PFMT.013.250.A.2

FUSES / SICHERUNGEN Resettable fuses PFMT Typical Time to Trip at 23 ˚C Surface Mount PTC-Fuses Type PFMT 20 PFMT.013.250.C.2 PFMT.013.250.2 PFMT.013.250.A.2 10 5,4 x 8,5 mm High voltage surge capabilities Compliance to ITU K.20/K.21 specifications Packaged per EIA 486-B Time to trip (s) PFMT.013.250.B.2 Agency recognition: UL, CSA, TÜV 1 0.1 0.01 0.1 1 5 Fault current (A) 50 75 100 Solder pad layouts 1.8 (.071) 4.6 (.181) 9.7 (.382) Dimensions 1.8 (.071) 4.6 (.181) Side View C End View / Endansicht Typical Part Marking Layout may vary Passive Aging / passive Alterung Humidity Aging / Feuchtigkeitsalterung Thermal Shock / Thermischer Schock Solvent Resistance / Lösungsmittel-Beständigkeit Lead Solerability / Lötbarkeit Flammability / Entflammbarkeit Vibration End View / Endansicht A Used as a secondary overcurent protection device in: • Customer Premise Equipment (CPE) • Central Office (CO) • Subscriber Line Interface Cards (SLIC) C E D Applications Environmental Characteristics Operating/Storage Temperature / Einsatz/Lagertemp. Maximum Device Surface Temperature in Tripped State / B Part identification Manufacturer’s Trademark Resistance Bin Date code week 1 of 2000 = 0A (year and week) week 27 of 2000 = A0 (week and year) -45 °C to +85 °C 125 °C +85 °C, 1000 hours / Std. +60 °C, 1000 hours / Std. +85 °C, 85% R.H. 500 hours / Std. MIL-STD-202F, Method 107G +125 °C/–55 °C 10 times / Zyklen MIL-STD-202, Method 215B ANSI/J-STD-002 IEC 695-2-2 MIL-STD-883C, Method 2007.1, Condition A Test Procedures And Requirements For Model PFMT Series Test / Test Test Conditions / Bedingungen Visual/Mech. / visuell/mech. Verify dimensions and materials / Kontrolle Abmess./Mat. Resistance / Widerstand In still air @ 23°C / bei ruhiger Luft 23 °C Time to Trip / Trip-Zeit At specified current, Vmax 23 °C / Bei entspr. Strom Hold Current / Haltestrom 30 min. at Ihold / bei Haltestrom Trip Cycle Life / Trip-Zyklen Vmax, Imax, 100 cycles / Zyklen Trip Endurance / Zeit im Tripzustand Vmax, 48 hours / Stunden Solderability / Lötbarkeit MIL-STD-202F, Method 208F / Methode 208F ± 2% typ. resist. change ± 3% typ. resist. change ± 3% typ. resist. change ±10% typ. resist. change ±15% typ. resist. change No change No Flame for 60 sec. No change Accept/Reject Criteria Per MF physical description Rmin ≤ R ≤ Rmax T ≤ max. time to trip (sec.) No trip / Keine Auslösung No arcing or burning No arcing or burning 95% min. coverage www.schurter.com 19 FUSES / SICHERUNGEN Resettable fuses PFMT Electrical Characteristics Type / Typ Max. Oper. Voltage / Max. Interrupt Ratings / Hold Current / Initial Resistance / Volts Volts Amps at / bei 23 °C Ih 0.13 0.13 0.13 0.13 Ohms at / bei 23 °C min. 6.5 6.5 9.0 7.0 PFMT.013.250.2 PFMT.013.250.A.2 PFMT.013.250.B.2 PFMT.013.250.C.2 Amps max. 250 250 250 250 60 60 60 60 max. 3.0 3.0 3.0 3.0 One Hour Post-Trip Restistance / Ohms Ohms at / bei 23 °C at / bei 23 °C max. max. 12.0 20.0 9.0 20.0 12.0 20.0 10.0 20.0 Nom. Power Dissipation Watts at 650 V / 23 °C 3.3 3.3 3.3 3.3 Dimensions A Type / Typ min. 8.5 (0.335) 8.5 (0.335) 8.5 (0.335) 8.5 (0.335) PFMT.013.250.2 PFMT.013.250.A.2 PFMT.013.250.B.2 PFMT.013.250.C.2 max. 9.4 (0.370) 9.4 (0.370) 9.4 (0.370) 9.4 (0.370) Packaged: Tape and reel: 2000 pcs. per reel B max. 3.4 (0.134) 3.4 (0.134) 3.4 (0.134) 3.4 (0.134) C max. 7.4 (0.291) 7.4 (0.291) 7.4 (0.291) 7.4 (0.291) D nom. 0.3 (0.011) 0.3 (0.011) 0.3 (0.011) 0.3 (0.011) E nom. 3.75 (0.148) 3.75 (0.148) 3.75 (0.148) 3.75 (0.148) Dimensions in mm/inches Soldering Profile / Lötprofil How To Order PF 300 MT .xxx .xxx .x .x PTC-Fuse Temperature (° C) / T 250 Maximum Package Body Temperature (220 °C) 200 Style MT = Surface Mount/ Telecom Component Melting Temperature of Solder (183 °C) 150 2 Minutes or More 100 10° to 20 C per Second Less than 120 °C per Second Hold Current, Ihold 013 (0.13 Amps) 50 Max. Interrupt Voltage, V Preheat Flux Activation 0 0 30 60 100 150 Time (Seconde) (s) Reflow 200 Cool 250 (250 V) Resistance Sorted Ω A = 6.5-9Ω B = 9-12Ω C = 7-12Ω 250 Solder reflow • Recommended reflow methods: IR, vapor phase oven, hot air oven. • Devices are not designed to be wave soldered to the bottom side of the board. • Gluing the devices is not recommended. • Recommended maximum paste thickness is 0,25 mm (.010 inch). • Devices can be cleaned using standard industry methods and solvents. Packaging Options Packaged per EIA 486-B 2 = Tape and reel Note: • If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Rework • A device should not be reworked. Thermal Derating Chart-Ihold/Itrip (Amps) Type / Typ PFMT.013.250.2 PFMT.013.250.A.2 PFMT.013.250.B.2 PFMT.013.250.C.2 20 www.schurter.com Ambient Operating Temperature –40 ˚C –20 ˚C 0 ˚C 0.21/0.42 0.18/0.37 0.16/0.31 0.21/0.42 0.18/0.37 0.16/0.31 0.21/0.42 0.18/0.37 0.16/0.31 0.21/0.42 0.18/0.37 0.16/0.31 23 ˚C 0.13/0.26 0.13/0.26 0.13/0.26 0.13/0.26 40 ˚C 0.10/0.23 0.10/0.23 0.10/0.23 0.10/0.23 50 ˚C 0.09/0.18 0.09/0.18 0.09/0.18 0.09/0.18 60 ˚C 0.08/0.15 0.08/0.15 0.08/0.15 0.08/0.15 70 ˚C 0.07/0.12 0.07/0.12 0.07/0.12 0.07/0.12 85 ˚C 0.05/0.10 0.05/0.10 0.05/0.10 0.05/0.10