HFC1N70

HFC1N70 Dec 2008 BVDSS = 700 V HFC1N70 700V N-Channel MOSFET FEATURES  Originative New Design  Superior Avalanche Rugged Technology  Robust Gate Oxide Technology  Very Low Intrinsic Capacitances  Excellent Switching Characteristics  Unrivalled Gate Charge : 4.5 nC (Typ.)  Extended Safe Operating Area  Lower RDS(ON) : 14.0 Ω (Typ.) @VGS=10V  100% Avalanche Tested RDS(on) typ = 14.0 Ω ID = 0.5 A TO-126 1 2 3 1.Gate 2. Drain 3. Source Absolute Maximum Ratings Symbol VDSS ID IDM VGS EAS IAR EAR dv/dt PD TJ, TSTG TL Drain-Source Voltage Drain Current Drain Current Drain Current Gate-Source Voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt TC=25℃ unless otherwise specified Parameter – Continuous (TC = 25℃) – Continuous (TC = 100℃) – Pulsed (Note 1) Value 700 0.5 0.35 2.0 ±30 (Note 2) (Note 1) (Note 1) (Note 3) Units V A A A V mJ A mJ V/ns W W/℃ ℃ ℃ 33 0.5 0.75 5.5 7.5 0.06 -55 to +150 300 Power Dissipation (TC = 25℃) - Derate above 25℃ Operating and Storage Temperature Range Maximum lead temperature for soldering purposes, 1/8” from case for 5 seconds * Drain current limited by junction temperature Thermal Resistance Characteristics Symbol RθJC RθJA Junction-to-Case Junction-to-Ambient Parameter Typ. --Max. 17 62.5 ℃/W Units ◎ SEMIHOW REV.A0,Dec 2008 HFC1N70 Electrical Characteristics TC=25 °C Symbol Parameter unless otherwise specified Test Conditions Min Typ Max Units On Characteristics VGS RDS(ON) Gate Threshold Voltage Static Drain-Source On-Resistance VDS = VGS, ID = 250 ㎂ VGS = 10 V, ID = 0.25 A 2.5 --14 4.5 17 V Ω Off Characteristics BVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = 250 ㎂ ID = 250 ㎂, Referenced to25℃ VDS = 700 V, VGS = 0 V VDS = 560 V, TC = 125℃ VGS = 30 V, VDS = 0 V VGS = -30 V, VDS = 0 V 700 ------0.65 ------1 10 100 -100 V V/℃ ㎂ ㎂ ㎁ ㎁ ΔBVDSS Breakdown Voltage Temperature Coefficient /ΔTJ IDSS IGSSF IGSSR Zero Gate Voltage Drain Current Gate-Body Leakage Current, Forward Gate-Body Leakage Current, Reverse Dynamic Characteristics Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance VDS = 25 V, VGS = 0 V, f = 1.0 MHz ---150 15 3.5 195 20 4.5 ㎊ ㎊ ㎊ Switching Characteristics td(on) tr td(off) tf Qg Qgs Qgd Turn-On Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge (Note 4,5) VDS = 300 V, ID = 0.8 A, RG = 25 Ω -------- 12 40 20 30 4.5 1.0 2.5 30 140 60 80 6.0 --- ㎱ ㎱ ㎱ ㎱ nC nC nC VDS = 560 V, ID = 0.8 A, VGS = 10 V (Note 4,5) Source-Drain Diode Maximum Ratings and Characteristics IS ISM VSD trr Qrr Continuous Source-Drain Diode Forward Current Pulsed Source-Drain Diode Forward Current Source-Drain Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge IS = 0.5 A, VGS = 0 V IS = 0.8 A, VGS = 0 V diF/dt = 100 A/μs (Note 4) --------160 0.45 0.5 2.0 1.4 --A V ㎱ μC Notes ; 1. Repetitive Rating : Pulse width limited by maximum junction temperature 2. L=96mH, IAS=0.8A, VDD=50V, RG=25Ω, Starting TJ =25°C 3. ISD≤0.5A, di/dt≤300A/μs, VDD≤BVDSS , Starting TJ =25 °C 4. Pulse Test : Pulse Width ≤ 300μs, Duty Cycle ≤ 2% 5. Essentially Independent of Operating Temperature ◎ SEMIHOW REV.A0,Dec 2008 HFC1N70 Typical Characteristics Figure 1. On Region Characteristics Figure 2. Transfer Characteristics 80 RDS(on) , [Ω] Drain-Source On-Resistance 70 60 50 40 30 20 10 0 0.0 0.3 0.6 0.9 1.2 1.5 VGS = 10V VGS = 20V * Note : TJ = 25oC 1.8 2.1 2.4 2.7 ID , Drain Current [A] Figure 3. On Resistance Variation vs Drain Current and Gate Voltage Figure 4. Body Diode Forward Voltage Variation with Source Current and Temperature 12 250 Ciss 200 Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd Crss = Cgd VGS, Gate-Source Voltage [V] 10 VDS = 140V VDS = 350V Capacitances [pF] 8 150 VDS = 560V 6 100 Coss Crss ※ Note ; 1. VGS = 0 V 2. f = 1 MHz 4 50 2 * Notes : ID = 0.8 A 0 -1 10 0 10 0 10 1 0 1 2 3 4 5 VDS, Drain-Source Voltage [V] QG, Total Gate Charge [nC] Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics ◎ SEMIHOW REV.A0,Dec 2008 HFC1N70 Typical Characteristics 1.2 (continued) 3.0 BVDSS, (Normalized) Drain-Source Breakdown Voltage 1.1 RDS(ON), (Normalized) Drain-Source On-Resistance 2.5 2.0 1.0 1.5 1.0 * Note : 1. VGS = 10 V 2. ID = 0.3 A 0.9 * Note : 1. VGS = 0 V 2. ID = 250µA 0.5 0.8 -100 -50 0 50 100 150 200 0.0 -100 -50 0 50 100 150 200 TJ, Junction Temperature [oC] TJ, Junction Temperature [oC] Figure 7. Breakdown Voltage Variation vs Temperature Figure 8. On-Resistance Variation vs Temperature 101 Operation in This Area is Limited by R DS(on) 0.5 0.4 ID, Drain Current [A] 10 0 1 ms 10 ms 100 ms ID, Drain Current [A] 100 µs 0.3 0.2 10-1 * Notes : 1. TC = 25 oC 2. TJ = 150 oC 3. Single Pulse DC 0.1 10-2 100 101 102 103 0.0 25 50 75 100 125 150 VDS, Drain-Source Voltage [V] TC, Case Temperature [oC] Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current vs Case Temperature 10 1 D=0.5 0.2 0.1 Zθ JC Thermal Response (t), 10 0 0.05 0.02 0.01 single pulse ※ Notes : (t) W 1. Zθ JC = 17 ℃/ Max. 2. Duty Factor, D=t1/t2 3. TJM - TC = PDM * Zθ JC (t) 10 -1 PDM t1 t2 10 1 10 -2 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 2 t1, Square Wave Pulse Duration [sec] Figure 11. Transient Thermal Response Curve ◎ SEMIHOW REV.A0,Dec 2008 HFC1N70 Fig 12. Gate Charge Test Circuit & Waveform 50KΩ 12V 200nF 300nF Same Type as DUT VDS VGS Qg 10V VGS Qgs Qgd DUT 3mA Charge Fig 13. Resistive Switching Test Circuit & Waveforms VDS RG RL VDD ( 0.5 rated VDS ) VDS 90% 10V DUT Vin 10% td(on) t on tr td(off) t off tf Fig 14. Unclamped Inductive Switching Test Circuit & Waveforms L VDS VDD ID RG DUT VDD BVDSS IAS BVDSS 1 EAS = ---- LL IAS2 -------------------2 BVDSS -- VDD ID (t) VDS (t) tp 10V Time ◎ SEMIHOW REV.A0,Dec 2008 HFC1N70 Fig 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms DUT + VDS _ IS L Driver RG Same Type as DUT VDD VGS • dv/dt controlled by RG • IS controlled by pulse period VGS ( Driver ) Gate Pulse Width D = -------------------------Gate Pulse Period 10V IFM , Body Diode Forward Current IS ( DUT ) IRM di/dt Body Diode Reverse Current VDS ( DUT ) Body Diode Recovery dv/dt Vf VDD Body Diode Forward Voltage Drop ◎ SEMIHOW REV.A0,Dec 2008 HFC1N70 Package Dimension TO-126 8.5max φ ± 3.2 0.2 2.8max 3.8±0.2 12max 1.27typ 2.5±0.2 0.78±0.08 2.3max 2.3max 0.5±0.1 13max 1.2±0.2 ◎ SEMIHOW REV.A0,Dec 2008