SSG4407
-10.7A, -30V,RDS(ON) 14mΩ Elektronische Bauelemente
P-Channel Enhancement Mode Power Mos.FET
RoHS Compliant Product
Description
The SSG4407 provide the designer with the best Combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The SOP-8 is universally preferred for all commercial industrial surface mount application and suited for low voltage applications such as DC/DC converters.
0.35 0.49
SOP-8
0.40 0.90 6.20 5.80 0.25
0.19 0.25
45
o
0.375 REF
3.80 4.00
1.27 Typ. 4.80 5.00 0.10 0.25
Featur es
* Lower On-Resistance * Simple Drive Requirement * Fast Switching Characteristic
D 8 D 7 D 6 D 5
0 o 8
o
1.35 1.75
Dimensions in millimeters
D
Date Code
4407SC
G
1 S 2 S 3 S 4 G
S
Absolute Maximum Ratings
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Continuous Drain Current Pulsed Drain Current
1 3 3
Symbol
VD S VG S ID@TA=25 oC ID@TA=70 C IDM PD@TA=25 C
o o
Ratings
-30
±25 -10.7 -8.6 -50 2 .5 0. 02
Unit
V V A A A W
W / oC
o
Total Power Dissipation Linear Derating Factor Operating Junction and Storage Temperature Range
Tj, Tstg
-55~+150
C
Thermal Data
Parameter
Thermal Resistance Junction-ambient
3
Symbol
Max. Rthj-a
Ratings
50
Unit
o
C /W
http://www.SeCoSGmbH.com/
Any changing of specification will not be informed individual
01-Jun-2002 Rev. A
Page 1 of 4
SSG4407
Elektronische Bauelemente
o
-10.7A, -30V,RDS(ON) 14mΩ
P-Channel Enhancement Mode Power Mos.FET
Electrical Characteristics( Tj=25 C Unless otherwise specified)
Parameter
Drain-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Gate Threshold Voltage Gate-Source Leakage Current Drain-Source Leakage Current (Tj=25 C ) Drain-Source Leakage Current(Tj= 70 C ) Static Drain-Source On-Resistance
2
o o
Symbol
BVDSS BVDS/ Tj VGS(th) IGSS IDSS
Min.
- 30
_
Typ.
_ - 0.015 _ _ _ _ _ _
Max.
_
Unit
V V/ C V nA uA uA
o
Test Condition
VGS=0V, ID=-2 50uA Reference to 25 C, ID=- 1mA VDS=VGS, ID=- 250uA VGS=±25V VDS=-3 0V,VGS=0 VDS=-2 4V,VGS=0 VGS=-1 0V, ID=- 10 A VGS=- 4.5V, ID=- 5 A
o
_
-1.0
_ _ _ _
-3.0
±100
-1 -25 14 20
46
_ _
RD S ( O N ) Qg Qgs Qgd Td(ON) Tr Td(Off) Tf Ciss Coss Crss Gfs
_ _ _ _ _ _ _ _ _ _ _
mΩ
Total Gate Charge2 Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time2 Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Forward Transconductance
29 6 14 15 12 100 70 2600 500 370 13
nC
ID=- 10.7A VDS=-24V VGS=-4.5V
_
_ _ _
VDD=-15V ID=-1A nS VGS=-10 V RG=3.3Ω RD=15 Ω
4100
_ _
pF
VGS=0V VDS=-25V f=1.0MHz
_
_
S
VDS=-1 0V, ID=-10A
Source-Drain Diode
Parameter
Forward On Voltage 2 Reverse Recovery Time
Reverse Recovery Change
Symbol
VSD Trr
Min.
_ _
Typ.
_
Max.
- 1 .2
_ _
Unit
V nS nC
Test Condition
IS=-10 .7A, VGS=0V. IS=-10.7A, VGS=0V. dl/dt=100A/us
31
25
Qrr
_
Notes: 1. Pulse width limited by Max. junction temperature. 2. Pulse width≦300us, dutycycle≦2%. 2 o 3. Surface mounted on 1 in copper pad of FR4 board;125 C/W when mounted on min. copper pad.
http://www.SeCoSGmbH.com/ Any changing of specification will not be informed individual
01-Jun-2002 Rev. A
Page 2 of 4
SSG4407
-10.7A, -30V,RDS(ON) 14mΩ Elektronische Bauelemente
P-Channel Enhancement Mode Power Mos.FET
Characteristics Curve
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance v.s. Junction Temperature
Fig 5. Forward Characteristics of Reverse Diode http://www.SeCoSGmbH.com/
01-Jun-2002 Rev. A
Fig 6. Gate Threshold Voltage v.s. JunctionAny empeof ature will not be informed individual Tchanging r specification
Page 3 of 4
SSG4407
-10.7A, -30V,RDS(ON) 14mΩ Elektronische Bauelemente
P-Channel Enhancement Mode Power Mos.FET
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
12
/W
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
Fig 11. Switching Time Waveform
Fig 12. Gate Charge Waveform
http://www.SeCoSGmbH.com/
Any changing of specification will not be informed individual
01-Jun-2002 Rev. A
Page 4 of 4
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