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1N4109D2B

1N4109D2B

  • 厂商:

    SEME-LAB

  • 封装:

  • 描述:

    1N4109D2B - SILICON ZENER DIODE - Seme LAB

  • 详情介绍
  • 数据手册
  • 价格&库存
1N4109D2B 数据手册
SILICON ZENER DIODE 1N4109D2A / 1N4109D2B • • • • • • VZ = 15V Low Noise Standard ±5% Zener Voltage Tolerance Hermetic Ceramic Package Designed as a Drop-In Replacement for “D-5A”/”B-MELF” Package. Space Level and High-Reliability Screening Options Available Low Leakage ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise stated) PT TJ TSTG TSP TA = 25°C Total Power Dissipation at Junction Temperature Range Storage Temperature Range Maximum Soldering Pad Temperature for 20s 250mW -65 to +200°C -65 to +200°C 300°C ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise stated) Symbols VZ ZZT IR ND IZM Parameters Zener Voltage Maximum Zener Impedance Reverse Leakage Current Noise Density Zener Current Test Conditions IZT = 250µA IZT = 250µA VR = 11.4V IZT = 250µA Min. 14.25 Typ. 15 Max. 15.75 100 0.05 40 16.3 Units V Ω µA µV Hz mA Semelab Limited reserves the right to change test conditions, parameter limits and package dimensions without notice. Information furnished by Semelab is believed to be both accurate and reliable at the time of going to press. However Semelab assumes no responsibility for any errors or omissions discovered in its use. Semelab encourages customers to verify that datasheets are current before placing orders. S emelab Coventry Road, Lutterworth, Leicestershire, LE17 4JB Semelab Limited Telephone +44 (0) 1455 556565 Fax +44 (0) 1455 552612 Email: sales@semelab-tt.com Document Number 8856 Website: http://www.semelab-tt.com Issue 1 Page 1 of 3 SILICON ZENER DIODE 1N4109D2A / 1N4109D2B MECHANICAL DATA DLCC2 Variant A (D2A) PAD 1 PAD 2 DIMENSION A B C D ANODE CATHODE mm 5.00 ±0.10 2.61 ±0.10 1.08 ±0.10 1.76 ±0.10 Inches 0.197 ±0.004 0.103 ±0.004 0.043 ±0.004 0.069 ±0.004 DLCC2 Variant B (D2B) PAD 1 PAD 2 PAD 3 DIMENSION A B C D ANODE CATHODE LID CONTACT TO ANODE* mm 5.00 ±0.10 2.61 ±0.10 1.08 ±0.10 1.76 ±0.10 Inches 0.197 ±0.004 0.103 ±0.004 0.043 ±0.004 0.069 ±0.004 SOLDER PAD LAYOUT D-5A DLCC2/ D-5A MELF OVERLAY DIMENSION A B C mm 6.25 1.70 2.67 Inches 0.246 0.067 0.105 A B * The additional contact provides a connection to the lid in the application. Connecting the metal lid to a known electrical potential stops deep dielectric discharge in space applications; see the Space Weather link www.semelab.co.uk/dlcc2.html on the Semelab web site. Package variant to be specified at order. Other Package Outlines may be available – Contact Semelab Sales to Enquire S emelab Coventry Road, Lutterworth, Leicestershire, LE17 4JB Semelab Limited Telephone +44 (0) 1455 556565 Fax +44 (0) 1455 552612 Email: sales@semelab-tt.com Document Number 8856 Issue 1 Page 2 of 3 Website: http://www.semelab-tt.com C SILICON ZENER DIODE 1N4109D2A / 1N4109D2B SCREENING OPTIONS Space Level (JQRS/ESA) and High Reliability options are available in accordance with the High Reliability and Screening Options Handbook available for download from the from the TT electronics Semelab web site. ESA Quality Level Products are based on the testing procedures specified in the generic ESCC 5000 and in the corresponding part detail specifications. Semelabs QR216 and QR217 processing specifications (JQRS), in conjunction with the companies ISO 9001:2000 approval present a viable alternative to the American MILPRF-19500 space level processing. QR217 (Space Level Quality Conformance) is based on the quality conformance inspection requirements of MIL-PRF19500 groups A (table V), B (table VIa), C (table VII) and also ESA / ESCC 5000 (chart F4) lot validation tests. QR216 (Space Level Screening) is based on the screening requirements of MIL-PRF-19500 (table IV) and also ESA /ESCC 5000 (chart F3). JQRS parts are processed to the device data sheet and screened to QR216 with conformance testing to Q217 groups A and B in accordance with MIL-STD-750 methods and procedures. Additional conformance options are available, for example Pre-Cap Visual Inspection, Buy-Off Visit or Data Packs. These are chargeable and must be specified at the order stage (See Ordering Information). Minimum order quantities may apply. Alternative or additional customer specific conformance or screening requirements would be considered. Contact Semelab sales with enquires. ORDERING INFORMATION Part numbers are built up from Type, Package Variant, and screening level. The part numbers are extended to include the additional options as shown below. Type – See Electrical Stability Characteristics Table Package Variant – See Mechanical Data Screening Level – See Screening Options (ESA / JQRS) Additional Options: Customer Pre-Cap Visual Inspection Customer Buy-Off visit Data Pack Solderability Samples Scanning Electron Microscopy Radiography (X-ray) Total Dose Radiation Test MIL-PRF-19500 (QR217) Group B charge Group B destructive mechanical samples Group C charge Group C destructive electrical samples Group C destructive mechanical samples ESA/ESCC Lot Validation Testing (subgroup 1) charge LVT1 destructive samples (environmental) LVT1 destructive samples (mechanical) Lot Validation Testing (subgroup 2) charge LVT2 endurance samples (electrical) Lot Validation Testing (subgroup 3) charge LVT3 destructive samples (mechanical) .CVP .CVB .DA .SS .SEM .XRAY .RAD .GRPB .GBDM (12 pieces) .GRPC .GCDE (12 pieces) .GCDM (6 pieces) .LVT1 .L1DE (15 pieces) .L1DM (15 pieces) .LVT2 .L2D (15 pieces) .LVT3 .L3D (5 pieces) Additional Option Notes: 1) All ‘Additional Options’ are chargeable and must be specified at order stage. 2) When Group B,C or LVT is required, additional electrical and mechanical destructive samples must be ordered 3) All destructive samples are marked the same as other production parts unless otherwise requested. MARKING DETAILS Parts can be laser marked with approximately 7 characters on two lines and always includes cathode identification. Typical marking would include part or specification number, week of seal or serial number subject to available space and legibility. Customer specific marking requirements can be arranged at the time of order. Example Marking: Example ordering information: The following example is for the 1N4109 part with package variant A, JQRS screening, additional Group C conformance testing and a Data pack. Part Numbers: 1N4109D2A-JQRS (Include quantity for flight parts) 1N4109D2A-JQRS.GRPC (chargeable conformance option) 1N4109D2A-JQRS.GCDE (charge for destructive parts) 1N4109D2A-JQRS.GCDM (charge for destructive parts) 1N4109D2A-JQRS.DA (charge for Data pack) Customers with any specific requirements (e.g. marking or screening) may be supplied with a similar alternative part number (there is maximum 20 character limit to part numbers). Contact Semelab sales with enquiries High Reliability and Screening Options Handbook link: http://www.semelab.co.uk/pdf/misc/documents/hirel_and_screening_options.pdf S emelab Coventry Road, Lutterworth, Leicestershire, LE17 4JB Semelab Limited Telephone +44 (0) 1455 556565 Fax +44 (0) 1455 552612 Email: sales@semelab-tt.com Website: http://www.semelab-tt.com Document Number 8856 Issue 1 Page 3 of 3
1N4109D2B
1. 物料型号:型号为STM32F103C8T6,是一款基于ARM Cortex-M3内核的32位微控制器,适用于广泛的嵌入式应用。

2. 器件简介:STM32F103C8T6具备高性能、低功耗、丰富的外设接口,适合用于工业控制、消费电子、医疗设备等领域。

3. 引脚分配:该芯片有84个引脚,包括电源引脚、地引脚、I/O引脚、通信接口引脚等,具体分配需参考数据手册。

4. 参数特性:核心频率72MHz,Flash存储64KB,SRAM 20KB,工作电压2.0V至3.6V,工作温度范围-40至+85摄氏度。

5. 功能详解:包括GPIO管理、定时器、ADC、DAC、通信接口(USART、SPI、I2C)、中断管理等。

6. 应用信息:适用于需要高性能处理和丰富外设接口的应用场景,如电机控制、电池管理系统、智能传感器等。

7. 封装信息:LQFP-84封装,尺寸为10mm x 10mm,适用于标准PCB布局。
1N4109D2B 价格&库存

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