SST2605

1 -u -0 0R v 5J n2 1 e. C SST2605 Elektronische Bauelemente -4.0A, -30V,RDS(ON) 80mΩ P-Channel Enhancement Mode Power Mos.FET Electrical Characteristics( Tj=25 C Unless otherwise specified) Parameter Drain-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Gate Threshold Voltage Gate-Source Leakage Current Drain-Source Leakage Current (Tj=25 C) Drain-Source Leakage Current (Tj=55 C) Static Drain-Source On-Resistance 2 o o o Symbo l BVDSS BVDS/ Tj VGS(th) IGSS IDSS Min. -30 _ Typ. _ Max. _ _ Unit V V/ C V nA uA uA o Test Condition VGS=0V, ID=-250uA Reference to 25 C ,ID=-1mA VDS=VGS, ID=-250uA VGS=± 20V VDS=-30V,VGS=0 VDS=-24V,VGS=0 VGS=-10V, ID=-4.0A VGS=-4.5V, ID=-3.0A o -0.02 _ _ _ _ -1.0 _ _ _ _ -3.0 ±100 -1 -25 80 120 8.8 _ _ _ _ 5.5 1 2.6 7 6 18 4 400 RDS(ON) Qg Qgs Qgd Td(ON) Tr Td(Off) Tf Ciss Coss Crss Gfs _ _ _ _ _ _ _ _ _ _ _ mΩ Total Gate Charge 2 Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Forward Transconductance 2 nC ID=-4.0A VDS=-24V VGS=-4.5V _ _ _ _ VDD=-15V ID=-1A nS VGS=-10V RG=3.3Ω RD=15 Ω 640 _ _ 90 30 6 pF VGS=0V VDS=-25V f=1.0MHz _ _ S VDS=-5V, ID=-4.0A Source-Drain Diode Parameter Forward On Voltage 2 Symbol VDS Min. _ Typ. _ 21 14 Max. -1.2 Unit V Test Condition IS=-1.6A, VGS=0V. Is=-4.0A, VGS=0V dl/dt=100A/us Reverse Recovery Time 2 Trr Qrr _ _ _ _ nS nC Reverse Recovery Charge Notes: 1.Pulse width limited by safe operating area. 2.Pulse width≦300us, dutycycle≦2%. O 3.Surface mounted on 1 in2 copper pad of FR4 board; 156 C/W when mounted on Min. copper pad. http://www.SeCoSGmbH.com/ Any changing of specification will not be informed individual 15-Jun-2010 Rev. C Page 2 of 4 SST2605 Elektronische Bauelemente -4.0A -30V,RDS(ON) 80mΩ P-Channel Enhancement Mode Power Mos.FET Characteristics Curve Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature Fig 5. Forward Characteristics of Reverse Diode http://www.SeCoSGmbH.com/ Fig 6. Gate Threshold Voltage v.s. Junction Temperature Any changing of specification will not be informed individual 15-Jun-2010 Rev. C Page 3 of 4 SST2605 Elektronische Bauelemente -4.0A, -30V,RDS(ON) 80mΩ P-Channel Enhancement Mode Power Mos.FET Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance Fig 11. Switching Time Waveform http://www.SeCoSGmbH.com/ Fig 12. Gate Charge Waveform Any changing of specification will not be informed individual 15-Jun-2010 Rev. C Page 4 of 4