SSRF4N60
Elektronische Bauelemente 4A , 600 V , RDS(ON) 2.4 Ω N-Channel Enhancement Mode Power MOSFET
RoHS Compliant Product A suffix of “-C” specifies halogen and lead-free
DESCRIPTION
The N-Channel MOSFET is used an advanced termination scheme to provide enhanced voltage-blocking capability without degrading performance over time. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance. This device is well suited for high efficiency switched mode power suppliers, active power factor correction, electronic lamp ballasts based half bridge topology. ITO-220
B
N
D E
M
A
FEATURES
Robust high voltage termination Avalanche energy specified Diode is characterized for use in bridge circuits Source to Drain diode recovery time comparable to a discrete fast recovery diode.
H
2
Drain
J K L
A B C D E F G Millimeter Min. Max. 14.60 15.70 9.50 10.50 12.60 14.00 4.30 4.70 2.30 3.2 2.30 2.80 0.30 0.70
C G F
REF. H J K L M N Millimeter Min. Max. 2.70 3.80 0.90 1.50 0.50 0.90 2.34 2.74 2.40 3.00 φ 3.0 φ 3.4
L
REF.
1
Gate
3
Source
ABSOLUTE MAXIMUM RATINGS(TC=25°C unless otherwise specified )
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Pulsed Drain Current Power Dissipation
2
Symbol
VDS VGS ID IDM PD
Ratings
600 ±30 4.0 16 33 0.26
Unit
V V A A W W/° C mJ mJ °C
Derating factor above 25° C Single Pulsed Avalanche Energy Repetitive Avalanche Energy
2 1
EAS EAR TJ, Tstg
330 7.3 150,-55~150
Operating Junction and Storage Temperature Range
Thermal Resistance Rating
Maximum Junction to Ambient Maximum Junction to Case RθJA RθJC 62.5 ° /W C 3.79
Notes: 1. L=30mH, IAS=4.4A, VDD=85V, RG=25 , Starting TJ=25° C 2. Repetitive Rating: Pulse width limited by maximum junction temperature
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
5-Jul-2011 Rev. A
Page 1 of 4
SSRF4N60
Elektronische Bauelemente 4A , 600 V , RDS(ON) 2.4 Ω N-Channel Enhancement Mode Power MOSFET
ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise specified)
Parameter Symbol Min. Typ. Max. Unit Test Conditions Static
Gate-Threshold Voltage Drain-Source On-Resistance Drain-Sounce Breakdown Voltage Zero Gate Voltage Drain Current Gate-Body Leakage Current, Forward Gate-Body Leakage Current, Reverse VGS(th) RDS(ON) BVDSS IDSS IGSSF IGSSR 2.0 600 2.0 4.0 2.4 10 100 -100 V µA nA nA V VDS=VGS, ID=250µA VGS=10V, ID=2A VGS=0, ID=250µA VDS=600V, VGS=0 VGS=30V, VDS=0 VGS= -30V, VDS=0
Dynamic
Total Gate Charge
1.2 1.2
Qg Qgs Qgd Td(on) Tr
-
19.8 4 7.2 27 19 160 22 672
nS VDD=300V, ID =4.4A, RG=25 nC VDS=480V, ID=4.4A, VGS=10V
Gate-Source Charge Gate-Drain Charge
1.2 1.2
Turn-on Delay Time Rise Time
1.2
Turn-off Delay Time Fall Time
1.2
1.2
Td(off) Tf Ciss Coss Crss IS ISM VSD Trr
1
Input Capacitance Output Capacitance Reverse Transfer Capacitance Maximum Continuous Drain-Source Diode Forward Current Maximum Pulsed Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge
-
66 4.7
300 2.2
4.0 16 1.4 -
pF
VDS=25V, VGS=0, f =1.0MHz
A A V nS µC VGS=0, IS=4.0A VGS=0, IS=4.0A, IF / dt =100A/µs
Qrr
Notes: 1. Pulse Test: Pulse width < 300us, Duty cycle ≤ 2%. 2. Basically not affected by working temperature.
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
5-Jul-2011 Rev. A
Page 2 of 4
SSRF4N60
Elektronische Bauelemente 4A , 600 V , RDS(ON) 2.4 Ω N-Channel Enhancement Mode Power MOSFET
CHARACTERISTIC CURVE
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
5-Jul-2011 Rev. A
Page 3 of 4
SSRF4N60
Elektronische Bauelemente 4A , 600 V , RDS(ON) 2.4 Ω N-Channel Enhancement Mode Power MOSFET
CHARACTERISTIC CURVE
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
5-Jul-2011 Rev. A
Page 4 of 4
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