STT8205S
Elektronische Bauelemente 6A, 20V, RDS(ON) 28m N-Channel Enhancement Mode Power MOSFET
RoHS Compliant Product A suffix of “-C” specifies halogen & lead-free
DESCRIPTION
The STT8205S provide the designer with best combination of fast switching, low on-resistance and cost-effectiveness. The TSOP-6 package is universally used for all commercial-industrial surface mount applications.
A E
6 5 4
TSOP-6
L
FEATURES
B
Low on-resistance Capable of 2.5V gate drive Low drive current
F DG
1
2
3
C K
H J
MARKING CODE
REF.
8205S
= Date Code
A B C D E F
Millimeter Min. Max. 2.70 3.10 2.60 3.00 1.40 1.80 1.10 MAX. 1.90 REF. 0.30 0.50
REF. G H J K L
Millimeter Min. Max. 0 0.10 0.60 REF. 0.12 REF. 0° 10° 0.95 REF.
PACKAGE INFORMATION
Package TSOP-6 MPQ 3K LeaderSize 7’ inch
G S G D S D
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current 3 Pulsed Drain Current 1 Power Dissipation Maximum Junction to Ambient Linear Derating Factor Operating Junction & Storage Temperature Range TJ, TSTG
3
Symbol
VDS VGS VGS=4.5V, TA = 25°C VGS=4.5V, TA = 70°C ID IDM PD RθJA
Ratings
20 ±10 6 4.8 20 1.14 110 0.01 -55~150
Unit
V V A A W °C / W W / °C °C
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
09-Mar-2011 Rev. B
Page 1 of 4
STT8205S
Elektronische Bauelemente 6A, 20V, RDS(ON) 28m N-Channel Enhancement Mode Power MOSFET
ELECTRICAL CHARACTERISTICS (Tj = 25°C unless otherwise specified)
Parameter
Drain-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Gate-Threshold Voltage Forward Transfer Conductance Gate-Body Leakage Zero Gate Voltage Drain Current Tj =25°C Tj =75°C
Symbol
BVDSS △BVDS/△Tj VGS(th) Gfs IGSS IDSS
Min.
20 0.5 -
Typ. Static
0.03 20 23 4.5 7 30 70 40 65 1035 320 150
Max.
1.5 ±100 1 25 28 38 -
Unit
V V / °C V S nA μA μA mΩ
Test condition
VGS=0V, ID=250μA Reference to 25°C, ID=1mA VDS=VGS, ID=250μA VDS=10V, ID=6A VGS=±10V VDS=16V,VGS=0 VDS=16V,VGS=0 VGS=4.5V, ID=6A VGS=2.5V, ID=5.2A ID=6A VDS=20V VGS=5V VDS=10V ID=1A VGS=5V RG=6Ω RD=10Ω VGS=0 VDS=20V f=1.0MHz
Drain-Source On-Resistance 2 Total Gate Charge
2
RDS(ON) Qg Qgs Qgd Td(on) Tr Td(off) Tf Ciss Coss Crss
Gate-Source Charge Gate-Drain (“Miller”) Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance
2
nC
nS
pF
Source-Drain Diode
Forward On Voltage 2 VDS 1.2 V IS=1.7A, VGS=0
Notes: 1 Pulse width limited by Max. junction temperature. 2 Pulse width≦300us, duty cycle≦2%. 2 3 Surface mounted on 1 in copper pad of FR4 board; t≦5 sec. 180°C/W when mounted on min. copper pad.
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
09-Mar-2011 Rev. B
Page 2 of 4
STT8205S
Elektronische Bauelemente 6A, 20V, RDS(ON) 28m N-Channel Enhancement Mode Power MOSFET
CHARACTERISTICS CURVE
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
09-Mar-2011 Rev. B
Page 3 of 4
STT8205S
Elektronische Bauelemente 6A, 20V, RDS(ON) 28m N-Channel Enhancement Mode Power MOSFET
CHARACTERISTICS CURVE
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
09-Mar-2011 Rev. B
Page 4 of 4
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