LB11685AV
Monolithic Digital IC
3‐phase Sensor Less Motor
Driver
Overview
The LB11685AV is a three-phase full-wave current-linear-drive
motor driver IC. It adopts a sensor less control system without the use
of a Hall Effect device. For quieter operation, the LB11685AV
features a current soft switching circuit and be optimal for driving the
cooling fan motors used in refrigerators, etc.
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Functions
•
•
•
•
•
•
•
•
Three-phase Full-wave Linear Drive (Hall Sensor-less Method)
Built-in Current Limiter Circuit
Built-in Three-phase Output Voltage Control Circuit
Built-in Motor Lock Protection Circuit
Motor Lock Protection Detection Output
FG Output Made by Back EMF
Built-in Thermal Shut Down Circuit
Beat Lock Prevention Circuit
SSOP24J
CASE 565AS
MARKING DIAGRAM
XXXXXXXXXX
YMDDD
Specifications
MAXIMUM RATINGS (TA = 25°C)
Ratings
Unit
VCC max
19
V
XXXXX = Specific Device Code
Y = Year
M = Month
DDD = Additional Traceability Data
Input Applied
Voltage
VIN max
−0.3 to VCC + 0.3
V
PIN ASSIGNMENT
Maximum Output
Current
IO max
(Note 1)
1.2
A
Allowable Power
Dissipation
Pd max
1.05
W
Parameter
Symbol
Maximum Supply
Voltage
Conditions
Mounted on
a board (Note 2)
Operating
Temperature
Topr
−40 to +85
°C
Storage
Temperature
Tstg
−55 to +150
°C
Junction
Temperature
Tj max
150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. The IO is a peak value of motor-current.
2. Specified board: 76.1 mm × 114.3 mm × 1.6 mm, glass epoxy board.
CAUTION: Absolute maximum ratings represent the value which cannot be
exceeded for any length of time.
CAUTION:
UOUT
(NC)
(NC)
PGND
MCOM
(NC)
SGND
FG
RD
(NC)
VCO
CX
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
VOUT
WOUT
(NC)
(NC)
RF
VCC
REG
VOH
FC1
FC2
C2
C1
ORDERING INFORMATION
See detailed ordering and shipping information on page 7 of
this data sheet.
Even when the device is used within the range of absolute
maximum ratings, as a result of continuous usage under high
temperature, high current, high voltage, or drastic temperature
change, the reliability of the IC may be degraded. Please
contact us for the further details.
© Semiconductor Components Industries, LLC, 2013
January, 2018 − Rev. 1
1
Publication Order Number:
LB11685AV/D
LB11685AV
RECOMMENDED OPERATING CONDITIONS (TA = 25°C)
Parameter
Symbol
VCC
VCC op
Conditions
Recommended Supply Voltage
Operating Supply Voltage
Ratings
Unit
12.0
V
4.5 to 18.0
V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)
Parameter
Symbol
ICC
Conditions
Supply Current
FC1 = FC2 = 0 V
VREG
Internal Regulate Voltage
VOSOUR
Output Voltage (Source)
IO = 0.8 A (Note 5)
VOSINK
Output Voltage (Sink)
IO = 0.8 A (Note 5)
VOLIM
Current Limiter
Min
Typ
Max
Unit
5
10
20
mA
3.0
3.3
3.6
V
1.3
1.7
V
0.5
1.3
V
0.300
0.332
V
0
VCC − 2
V
0.268
VINCOM
MCOM Pin
Common-input Voltage Range
ICOM+
MCOM Pin
Source Current for Hysteresis
MCOM = 7 V
30
80
mA
ICOM−
MCOM Pin
Sink Current for Hysteresis
MCOM = 7 V
30
80
mA
RTCOM
MCOM Pin
Hysteresis Current Ratio
RTCOM = ICOM+ / ICOM−
0.6
1.4
IVCO
VCO Input Bias Current
VCO = 2.3 V
fVCOmin
VCO Oscillation Minimum Frequency
VCO = 2.1 V, CX = 0.015 mF
Design target (Note 4)
930
Hz
fVCOmax
VCO Oscillation Maximum Frequency
VCO = 2.7 V, CX = 0.015 mF
Design target (Note 4)
8.6
kHz
CX Charge/Discharge Current
VCO = 2.5 V, CX = 1.6 V
ICX
0.2
70
100
140
0.35
0.55
0.75
mA
mA
DVCX
CX Hysteresis Voltage
IC1(2)+
C1 (C2) Charge Current
VCO = 2.5 V, C1(2) = 1.3 V
12
20
28
mA
IC1(2)−
C1 (C2) Discharge Current
VCO = 2.5 V, C1(2) = 1.3 V
12
20
28
mA
RTC1(2)
C1 (C2) Charge/Discharge Current Ratio
RTC1(2) = IC1(2)+ / IC1(2)−
0.8
1.0
1.2
RTCCHG
C1/C2 Charge Current Ratio
RTCCHG = IC1+ / IC2+
0.8
1.0
1.2
RTCDIS
C1/C2 Discharge Current Ratio
RTCDIS = IC1− / IC2−
0.8
1.0
1.2
VCW1(2)
C1 (C2) Cramp Voltage Width
1.0
1.3
1.6
V
VFGL
FG Output Low Level Voltage
IFG = 3 mA
0.5
V
VRDL
RD Output Low Level Voltage
IRD = 3 mA
0.5
V
TTSD
Thermal Shut Down Operating Temperature
(Note 3)
Junction temperature
Design target (Note 4)
DTTSD
Thermal Shut Down Hysteresis Temperature
(Note 3)
Junction temperature
Design target (Note 4)
150
180
°C
15
°C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. The thermal shut down circuit is built-in for protection from damage of IC. But its operation is out of Topr. Design thermal calculation at normal
operation.
4. Design target value and no measurement is made.
5. The IO is a peak value of motor-current.
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2
LB11685AV
Allowable Power Dissipation,
Pd max (W)
1.5
Specified circuit board:
114.3 × 76.1 × 1.6 mm3
glass epoxy board
1.05
1.0
0.55
0.5
0
−40
−20
0
20
40
60
Ambient Temperature, TA (5C)
Figure 1. Pd max − TA
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3
80
100
LB11685AV
BLOCK DIAGRAM
1
24
2
23
3
22
Pre Drive
Distributor
4
21
Output Switching
Control
5
Start Up
&
Mask Timing
6
7
Reference
Voltage
20
Bandgap
19
Power On Reset
18
TSD
8
Motor Lock
Detector
17
Torque Ripple
Rejection &
Current Limit
9
FG
10
16
15
PLL
Low Voltage
Control
11
14
Soft
Switching
VCO
12
13
Figure 2. Block Diagram
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4
LB11685AV
PIN FUNCTION
PIN FUNCTION
Pin Name
1
23
24
UOUT
WOUT
VOUT
Each output pin of three phases.
4
PGND
GND pin in the output part.
This pin is connected to GND. The SGND pin is
also connected to GND
20
5
RF
MCOM
Function
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Pin No.
Equivalent Circuit
Pin No. 20
Pin No. 1, 23, 24
Pin to detect output current.
By connecting a resistor between this pin and
VCC, the output current is detected as a voltage.
The current limiter is operated by this voltage.
Pin No. 4
Motor coil midpoint input pin.
The coil voltage waveform is detected based on
this voltage.
SGND SGND SGND
VCC
VCC
Pin No. 5
SGND
SGND
7
SGND
8
FG
9
11
RD
VCO
Ground pin (except the output part)
This pin is connected to GND.
The PGND pin is also connected to GND.
FG out made by back EMF pin.
It synchronizes FG out with inverted V-phase.
When don’t use this function, open this pin.
Motor lock protection detection output pin.
Output with L during rotation of motor.
Open during lock protection of motor
(High-impedance).
When don’t use this function, open this pin.
PLL output pin and VCO input pin.
To stabilize PLL output, connect a capacitor
between this pin and GND.
Pin No. 8, 9
SGND
SGND
VREG
VCC
Pin No. 11
VREG
SGND
VREG
500 kW
SGND
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5
LB11685AV
PIN FUNCTION (continued)
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Pin No.
Pin Name
Function
Equivalent Circuit
12
CX
VCO oscillation output pin.
Operation frequency range and minimum
frequency are determined by the capacity of the
capacitor connected to this pin.
VREG
VCC
Pin No. 12
SGND
SGND
13
14
C1
C2
Soft switching adjustment pin.
The triangular wave from is form formed by
connecting a capacitor with this pin.
And, the switching of three-phase output is
adjusted by the slope.
VCC
Pin No. 13, 14
SGND
SGND
15
FC2
Frequency characteristic correction pin 2.
To suppress the oscillation of control system
closed loop of sink-side, connect a capacitor
between this pin and GND.
VREG
VCC
Pin No. 15
SGND
SGND
16
FC1
Frequency characteristic correction pin 1.
To suppress the oscillation of control system
closed loop of source-side, connect a capacitor
between this pin and GND.
VCC
Pin No. 16
SGND
SGND
17
VOH
Three-phase output high level output pin.
To stabilize the output voltage of this pin,
connect a capacitor between this pin and the
VCC pin.
VCC
VCC
SGND
Pin No. 17
SGND
18
VREG
DC voltage (3.3 V) output pin.
Connect a capacitor between this pin and GND
for stabilization.
VCC
VCC
Pin No. 18
SGND
SGND
19
VCC
Pin to supply power-supply voltage.
To curb the influence of ripple and noise.
The voltage should be stabilized.
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6
LB11685AV
APPLICATION CIRCUIT EXAMPLE
* Each fixed number in the following Figure 3, is the referential value.
0.1 mF
0.1 mF
0.1 mF
FAN MOTOR
1
24
2
23
3
22
4
21
5
20
6
19
7
18
8
17
9
16
10
15
11
14
12
13
0.1 mF
10 mF
1 mF
1 mF
0.015 mF
VCC
0.1 mF
1 mF
0.1 mF
0.01 mF
0.01 mF
Figure 3. Application Circuit Example
ORDERING INFORMATION
Device
Package
Wire Bond
Shipping† (Qty / Packing)
LB11685AV−TLM−H
SSOP24J (275mil)
(Pb-Free / Halogen Free)
Au-wire
2000 / Tape & Reel
LB11685AV−W−AH
SSOP24J (275mil)
(Pb-Free / Halogen Free)
Cu-wire
2000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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7
LB11685AV
PACKAGE DIMENSIONS
SSOP24J (275mil)
CASE 565AS
ISSUE A
1.00
SOLDERING FOOTPRINT*
7.00
(Unit: mm)
0.80
0.42
NOTE: The measurements are not to guarantee but for reference only.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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8
LB11685AV
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LB11685AV/D