LB11867RV
Variable Speed
Single‐phase Full‐wave
Pre‐driver for Fan Motor
Monolithic Digital IC
www.onsemi.com
Overview
LB11867RV is a single-phase bipolar driving motor pre-driver with
the variable speed function compatible with external PWM signal.
With a few external parts, a highly-efficient and highly-silent variable
drive fan motor with low power consumption can be achieved. This
product is best suited for driving of the server requiring large air flow
and large current and the fan motor of consumer appliances.
SSOP16
CASE 565AM
Features
• Single-phase Full-wave Driving Pre-driver
•
•
•
•
•
•
•
•
MARKING DIAGRAM
⇒ Low-saturation Drive Using External PMOS−NMOS Enables
High-efficiency Low Power-consumption Drive
Variable Speed Control Possible with External PWM Input
⇒ Separately-excited Upper Direct PWM (f =30 kHz) Control
Method Ensures Highly Silent Speed Control
Current Limiting Circuit Incorporated
⇒ Chopper Type Current Limiting Made at Startup and during Lock
Reactive Current Cut Circuit Incorporated
⇒ Reactive Current before Phase Changeover is Cut, Ensuring
Highly Silent and Low Power-consumption Drive
Minimum Speed Setting Pin
⇒ Minimum Speed can be Set by Setting the Resistance
Soft Start Setting Pin
Lock Protection and Automatic Reset Circuits Incorporated
RD (Lock Detection) Output
Thermal Shutdown Circuit Incorporated
Typical Applications
•
•
•
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XXXXXXXXXX
YMDDD
XXXX
Y
M
DDD
= Specific Device Code
= Year
= Month
= Additional Traceability Data
PIN ASSIGNMENT
1
16
OUT2P
OUT1P
OUT2N
OUT1N
VCC
Computing & Peripherals
Industrial
Server
Vending Machine
SGND
5VREG
SENSE
RMI
S−S
VTH
CT
CPWM
IN+
RD
IN−
8
(Top View)
9
ORDERING INFORMATION
See detailed ordering and shipping information on page 9 of
this data sheet.
© Semiconductor Components Industries, LLC, 2014
March, 2018 − Rev. 2
1
Publication Order Number:
LB11867RV/D
LB11867RV
SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Symbol
Parameter
VCC max
Conditions
Ratings
Unit
VCC Pin Maximum Supply Voltage
18
V
IOUTN max
OUTN Pin Maximum Output Current
20
mA
IOUTP max
OUTP Pin Maximum Sink Current
20
mA
VOUT max
OUT Pin Output Withstand Voltage
18
V
VVTH, VRMI max
VTH, RMI Pins Withstand Voltage
7
V
S−S Pin Withstand Voltage
7
V
VRD max
RD Output Pin Withstand Voltage
19
V
IRD max
RD Pin Maximum Output Current
10
mA
5VREG Pin Maximum Output Current
20
mA
800
mW
−30 to 95
°C
−55 to 150
°C
VS−S max
I5VREG max
Pd max
Allowable Power Dissipation
With specified substrate (Note 1)
Topr
Operating Temperature
(Note 2)
Tstg
Storage Temperature
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Specified substrate: 114.3 mm × 76.1 mm × 1.6 mm, glass epoxy board.
2. Tj max = 150°C must not be exceeded.
RECOMMENDED OPERATING CONDITIONS (TA = 25°C)
Symbol
VCC
VTH, RMI
VICM
Parameter
Conditions
VCC Supply Voltage
VTH, RMI Input Voltage Range
Hall Input Common-phase Input Voltage Range
Ratings
Unit
5.5 to 16
V
0 to 5
V
0.2 to 3
V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
ELECTRICAL CHARACTERISTICS (TA = 25°C, VCC = 12 V)
Symbol
Min
Typ
Max
Unit
During drive
5.5
7.5
9.5
mA
During lock protection
5.5
7.5
9.5
mA
I5VREG = 5 mA
4.80
4.95
5.10
V
Current Limiting Voltage
185
200
215
mV
VCPWMH
CPWM Pin “H” Level Voltage
2.8
3.0
3.2
V
VCPWML
CPWM Pin “L” Level Voltage
0.9
1.1
1.3
V
ICPWM1
CPWM Pin Charge Current
VCPWM = 0.5 V
24
30
36
mA
ICPWM2
CPWM Pin Discharge Current
VCPWM = 3.5 V
21
27
33
mA
FPWM
CPWM Oscillation Frequency
C = 220 pF
−
30
−
kHz
VCTH
CT Pin “H” Level Voltage
2.8
3.0
3.2
V
ICC1
Parameter
Circuit Current
ICC2
5VREG
VLIM
5VREG Voltage
Conditions
VCTL
CT Pin “L” Level Voltage
0.9
1.1
1.3
V
ICT1
CT Pin Charge Current
VCT = 0.5 V
1.6
2.0
2.5
mA
ICT2
CT Pin Discharge Current
VCT = 3.5 V
0.16
0.20
0.25
mA
RCT
CT Pin Charge/Discharge Ratio
ICT1/ICT2
8
10
12
times
IS−S
S−S Pin Discharge Current
VS−S = 1 V
0.4
0.5
0.6
mA
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2
LB11867RV
ELECTRICAL CHARACTERISTICS (TA = 25°C, VCC = 12 V) (continued)
Symbol
Parameter
Conditions
Min
Typ
Max
VONH
OUTN Output H-level Voltage
IO = 10 mA
−
VONL
OUTN Output L-level Voltage
IO = 10 mA
−
0.9
1.00
V
VOPL
OUTP Output L-level Voltage
IO = 10 mA
−
0.5
0.65
V
VHN
Hall Input Sensitivity
IN+,
differential voltage
(including offset and hysteresis)
−
±10
±20
mV
VRDL
RD Output L-level Voltage
IRD = 5 mA
−
0.15
0.30
V
IRDL
RD Pin Leakage Current
VRD = 19 V
−
−
20
mA
VTH/RMI Pin Bias Current
CPWM = VTH/RMI = 2 V
−
−
0.1
mA
IVTH/IRMI
IN−
VCC−0.85 VCC−1.00
Unit
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
Allowable Power Dissipation,
Pd max − mW
1000
Mounted on a specified board:
114.3 × 76.1 × 1.6 mm glass epoxy board
800
600
400
352
200
0
−30
95
0
30
60
90
Ambient Temperature, TA − 5C
Figure 1. Pd max − TA
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3
120
LB11867RV
BLOCK DIAGRAM
Figure 2. Block Diagram
TRUTH TABLE − DRIVE LOCK CPWM = H VTH, RMI, S−S = L
IN−
IN+
CT
OUT1P
OUT1N
OUT2P
OUT2N
FG
Mode
H
L
L
L
L
OFF
H
L
OUT1 → 2 drive
L
H
OFF
H
L
L
L
OUT2 → 1 drive
H
L
OFF
L
OFF
H
OFF
Lock protection
L
H
OFF
H
OFF
L
OFF
H
TRUTH TABLE − SPEED CONTROL CT, S−S = L
VTH, RMI
CPWM
IN−
IN+
OUT1P
OUT1N
OUT2P
OUT2N
Mode
L
H
H
L
L
L
OFF
H
OUT1 → 2 drive
L
H
OFF
H
L
L
OUT2 → 1 drive
H
L
H
L
OFF
L
OFF
H
Regeneration mode
L
H
OFF
H
OFF
L
NOTE:
For VTH, RMI, and S−S pins, refer to the timing chart.
www.onsemi.com
4
LB11867RV
APPLICATION CIRCUIT
Figure 3. Application Circuit Example (12 V)
This also has a soft switch section with ±30 mV
(input signal differential voltage).
It is also recommended that the Hall input level is
minimum 100 mV(p−p).
*5: CPWM Pin
Pin to connect the capacitor for generation of the
PWM basic frequency
The use of CP = 220 pF causes oscillation at
f = 30 kHz, which is the basic frequency of PWM.
As this is used also for the current limiting
canceling signal, be sure to connect the capacitor
even when the speed control is not made.
*6: RMI Pin
Minimum speed setting pin.
Perform pull-up with 5VREG when this pin is not
to be used.
If the IC power supply is likely to be turned OFF
first when the pin is used with external power
supply, be sure to insert the current limiting
resistor to prevent inflow of large current.
(The same applies to the VTH pin.)
*1: Power-GND Wiring
SGND is connected to the control circuit power
supply system.
*2: Power Stabilization Capacitor
For the power stabilization capacitor on the signal
side, use the capacitance of 1 mF or more.
Connect VCC and GND with a thick and shortest
pattern.
*3: Power Stabilization Capacitor on the Power Side
For the power stabilization capacitor on the power
side, use the capacitance of 1 mF or more.
Connect the power supply on the power side and
GND with a thick and shortest pattern.
*4: IN+, IN− Pins
Hall signal input pin.
Wiring should be short to prevent carrying of
noise.
If noise is carried, insert the capacitor between IN+
and IN− pins.
The Hall input circuit functions as a comparator
with hysteresis (15 mV).
www.onsemi.com
5
LB11867RV
*10: CT Pin
Pin to connect the lock detection capacitor.
The constant-current charge and discharge circuits
incorporated cause locking when the pin voltage
becomes 3.0 V and unlocking when it is 1.1 V.
Connect the pin to GND when it is not to be used
(locking not necessary).
*11: S−S Pin
Pin to connect the soft-start setting capacitor.
Connect the capacitor between 5VREG and S−S
pin.
This pin enables setting of the soft start time
according to the capacity of the capacitor.
See the timing char.
Connect the pin to GND when it is not to be used.
*7: VTH Pin
Speed control pin.
Connect this pin to GND when it is not used
(at full speed).
For the control method, refer to the timing chart.
For control with pulse input, insert the current
limiting resistor and use the pin with the frequency
of 20 kHz to 100 kHz (20 kHz to 50 kHz
recommended).
*8: SENSE Pin
Current limiting detection pin.
When the pin voltage exceeds 0.2 V, the current is
limited and the operation enters the lower
regeneration mode.
Connect this pin to GND when it is not to be used.
*9: RD Pin
Lock detection pin.
In open collector output, L upon rotation and H
when locked (using pull-up resistance).
Keep this pin open when it is not to be used.
www.onsemi.com
6
LB11867RV
CONTROL TIMING CHART (SPEED CONTROL)
Figure 4. Control Timing Chart − Speed Control
when the VTH voltage is low. The upper output
TR is turned OFF when the VTH voltage is high,
regenerating the coil current in the lower TR.
Therefore, as the VTH voltage decreases, the
output ON-DUTY increases, causing increase in
the coil current, raising the motor rotation speed.
3. Full Speed Mode
The full speed mode becomes effective when the
VTH voltage is 1.1 V or less. (Set VTH = GND
when the speed control is not to be made.)
1. Minimum Speed Setting (Stop) Mode
The low-speed fan rotation occurs at the minimum
speed set with the RMI pin. When the minimum
speed is not set (RMI pin pulled up to 5VREG),
the motor stops.
2. Low Speed ⇔ High Speed
PMW control is made by comparing the CPWM
oscillation voltage (1.1 V ⇔ 3.0 V) and VTH
voltage.
Both upper and lower output TRs are turned ON
www.onsemi.com
7
LB11867RV
CONTROL TIMING CHART (SOFT START)
1. At VTH < RMI Voltage
Figure 5. At VTH < RMI Voltage
2. At VTH > RMI Voltage
Figure 6. At VTH > RMI Voltage
Adjust the S−S pin voltage gradient by means of the capacitance of the capacitor between the S−S pin and 5VREG.
Recommended capacitor: 0.1 mF to 1 mF
www.onsemi.com
8
LB11867RV
ORDERING INFORMATION
Package
Wire Bond
Shipping† (Qty / Packing)
LB11867RV−MPB−H
SSOP16 (225mil)
(Pb−Free / Halogen Free)
Au−wire
90 / Fan−Fold
LB11867RV−TLM−E
SSOP16 (225mil)
(Pb−Free)
Au−wire
2,000 / Tape & Reel
LB11867RV−TLM−H
SSOP16 (225mil)
(Pb−Free / Halogen Free)
Au−wire
2,000 / Tape & Reel
LB11867RV−W−AH
SSOP16 (225mil)
(Pb−Free / Halogen Free)
Cu−wire
2,000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
9
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SSOP16 (225mil)
CASE 565AM
ISSUE A
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
5.80
(Unit: mm)
1.0
0.32
0.65
NOTE: The measurements are not to guarantee but for reference only.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON66065E
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
DATE 23 OCT 2013
SSOP16 (225MIL)
http://onsemi.com
1
XXXXXXXXXX
YMDDD
XXXXX = Specific Device Code
Y = Year
M = Month
DDD = Additional Traceability Data
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON66065E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION FROM SANYO ENACT# S−010 TO ON
SEMICONDUCTOR. REQ. BY D. TRUHITTE.
30 JAN 2012
A
ADDED MARKING AND SOLDER FOOTPRINT INFORMATION. REQ. BY D.
TRUHITTE.
23 OCT 2013
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Case Outline Number:
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