 65 71 71 65 76 59 81 52 85 45 89 38 92 31 95 23 97 16 99 8 100 0 100 1/10 (%) 1ch 2ch 100 0 99 95 89 81 71 59 45 31 16 0 16 31 45 59 71 81 89 95 99 100 No.A1998-13/23 LV8727 (12) Current wave example in each micro step resolution (Half, 1/16, 1/128, 1/20 STEP) Half STEP (CW mode) STEP MO (%) 100 I1 0 -100 (%) 100 I2 0 -100 1/16 STEP (CW mode) STEP MO (%) 100 50 I1 0 -50 -100 (%) 100 50 I2 0 -50 -100 No.A1998-14/23 LV8727 1/128 STEP ( CW mode ) STEP MO (%) 100 50 I1 0 -50 -100 (%) 100 50 I2 0 -50 -100 1/20 STEP ( CW mode ) STEP MO (%) 100 50 I1 0 -50 -100 (%) 100 50 I2 0 -50 -100 No.A1998-15/23 LV8727 (13) Current control operation SLOW DECAY current control operation When FDT pin voltage is a voltage over 3.5V, the constant-current control is operated in SLOW DECAY mode. ( Sine-wave increasing direction ) STEP Setting current Setting current Coil current Chopping period Blanking Time Current mode CHARGE SLOW CHARGE SLOW ( Sine-wave decreasing direction ) STEP Setting current Coil current Setting current Chopping period Blanking Time Chopping period Current mode CHARGE SLOW Blanking Time SLOW Blanking Time SLOW Each of current modes operates with the follow sequence. The IC enters CHARGE mode at a rising edge of the chopping oscillation. ( A period of CHARGE mode (Blanking Time) is forcibly present in approximately 1μs, regardless of the current value of the coil current (ICOIL) and set current (IREF)). After the period of the blanking time, the IC operates in CHARGE mode until ICOIL ≥ IREF. After that, the mode switches to the SLOW DECAY mode and the coil current is attenuated until the end of a chopping period. At the constand-current in SLOW DECAY mode, following to the setting current from the coil current may take time (or not follow) for the current delay attenuation. No.A1998-16/23 LV8727 FAST DECAY current control operation When FDT pin voltage is a voltage under 0.8V, the constant-current control is operated in FAST DECAY mode. (Sine-wave inxreasing direction) STEP Setting current Setting current Coil current Chopping period Blanking Time Current mode CHARGE FAST CHARGE FAST (Sine-wave decreasing direction) STEP Setting current Coil current Setting current Chopping period Blanking Time Current mode CHARGE FAST Blanking Time FAST CHARGE FAST Each of current modes operates with the follow sequence. The IC enters CHARGE mode at a rising edge of the chopping oscillation. ( A period of CHARGE mode (Blanking Time) is forcibly present in approximately 1μs, regardless of the current value of the coil current (ICOIL) and set current (IREF)). After the period of the blanking time, the IC operates in CHARGE mode until ICOIL ≥ IREF. After that, the mode switches to the FAST DECAY mode and the coil current is attenuated until the end of a chopping period. At the constand-current control in FAST DECAY mode, following to the setting current from the coil current take short-time for the current fast attenuation, but, the current ripple value may be higher. No.A1998-17/23 LV8727 MIXED DECAY current control operation When FDT pin voltage is a voltage between 1.1V to 3.1V or OPEN, the constant-current control is operated in MIXED DECAY mode. (Sine-wave increasing direction) STEP Setting current Coil current Setting current Chopping period Blanking Time Current mode CHARGE SLOW FAST CHARGE SLOW FAST (Sine-wave decreasing direction) STEP Setting current Coil current Setting current Chopping period Blanking Time Current mode CHARGE SLOW FAST Blanking Time FAST CHARGE SLOW Each of current modes operates with the follow sequence. The IC enters CHARGE mode at a rising edge of the chopping oscillation. ( A period of CHARGE mode (Blanking Time) is forcibly present in approximately 1μs, regardless of the current value of the coil current (ICOIL) and set current (IREF)). In a period of Blanking Time, the coil current (ICOIL) and the setting current (IREF) are compared. If an ICOIL < IREF state exists during the charge period: The IC operates in CHARGE mode until ICOIL ≥ IREF. After that, it switches to SLOW DECAY mode and then switches to FAST DECAY mode in the last approximately 1μs of the period. If no ICOIL < IREF state exists during the charge period: The IC switches to FAST DECAY mode and the coil current is attenuated with the FAST DECAY operation until the end of a chopping period. The above operation is repeated. Normally, in the sine wave increasing direction the IC operates in SLOW (+ FAST) DECAY mode, and in the sine wave decresing direction the IC operates in FAST DECAY mode until the current is attenuated and reaches the set value and the IC operates in SLOW (+ FAST) DECAY mode. No.A1998-18/23 LV8727 (13) Output short-circuit protection circuit Built-in output short-circuit protection circuit makes output to enter in stand-by mode. This function prevents the IC from damaging when the output shorts circuit by a voltage short or a ground short, etc. When output short state is detected, short-circuit detection circuit state the operating and output is once turned OFF. Subsequently, the output is turned ON again after the timer latch period ( typ. 256μs ). If the output remains in the short-circuit state, turn OFF the output, fix the output to the wait mode, and turn ON the EMO output. When output is fixed in stand-by mode by output short protection circuit, output is released the latch by setting ST = “L”. Output ON H-bridge output state Output ON Output OFF Standby state Short-circuit detection state Short- Release circuit Short-circuit Internal counter 1st counter start 1st counter 1st counter stop start 1st counter end 2nd counter start 2nd counter end No.A1998-19/23 LV8727 (15) DOWN output pin The DOWN output pin is an open-drain connection. This pin is turned ON when no rising edge of STEP between the input signals while a period determined by a capacitor between OSC2 and GND, and outputs at low levels. The open-drain output in once turned ON, is turned OFF at the next rising edge of STEP. Holding current switching time ( Tdown ) is set as shown below by a capacitor between OSC2 pin and GND. Tdown = Cosc2 х 0.4 х 109 (s) (Example) When Cosc2 = 1500pF, the STEM signal detection time is shown below. Tdown = 1500pF х 0.4 х 109 = 0.6 (s) Rotation STEP input Motor keep Rotation Tdown DOWN output OFF Low OFF By connecting circumference parts like the example of the following circuit diagram using a DOWN pin, that is a STEP signal is not inputted more than detection time, it is a DOWN output's turning on in the state of holding turning on electricity the position of a stepping motor, and setting current's falling because VREF input voltage's falls, and stopping power consumption -- it can do. VREF R3 R1 R2 DOWN (Example) When V1=5V, R1=27kΩ, R2=4.7kΩ, R3=1kΩ, the VREF input voltage is shown below. DOWN output OFF: VREF=V1×R2/(R1+R2)=0.741V DOWN output ON: VREF=V1×(R2║R3)/ (R1+(R2║R3))=0.126V No.A1998-20/23 LV8727 Application Circuit Example LV8727 PGND1 OUT1B OUT2B PGND2 OUT1A DOWN OSC1 OSC2 FDT RF2 24 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 -+ - Logic supply M Motor connect pin The above sample application circuit is set to the following conditions: · Constant-current setting IOUT=VREF/3/RF (Example) When is VREF=0.9V IOUT=0.9V/3/0.1Ω=3A · Chopping frequency setting Fchop=Ichop/(Cchop×Vt×2) =10µA/(180pF×0.5V×2)=55.6kHz -+ Logic input 180pF No.A1998-21/23 OUT2A 25 SGND STEP VREF MD1 VM1 MD2 MD3 RST RF1 MO OE + ST VM2 FR LV8727 HZIP25 Heat sink attachment Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to the outer environment and dissipating that heat. a. Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be applied to the heat sink or tabs. b. Heat sink attachment · Use flat-head screws to attach heat sinks. · Use also washer to protect the package. · Use tightening torques in the ranges 39-59Ncm(4-6kgcm) . · If tapping screws are used, do not use screws with a diameter larger than the holes in the semiconductor device itself. · Do not make gap, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. · Take care a position of via hole . · Do not allow dirt, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. · Verify that there are no press burrs or screw-hole burrs on the heat sink. · Warping in heat sinks and printed circuit boards must be no more than 0.05 mm between screw holes, for either concave or convex warping. · Twisting must be limited to under 0.05 mm. · Heat sink and semiconductor device are mounted in parallel. Take care of electric or compressed air drivers · The speed of these torque wrenches should never exceed 700 rpm, and should typically be about 400 rpm. Binding head machine screw Countersunk head mashine screw Heat sink gap Via hole c. Silicone grease · Spread the silicone grease evenly when mounting heat sinks. · Sanyo recommends YG-6260 (Momentive Performance Materials Japan LLC) Mount · First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board. · When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin doesn't hang. When mounting the semiconductor device to the heat sink using jigs, etc., · Take care not to allow the device to ride onto the jig or positioning dowel. · Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device. Heat sink screw holes · Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used. · When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used. A hole diameter about 15% larger than the diameter of the screw is desirable. · When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about 15% smaller than the diameter of the screw is desirable. There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not recommended because of possible displacement due to fluctuation of the spring force with time or vibration. d. e. f. g. No.A1998-22/23 LV8727 SANYO Semiconductor Co.,Ltd. assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein. SANYO Semiconductor Co.,Ltd. strives to supply high-quality high-reliability products, however, any and all semiconductor products fail or malfunction with some probability. It is possible that these probabilistic failures or malfunction could give rise to accidents or events that could endanger human lives, trouble that could give rise to smoke or fire, or accidents that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design. In the event that any or all SANYO Semiconductor Co.,Ltd. products described or contained herein are controlled under any of applicable local export control laws and regulations, such products may require the export license from the authorities concerned in accordance with the above law. No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written consent of SANYO Semiconductor Co.,Ltd. Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification" for the SANYO Semiconductor Co.,Ltd. product that you intend to use. Upon using the technical information or products described herein, neither warranty nor license shall be granted with regard to intellectual property rights or any other rights of SANYO Semiconductor Co.,Ltd. or any third party. SANYO Semiconductor Co.,Ltd. shall not be liable for any claim or suits with regard to a third party's intellctual property rights which has resulted from the use of the technical information and products mentioned above. This catalog provides information as of November, 2011. Specifications and information herein are subject to change without notice. PS No.A1998-23/23