SSG4639STM
Elektronische Bauelemente P-Ch Enhancement Mode Power MOSFET -14 A, -30 V, RDS(ON) 8.5 m
FEATURES
Super high dense cell design for low RDS(on). Rugged and reliable. Surface Mount Package. ESD Protected.
SOP-8
B
PRODUCT SUMMARY
VDSS(V) -30 PRODUCT SUMMARY RDS(on) m( 8.5@VGS= -10V 13@VGS= -4.5V ID(A) -14
A C N J
K
L
D M
MARKING
D 8 D 7 D 6 D 5
H
G
F
E
REF. A B C D E F G
STM4639
4 G
= Date Code
1 S
2 S
3 S
Millimeter Min. Max. 5.80 6.20 4.80 5.00 3.80 4.00 0° 8° 0.40 0.90 0.19 0.25 1.27 TYP.
REF. H J K L M N
Millimeter Min. Max. 0.35 0.49 0.375 REF. 45° 1.35 1.75 0.10 0.25 0.25 REF.
MAXIMUM RATINGS (TA = 25°C unless otherwise specified)
PARAMETER
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current a Pulsed Drain Current
b
SYMBOL
VDS VGS ID @ TA = 25°C ID @ TA = 70°C IDM EAS PD @ TA = 25°C PD @ TA = 70°C TJ, TSTG RθJA THERMAL RESISTANCE RATINGS
RATINGS
-30 ±20 -14 -11.2 -79 180 2.5 1.6 -55 ~ 150 50
UNIT
V V A A A mJ W W °C °C / W
Single Pulse Avalanche Energy d Maximum Power Dissipation a Operating Junction & Storage Temperature Range Thermal Resistance Junction-ambient a
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
13-May-2010 Rev. B
Page 1 of 5
SSG4639STM
Elektronische Bauelemente P-Ch Enhancement Mode Power MOSFET -14 A, -30 V, RDS(ON) 8.5 m
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified)
PARAMETER
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Body Leakage Current Gate Threshold Voltage Drain-Source On-State Resistance Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Maximum Continuius Drain-Source Diode Forward Current Diode Forward Voltage b
Notes a. b. c. d. Surface Mounted on FR4 Board, t ≦ 10 sec. Pulse Test:Pulse Width ≦ 300 μs, Duty Cycle ≦ 2%. Guaranteed by design, not subject to production testing. Starting TJ=25°C, L=3.0mH, VDD=30V, VGS=10V. (See Figure13)
SYMBOL
BVDSS IDSS IGSS VGS(th) RDS(ON) gfs CISS COSS CRSS Td(on) Tr Td(off) Tf Qg Qgs Qgd
MIN.
-30 -0.8 -
TYP.
-1.7 7 9.8 32 4049 641 351 24 68 484 188 95 40 6 23
MAX.
-1 ±10 -2.0 8.5 13 C
UNIT
V μA μA V mΩ S
TEST CONDITIONS
VGS=0V, ID=250μA VDS= -24V, VGS=0V VGS=±20V, VDS=0V VDS= VGS, ID=-250μA VGS=-10V, ID=-14A VGS=-4.5V, ID=-11.3A VDS=-10V, ID=-14A
OFF CHARACTERISTICS
ON CHARACTERISTICS
DYNAMIC CHARACTERISTICS -
pF
VDS=-15V, VGS=0V, f=1.0MHz
SWITCHING CHARACTERISTICS C VDD=-15V ID=-1A VGS=-10V RGEN=3Ω VDS=-15V, ID=-14A, VGS=-10V nC VDS=-15V, ID=-14A, VGS=-4.5V VDS=-15V, ID=-14A, VGS=-10V
nS
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS IS VSD -0.7 -2.0 -1.2 A V VGS=0V, IS=-2.0A
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
13-May-2010 Rev. B
Page 2 of 5
SSG4639STM
Elektronische Bauelemente P-Ch Enhancement Mode Power MOSFET -14 A, -30 V, RDS(ON) 8.5 m
CHARACTERISTIC CURVE
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
13-May-2010 Rev. B
Page 3 of 5
SSG4639STM
Elektronische Bauelemente P-Ch Enhancement Mode Power MOSFET -14 A, -30 V, RDS(ON) 8.5 m
CHARACTERISTIC CURVE
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
13-May-2010 Rev. B
Page 4 of 5
SSG4639STM
Elektronische Bauelemente P-Ch Enhancement Mode Power MOSFET -14 A, -30 V, RDS(ON) 8.5 m
CHARACTERISTIC CURVE
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
13-May-2010 Rev. B
Page 5 of 5
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