SSG9478

SSG9478 4.8A, 60V,RDS(ON) 64mΩ Elektronische Bauelemente N-Channel Enhancement Mode Power Mos.FET RoHS Compliant Product SOP-8 Description The SSG9478 provide the designer with the best Combination of fast switching, ruggedized device design, Ultra low on-resistance and cost-effectiveness. The SOP-8 is universally preferred for all commercial industrial surface mount application and suited for low voltage applications such as DC/DC converters. 0.35 0.49 1.27Typ. 4.80 5.00 0.100.25 3.80 4.00 6.20 5.80 0.25 0.40 0.90 0.19 0.25 45 o 0.375 REF Features * Simple drive requirement * Low gate charge D 8 D 7 D 6 D 5 0 o 8 o 1.35 1.75 Dimensions in millimeters D * Fast switching Characteristic Date Code 9478SC G 1 S 2 S 3 S 4 G S Absolute Maximum Ratings Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Continuous Drain Current Pulsed Drain Current 1 3 Symbol VDS VGS ID@TA=25 C ID@TA=70 C IDM PD@TA=25 C o o o Ratings 60 ±25 4.8 3.8 30 2.5 0.02 Unit V V A A A W W / oC o 3 Total Power Dissipation Linear Derating Factor Operating Junction and Storage Temperature Range Tj, Tstg -55~+150 C Thermal Data Parameter Thermal Resistance Junction-ambient Max. Symbol Rthj-a Ratings 50 o Unit C /W http://www.SeCoSGmbH.com/ Any changing of specification will not be informed individual 01-Jun-2002 Rev. A Page 1 of 4 SSG9478 Elektronische Bauelemente 4.8A, 60V,RDS(ON) 64mΩ N-Channel Enhancement Mode Power Mos.FET Electrical Characteristics( Tj=25 C Unless otherwise specified) Parameter Drain-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Gate Threshold Voltage Gate-Source Leakage Current Drain-Source Leakage Current (Tj=25 C) Drain-Source Leakage Current (Tj=70 C) Static Drain-Source On-Resistance 2 o o o Symbol BVDSS BVDS/ Tj VGS(th) IGSS IDSS Min. 60 _ Typ. _ Max. _ _ Unit V V/ C V nA uA uA o Test Condition VGS=0V, ID=250uA Reference to 25 C,ID=1mA VDS=VGS, ID=250uA VGS=± 25V VDS=60V,VGS=0 VDS=48V,VGS=0 VGS=10V, ID=4A VGS=4.5V, ID=3A o 0.06 _ _ _ _ 1.0 _ _ _ _ 3.0 ±100 1 25 64 72 15 _ _ _ _ 9 2 5 8 6 20 4 710 80 51 6 2.1 RDS(ON) Qg Qgs Qgd Td(ON) Tr Td(Off) Tf Ciss Coss Crss Gfs Rg _ _ _ _ _ _ _ _ _ _ _ mΩ Total Gate Charge 2 Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Forward Transconductance Gate Resistance 2 nC ID=4A VDS=48V VGS=4.5V _ _ _ _ VDD=30V ID=1A nS VGS=10V RG=3.3 Ω RD=30 Ω 1140 _ _ pF VGS=0V VDS=25V f=1.0MHz _ _ S Ω VDS=10V, ID=4A _ _ f=1.0MHz Source-Drain Diode Parameter Forward On Voltage 2 Symbol VDS Min. _ Typ. _ Max. 1.2 Unit V Test Condition IS=2A, VGS=0V. Is=4A, VGS=0V dl/dt=100A/us Reverse Recovery Time 2 Trr Qrr _ _ 28 36 _ _ nS nC Reverse Recovery Charge Notes: 1.Pulse width limited by safe operating area. 2.Pulse width≦300us, dutycycle≦2%. 3.Surface mounted on 1 inch2 copper pad of FR4 board; 135OC/W when mounted on min. copper pad. http://www.SeCoSGmbH.com/ Any changing of specification will not be informed individual 01-Jun-2002 Rev. A Page 2 of 4 SSG9478 Elektronische Bauelemente 4.8A, 60V,RDS(ON) 64mΩ N-Channel Enhancement Mode Power Mos.FET Characteristics Curve Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature http://www.SeCoSGmbH.com/ Fig 5. Forward Characteristics of Reverse Diode Fig 6. Gate Threshold Voltage v.s. Junction Temperature Any changing of specification will not be informed individual 01-Jun-2002 Rev. A Page 3 of 4 SSG9478 Elektronische Bauelemente 4.8A, 60V,RDS(ON) 64m Ω N-Channel Enhancement Mode Power Mos.FET Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance Fig 11. Switching Time Circuit http://www.SeCoSGmbH.com/ Fig 12. Gate Charge Waveform Any changing of specification will not be informed individual 01-Jun-2002 Rev. A Page 4 of 4