SSD01N60
Elektronische Bauelemente 1.6A, 600V,RDS(ON)8Ω N-Channel Enhancement Mode Power Mos.FET
RoHS Compliant Product
Description
TO-252
The SSD01N60 provide the designer with the best combination of fast switching. The TO-252 is universally preferred for all commercial-industrial surface mount applications and suited for AC/DC converters.
Featur es
* Dynamic dv/dt Rating
* Simple Drive Requirement * Fast Switching * Repetitive Avalanche Rated
D
REF. A B C D E F S
G
S
Millimeter Min. Max. 6.40 6.80 5.20 5.50 6.80 7.20 2.20 2.80 2.30 REF. 0.70 0.90 0.60 0.90
REF. G H J K L M R
Millimeter Min. Max. 0.50 0.70 2.20 2.40 0.45 0.55 0 0.15 0.90 1.50 5.40 5.80 0.80 1.20
Absolute Maximum Ratings
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current,VGS@10V Continuous Drain Current,VGS@10V Pulsed Drain Current
1
Symbol
V DS V GS ID@TC=25 C ID@TC=100C IDM PD@TC=25 C
o o o
Ratings
600
± 20 1.6 1 6 39 0.31
Unit
V V A A A W
W/ C
o
Total Power Dissipation Linear Derating Factor Single Pulse Avalanche Energy Avalanche Current Repetitive Avalanche Energy Operating Junction and Storage Temperature Range
2
EAS I AR EAR Tj, Tstg
13 1.6 0.5 -55~+150
mJ A mJ
o
C
Thermal Data
Parameter
Thermal Resistance Junction-case Thermal Resistance Junction-ambient
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Symbol Max. Max.
Rthj-c Rthj-a
Ratings
3.2 110
o o
Unit
C /W C /W
Any changing of specification will not be informed individual
01-Jun-2002 Rev. A
Page 1 of 5
SSD01N60
Elektronische Bauelemente 1.6A, 600V,RDS(ON)8Ω N-Channel Enhancement Mode Power Mos.FET
Electrical Characteristics( Tj=25 C Unless otherwise specified)
Parameter
Drain-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Gate Threshold Voltage Gate-Source Leakage Current Drain-Source Leakage Current (Tj=25 C ) Drain-Source Leakage Current(Tj=150C) Static Drain-Source On-Resistance
o o
o
Symbol
BVDSS BVDS/ Tj VGS(th) IGSS IDSS RD S ( O N ) Gfs Qg Qgs Qgd Td(ON) Tr Td(Off) Tf Ciss Coss Crss
Min.
600
_
Typ.
_
Max.
_
Unit
V V/ C V nA uA uA
Ω
o
Test Condition
VGS=0V, ID=250uA Reference to 25 C, ID=1mA VDS=VGS, ID=250uA VGS=± 20 V VDS=60 0V ,VGS=0 VDS=480 V,VGS=0 VGS=10V, ID=0.8A VDS=50V, ID=0.8A ID=1.6A VDS=480V VGS= 10V
o
0.6
_ _ _ _
_
2.0
_ _ _ _
4.0
±100
100 500 8.0
_
_ _ _
7.2
Forward Transconductance Total Gate Charge3 Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time3 Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance
_
_ _ _ _ _ _ _ _ _ _
0.8 7.7 1.5 2.6 8 5 14 7 286 25 5
S
nC
_
_ _ _ _ _ _
VDD=300V ID=1.6A nS VGS=10V RG=10 Ω RD=187.5 Ω
pF
VGS=0V VDS=25V f=1.0MHz
Source-Drain Diode
Parameter
Forward On Voltage 3 Continuous Source Current(Body Diode)
Pulsed Source Current(Body Diode)
1
Symbol
VSD IS
Min.
_ _
Typ.
_ _ _
Max.
1.5
Unit
V A A
Test Condition
IS=1.6A, VGS=0V.Tj=25C VD=VG=0V,VS=1.5 V
o
1.6
6
ISM
_
Notes: 1. Pulse width limited by saf e operating area. 2. Staring Tj=25 : , VDD=50V, L=10mH, RG=25 Ł , IAS=1.6A. 3. Pulse width 300us, duty cycle 2%.
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01-Jun-2002 Rev. A
Page 2 of 5
SSD01N60
Elektronische Bauelemente 1.6A, 600V,RDS(ON)8Ω N-Channel Enhancement Mode Power Mos.FET
Characteristics Curve
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
Fig 3. Normalized BVDSS v.s. Junction Temperature
Fig 4. Normalized On-Resistance v.s. Junction Temperature
Fig 5. Maximum Drain Current v.s. Case Temperature http://www.SeCoSGmbH.com/
01-Jun-2002 Rev. A
Fig 6. Type Power Dissipation
Any changing of specification will not be informed individual
Page 3 of 5
SSD01N60
Elektronische Bauelemente
1.6A, 600V,RDS(ON)8Ω N-Channel Enhancement Mode Power Mos.FET
Fig 7. Maximum Safe Operating Area
Fig 8. Effective Transient Thermal Impedance
Fig 9. Gate Charge Characteristics
Fig 10. Typical Capacitance Characteristics
Fig 11. Forward Characteristics of Reverse Diode
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01-Jun-2002 Rev. A
Fig 12. Gate Threshold Voltage v.s. Junction Temperature
Any changing of specification will not be informed individual
Page 4 of 5
SSD01N60
Elektronische Bauelemente 1.6A, 600V,RDS(ON)8Ω N-Channel Enhancement Mode Power Mos.FET
Fig 13. Switching Time Circuit
Fig 14. Switching Time Waveform
Fig 15. Gate Charge Circuit
Fig 16. Gate Charge Waveform
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Any changing of specification will not be informed individual
01-Jun-2002 Rev. A
Page 5 of 5
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