SSD95N03
Elektronische Bauelemente 96A , 30V , RDS(ON) 4m N-Ch Enhancement Mode Power MOSFET
RoHS Compliant Product A suffix of “-C” specifies halogen free
DESCRIPTION
The SSD95N03 is the highest performance trench N-ch MOSFETs with extreme high cell density , which provide excellent RDS(ON) and gate charge for most of the synchronous buck converter applications .
TO-252(D-Pack)
FEATURES
Advanced high cell density Trench technology Super Low Gate Charge Excellent CdV/dt effect decline 100% EAS Guaranteed Green Device Available
A B
C D
GE
K
HF
N O P
MARKING
95N03
Date Code
M
J
REF.
PACKAGE INFORMATION
Package TO-252 MPQ 2.5K Leader Size 13 inch
A B C D E F G H
Millimeter Min. Max. 6.35 6.80 5.20 5.50 2.15 2.40 0.45 0.58 6.8 7.5 2.40 3.0 5.40 6.25 0.64 1.20
REF.
J K M N O P
Millimeter Min. Max. 2.30 REF. 0.64 0.90 0.50 1.1 0.9 1.65 0 0.15 0.43 0.58
2
Drain
1
Gate
3
Source
ABSOLUTE MAXIMUM RATINGS (TA=25°C unless otherwise specified)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Pulsed Drain Current
2 4 1
Symbol
VDS VGS
Rating
30 ±20 96 88 192 62.5 0.42
Unit
V V A A A W W/° C mJ A ° C
VGS=10V, TC=25° C VGS=10V,TC=100° C
ID IDM
Total Power Dissipation Linear Derating Factor
TC=25° C
PD
Single Pulse Avalanche Energy Single Pulse Avalanche Current
3
EAS IAS TJ, TSTG
317 53.8 -55~175
Operating Junction and Storage Temperature Range
Thermal Resistance Rating
Maximum Thermal Resistance Junction-Ambient Maximum Thermal Resistance Junction-Case
http://www.SeCoSGmbH.com/ 1 1
RθJA RθJC
62 2.4
° /W C ° /W C
Any changes of specification will not be informed individually.
24-Nov-2011 Rev. A
Page 1 of 4
SSD95N03
Elektronische Bauelemente 96A , 30V , RDS(ON) 4m N-Ch Enhancement Mode Power MOSFET
ELECTRICAL CHARACTERISTICS (TJ=25°C unless otherwise specified)
Parameter Symbol Min. Static
Drain-Source Breakdown Voltage BVDSS 30 1.0 IDSS TJ =55° C Static Drain-Source On-Resistance Total Gate Charge Gate-Source Charge Gate-Drain (“Miller”) Change Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance
2
Typ.
Max.
Unit
Teat Conditions
0.0213 26.5 3.4 5.2 31.6 8.6 11.7 9 19 58 15.2 3075 400 315
2.5 ±100 1
V V/° C V S nA µA
VGS=0, ID=250µA Reference to 25° C, ID=1mA VDS=VGS, ID=250µA VDS=5V, ID=30A VGS= ±20V VDS=24V, VGS=0 V DS=24V, VGS=0 VGS=10V, ID=30A
Breakdown Voltage Temperature Coefficient △BVDSS /△TJ Gate-Threshold Voltage Forward Transconductance Gate-Source Leakage Current TJ =25° C Drain-Source Leakage Current VGS(th) gfs IGSS
RDS(ON) Qg Qgs Qgd Td(on) Tr Td(off) Tf Ciss Coss Crss -
5 4 m 6 nS 4000 530 pF nC
VGS=4.5V, ID=15A ID=15A VDS=15V VGS=4.5V
VDD=15 V ID=15A VGS=10V RG=3.3
VGS =0 VDS=15 V f =1.0MHz
Guaranteed Avalanche Characteristics
Single Pulse Avalanche Energy
5
EAS
98
-
-
mJ
VDD=25V,L=0.1mH , IAS=30A
Source-Drain Diode
Diode Forward Voltage
2 1,6
VSD IS ISM
-
-
1.2 96 192
V A
IS=30A, VGS=0 VD=VG=0, Force Current
Continuous Source Current Pulsed Source Current
2,6
A
Notes: 1. The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper. 2. The data tested by pulsed , pulse width≦300µs , duty cycle≦2% 3. The EAS data shows Max. rating . The test condition is VDD=25V,VGS=10V,L=0.1mH,IAS=53.8A 4. The power dissipation is limited by 175° junct ion temperature C 5. The Min. value is 100% EAS tested guarantee. 6. The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
24-Nov-2011 Rev. A
Page 2 of 4
SSD95N03
Elektronische Bauelemente 96A , 30V , RDS(ON) 4m N-Ch Enhancement Mode Power MOSFET
CHARACTERISTIC CURVES
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
24-Nov-2011 Rev. A
Page 3 of 4
SSD95N03
Elektronische Bauelemente 96A , 30V , RDS(ON) 4m N-Ch Enhancement Mode Power MOSFET
CHARACTERISTIC CURVES
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
24-Nov-2011 Rev. A
Page 4 of 4
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