SML300HB12GG
Attributes: -Aerospace build standard -High reliability -Lightweight -Cu and metal matrix base plate versions (pin finned versions available) -AlN isolation -Trench gate igbts Maximum rated values/Electrical Properties
Collector-emitter voltage DC collector current Repetitive peak collector current Total power dissipation Tc=70C, Tvj=175C Tc=25C,Tvj=175C tp=1msec,Tc=80C Tc=25C
Vce
1200 320 455 600 850
V A A W
Ic, nom Ic Icrm Ptot
Gate-emitter peak voltage DC forward diode current Repetitive peak forward current I2t value per diode tp=1msec Vr=0V, tp=10msec, Tvj=125C Tvj=150C RMS, 50Hz, t=1min Ic=300A,Vge=15V, Tc=25C Ic=300A,Vge=15V,Tc=125C Ic=300A,Vge=15V,Tc=150C Ic=6.4mA,Vce=Vge, Tvj=25C f=1MHz,Tvj=25C,Vce=25V, Vge=0V f=1MHz,Tvj=25C,Vce=25V, Vge=0V Vce=1200V,Vge=0V,Tvj=25C Vce=1200,Vge=0V,Tvj=125C Vce=0V,Vge=20V,Tvj=25C
Vges If Ifrm
+/-20 400 800
V A A
I2t Visol Vce(sat)
11000 10500 2500 1.7 2.0 5.0 5.8 21.5 0.98
A2sec V 2.15 2.45 6.5 V
Isolation test voltage Collector-emitter saturation voltage Gate threshold voltage Input capacitance Reverse transfer capacitance Collector emitter cut off current Gate emitter cut off current
Vge(th) Cies Cres Ices Iges
V nF nF
0.3 400
mA mA nA
Turn on delay time
Ic=300A, Vcc=600V Vge=+/-15V,Rg=2Ω,Tvj=125C Ic=300A, Vcc=600V Vge=+/-15V,Rg=2Ω,Tvj=125C Ic=300A, Vcc=600V Vge=+/-15V,Rg=2Ω,Tvj=125C Ic=300A, Vcc=600V Vge=+/-15V,Rg=2Ω, Tvj=125C
td,on
280
nsec
Rise time
tr
65
nsec
Turn off delay time
td,off
630
nsec
Fall time
tf
130
nsec
Turn on energy loss per pulse Ic=300A,Vce=600V,Vge=15V Rge=2Ω,L=30nH Tvj=125C Turn off energy loss per pulse Ic=300A,Vce=600V,Vge=15V Rge=2Ω,L=30nH Tvj=125C SC Data tp≤10µsec, Vge≤15V Vcc=360V, Tvj=25C Vce(max)=Vces-Lσdi/dt Tvj=150C
Eon
35
mJ
Eoff Isc Lσce Rc
45 2800 2000 18 1.0
mJ A A nH mΩ
Stray Module inductance Terminal-chip resistance
Diode characteristics
Forward voltage Ic=300A,Vge=0V, Tc=25C Ic=300A,Vge=0V, Tc=125C Vf 1.6 1.6 1.8 V 1.8 V
Peak reverse recovery current If=300A, -di/dt=6200A/µsec Vce=300V,Vge=-10V,Tvj=125C Recovered charge If=300A, -di/dt=6200A/µsec Vce=600V,Vge=-10V,Tvj=125C If=300A, -di/dt=6200A/µsec Vce=600V,Vge=-10V,Tvj=125C
Irm
375
A
Qr
75
µC
Reverse recovery energy
Erec
33
mJ
Thermal Properties
Thermal resistance junction to case (MMC) Thermal resistance case to heatsink Maximum junction temperature Maximum operating temperature Igbt Diode RθJ-C
Min
Typ
Max
0.042 0.1 K/W
RθC-hs
0.045
K/W
Tvj Top -55
175 175
C C
Storage Temperature
Tstg
-55
175
C
GAL
GAR
CIRCUIT DIAGRAM