Ordering number : ENA1315A
EMH2412
N-Channel Power MOSFET
http://onsemi.com
24V, 6A, 27mΩ, Dual EMH8
Features
•
•
•
•
•
•
Low ON-resistance
Best suited for LiB charging and discharging switch
Common-drain type
2.5V drive
Halogen free compliance
Protection diode in
Specifications
Absolute Maximum Ratings at Ta=25°C
Parameter
Symbol
Drain-to-Source Voltage
Conditions
Ratings
VDSS
VGSS
Gate-to-Source Voltage
Drain Current (DC)
ID
IDP
Drain Current (Pulse)
Allowable Power Dissipation
Unit
24
V
±12
V
6
A
PW≤10μs, duty cycle≤1%
60
A
When mounted on ceramic substrate (900mm2×0.8mm) 1unit
1.3
W
Total Dissipation
PD
PT
1.4
W
Channel Temperature
Tch
150
°C
Storage Temperature
Tstg
--55 to +150
°C
When mounted on ceramic substrate (900mm2×0.8mm)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating
Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
Package Dimensions
Product & Package Information
unit : mm (typ)
7045-006
• Package
: EMH8
• JEITA, JEDEC
:• Minimum Packing Quantity : 3,000 pcs./reel
0.125
0.2
0.2
EMH2412-TL-H
5
Taping Type : TL
Marking
LM
2.1
1.7
8
LOT No.
TL
1
0.2
4
0.5
0.05
0.75
2.0
1 : Source1
2 : Gate1
3 : Source2
4 : Gate2
5 : Drain
6 : Drain
7 : Drain
8 : Drain
Electrical Connection
8
7
6
5
1
2
3
4
EMH8
Semiconductor Components Industries, LLC, 2013
July, 2013
53012 TKIM/91008PE TI IM TC-00001579 No. A1315-1/7
EMH2412
Electrical Characteristics at Ta=25°C
Parameter
Symbol
Drain-to-Source Breakdown Voltage
V(BR)DSS
Zero-Gate Voltage Drain Current
IDSS
Conditions
Ratings
min
typ
Unit
max
24
ID=1mA, VGS=0V
VDS=20V, VGS=0V
V
--1
μA
±10
μA
Gate-to-Source Leakage Current
IGSS
Cutoff Voltage
VGS(off)
VGS=±8V, VDS=0V
VDS=10V, ID=1mA
0.5
Forward Transfer Admittance
| yfs |
VDS=10V, ID=3A
2.8
RDS(on)1
RDS(on)2
16
21
27
mΩ
17
22
29
mΩ
RDS(on)3
ID=3A, VGS=4.5V
ID=3A, VGS=4V
ID=3A, VGS=3.1V
18
25
34
mΩ
RDS(on)4
ID=1.5A, VGS=2.5V
21
30
42
mΩ
Static Drain-to-Source On-State Resistance
Turn-ON Delay Time
td(on)
Rise Time
tr
Turn-OFF Delay Time
Fall Time
td(off)
tf
Total Gate Charge
Qg
Gate-to-Source Charge
Qgs
Gate-to-Drain “Miller” Charge
Qgd
Diode Forward Voltage
VSD
See specified Test Circuit.
VDS=10V, VGS=4.5V, ID=6A
1.3
4.8
310
ns
1020
ns
3000
ns
2250
ns
6.3
nC
0.83
nC
1.9
IS=6A, VGS=0V
V
S
0.8
nC
1.2
V
Switching Time Test Circuit
4.5V
0V
VDD=10V
VIN
ID=3A
RL=3.33Ω
VIN
D
PW=10μs
D.C.≤1%
G
VOUT
Rg
EMH2412
P.G
50Ω
S
Rg=2kΩ
Ordering Information
Device
EMH2412-TL-H
Package
Shipping
memo
EMH8
3,000pcs./reel
Pb Free and Halogen Free
No. A1315-2/7
EMH2412
ID -- VDS
6
VGS=1.5V
1
1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
Drain-to-Source Voltage, VDS -- V
Static Drain-to-Source
On-State Resistance, RDS(on) -- mΩ
3A
40
30
20
10
0
1
2
3
4
5
6
7
Gate-to-Source Voltage, VGS -- V
1.0
Source Current, IS -- A
Forward Transfer Admittance, | yfs | -- S
C
5°
--2
°C
75
°C
25
7
5
3
2
3
5 7 0.1
2
3
5 7 1.0
2
3
SW Time -- ID
7
Switching Time, SW Time -- ns
5
VDD=10V
VGS=4.5V
td(off)
3
tf
2
1000
tr
7
5
td(on)
3
2
0.1
30
20
2
3
5
7
1.0
2
Drain Current, ID -- A
3
5
7
IT13207
1.6
1.8
IT13202
--40 --20
0
20
40
60
80
100
120
140
160
IT13997
IS -- VSD
VGS=0V
3
2
1.0
7
5
3
2
0.1
7
5
0.4
0.6
0.8
1.0
1.2
Diode Forward Voltage, VSD -- V
IT13999
VGS -- Qg
4.5
VDS=10V
ID=6A
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
10
1.4
10
0.01
0.2
5 7 10
IT13998
Drain Current, ID -- A
1.2
5A
=1.
, ID
V
5
.
=2
VGS
3.0A
, I D=
V
0
.
=4
3.0A
VGS
, I D=
V
5
.
=4
VGS
40
3
2
2
0.1
0.01
1.0
50
10
7
5
3
0.8
Ambient Temperature, Ta -- °C
5
=
Ta
0.6
RDS(on) -- Ta
0
--60
8
VDS=10V
2
0.4
IT13996
| yfs | -- ID
10
0.2
60
Gate-to-Source Voltage, VGS -- V
Static Drain-to-Source
On-State Resistance, RDS(on) -- mΩ
ID=1.5A
0
Gate-to-Source Voltage, VGS -- V
Ta=25°C
50
7
0
1.0
IT13201
RDS(on) -- VGS
60
0
2
Ta=7
5°C
25°C
--25°C
0
3
--25°C
2
4
25°C
3
5
Ta=7
5°C
1.8V
Drain Current, ID -- A
4
VDS=10V
V
2.0
3.5V
Drain Current, ID -- A
5
ID -- VGS
7
2.5V
4.5V 4.0V
6
0
1
2
3
4
5
Total Gate Charge, Qg -- nC
6
7
IT13209
No. A1315-3/7
EMH2412
ASO
2
10
7
5
3
2
IDP=60A
10
ID=6A
DC
10
0
1m μs
s
ms
0m
s
10
op
era
tio
1.0
7
5
3
2
0.1
7
5
3
2
PW≤10μs
Allowable Power Dissipation, PD -- W
Drain Current, ID -- A
100
7
5
3
2
Operation in this area
is limited by RDS(on).
n(
Ta
=2
5°
C)
Ta=25°C
Single pulse
When mounted on ceramic substrate
(900mm2×0.8mm) 1unit
0.01
0.01
2 3
5 7 0.1
2 3
5 7 1.0
PD -- Ta
1.6
2 3
5 7 10
Drain-to-Source Voltage, VDS -- V
2 3
5
IT13983
When mounted on ceramic substrate
(900mm2×0.8mm)
1.4
1.3
1.2
1.0
To
t
0.8
1u
al
ni
di
ss
t
ip
ati
on
0.6
0.4
0.2
0
0
20
40
60
80
100
120
Ambient Temperature, Ta -- °C
140
160
IT13984
No. A1315-4/7
EMH2412
Embossed Taping Specification
EMH2412-TL-H
No. A1315-5/7
EMH2412
Outline Drawing
EMH2412-TL-H
Land Pattern Example
Mass (g) Unit
0.008 mm
* For reference
Unit: mm
1.9
0.4
0.3
0.5
No. A1315-6/7
EMH2412
Note on usage : Since the EMH2412 is a MOSFET product, please avoid using this device in the vicinity of
highly charged objects.
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PS No. A1315-7/7