HFS10N65S

HFS10N65S Sep 2009 BVDSS = 650 V HFS10N65S 650V N-Channel MOSFET FEATURES  Originative New Design  Superior Avalanche Rugged Technology  Robust Gate Oxide Technology  Very Low Intrinsic Capacitances  Excellent Switching Characteristics  Unrivalled Gate Charge : 29 nC (Typ.)  Extended Safe Operating Area  Lower RDS(ON) : 0.83 Ω (Typ.) @VGS=10V  100% Avalanche Tested RDS(on) typ = 0.83 Ω ID = 9.2 A TO-220F 1 2 3 1.Gate 2. Drain 3. Source Absolute Maximum Ratings Symbol VDSS ID IDM VGS EAS IAR EAR dv/dt PD TJ, TSTG TL Drain-Source Voltage Drain Current Drain Current Drain Current Gate-Source Voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt TC=25℃ unless otherwise specified Parameter – Continuous (TC = 25℃) – Continuous (TC = 100℃) – Pulsed (Note 1) Value 650 9.2* 5.5* 36.8* ±30 (Note 2) (Note 1) (Note 1) (Note 3) Units V A A A V mJ A mJ V/ns W W/℃ ℃ ℃ 650 9.2 15.6 4.5 50 0.4 -55 to +150 300 Power Dissipation (TC = 25℃) - Derate above 25℃ Operating and Storage Temperature Range Maximum lead temperature for soldering purposes, 1/8” from case for 5 seconds *Drain current limited by maximum junction temperature Thermal Resistance Characteristics Symbol RθJC RθJA Junction-to-Case Junction-to-Ambient Parameter Typ. --Max. 2.5 62.5 Units ℃/W ◎ SEMIHOW REV.A0,Sep 2009 HFS10N65S Electrical Characteristics TC=25 °C Symbol Parameter unless otherwise specified Test Conditions Min Typ Max Units On Characteristics VGS RDS(ON) Gate Threshold Voltage Static Drain-Source On-Resistance VDS = VGS, ID = 250 ㎂ VGS = 10 V, ID = 4.6 A 2.0 --0.83 4.0 1.0 V Ω Off Characteristics BVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = 250 ㎂ ID = 250 ㎂, Referenced to 25℃ VDS = 650 V, VGS = 0 V VDS = 520 V, TC = 125℃ VGS = 30 V, VDS = 0 V VGS = -30 V, VDS = 0 V 650 ------0.7 ------1 10 100 -100 V V/℃ ㎂ ㎂ ㎁ ㎁ ΔBVDSS Breakdown Voltage Temperature Coefficient /ΔTJ IDSS IGSSF IGSSR Zero Gate Voltage Drain Current Gate-Body Leakage Current, Forward Gate-Body Leakage Current, Reverse Dynamic Characteristics Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance VDS = 25 V, VGS = 0 V, f = 1.0 MHz ---1450 145 13 1885 190 17 ㎊ ㎊ ㎊ Switching Characteristics td(on) tr td(off) tf Qg Qgs Qgd Turn-On Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge (Note 4,5) VDS = 325 V, ID = 9.2 A, RG = 25 Ω -------- 23 69 144 77 29 6.8 10.3 55 150 300 165 38 --- ㎱ ㎱ ㎱ ㎱ nC nC nC VDS = 520V, ID = 9.2 A, VGS = 10 V (Note 4,5) Source-Drain Diode Maximum Ratings and Characteristics IS ISM VSD trr Qrr Continuous Source-Drain Diode Forward Current Pulsed Source-Drain Diode Forward Current Source-Drain Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge IS = 9.2 A, VGS = 0 V IS = 9.2 A, VGS = 0 V diF/dt = 100 A/μs (Note 4) --------420 4.2 9.2 36.8 1.4 --A V ㎱ μC Notes ; 1. Repetitive Rating : Pulse width limited by maximum junction temperature 2. L=14.2mH, IAS=9.2A, VDD=50V, RG=25Ω, Starting TJ =25°C 3. ISD≤9.2A, di/dt≤200A/μs, VDD≤BVDSS , Starting TJ =25 °C 4. Pulse Test : Pulse Width ≤ 300μs, Duty Cycle ≤ 2% 5. Essentially Independent of Operating Temperature ◎ SEMIHOW REV.A0,Sep 2009 HFS10N65S Typical Characteristics ID, Drain Current [A] ID, Drain Current [A] VDS, Drain-Source Voltage [V] VGS, Gate-Source Voltage [V] Figure 1. On Region Characteristics Figure 2. Transfer Characteristics 2.0 RDS(ON)[Ω], Drain-Source On-Resistance 1.5 VGS = 10V 1.0 VGS = 20V 0.5 * Note : TJ = 25oC 0.0 0 5 10 15 20 25 30 35 ID, Drain Current[A] IDR, Reverse Drain Current [A] VSD, Source-Drain Voltage [V] Figure 3. On Resistance Variation vs Drain Current and Gate Voltage 3000 Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd Crss = Cgd Figure 4. Body Diode Forward Voltage Variation with Source Current and Temperature 12 VDS = 130V VGS, Gate-Source Voltage [V] 2500 10 VDS = 325V VDS = 520V Capacitances [pF] 2000 Ciss 8 1500 6 Coss 1000 ∗ Note ; 1. VGS = 0 V 2. f = 1 MHz 4 500 Crss 2 * Note : ID = 9.2A 0 10-1 0 100 101 0 4 8 12 16 20 24 28 32 VDS, Drain-Source Voltage [V] QG, Total Gate Charge [nC] Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics ◎ SEMIHOW REV.A0,Sep 2009 HFS10N65S Typical Characteristics (continued) 2.5 BVDSS, (Normalized) Drain-Source Breakdown Voltage RDS(ON), (Normalized) Drain-Source On-Resistance 2.0 1.5 1.0 0.5 ∗ Note : 1. VGS = 10 V 2. ID = 4.6 A 0.0 -100 -50 0 50 100 150 200 TJ, Junction Temperature [oC] TJ, Junction Temperature [oC] Figure 7. Breakdown Voltage Variation vs Temperature 10 Figure 8. On-Resistance Variation vs Temperature 102 Operation in This Area is Limited by R DS(on) 10 µs 8 ID, Drain Current [A] 10 1 ID, Drain Current [A] 103 10 0 100 µs 1 ms 10 ms 100 ms DC 6 4 10-1 * Notes : 1. TC = 25 oC 2. TJ = 150 oC 3. Single Pulse 2 10-2 100 101 102 0 25 50 75 100 125 150 VDS, Drain-Source Voltage [V] TC, Case Temperature [oC] Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current vs Case Temperature ZθJC(t), Thermal Response 100 D=0.5 0.2 0.1 10-1 0.05 0.02 0.01 single pulse * Notes : 1. ZθJC(t) = 2.5 oC/W Max. 2. Duty Factor, D=t1/t2 3. TJM - TC = PDM * ZθJC(t) PDM t1 10-3 10-2 10-1 10-2 10-5 t2 100 101 10-4 t1, Square Wave Pulse Duration [sec] Figure 11. Transient Thermal Response Curve ◎ SEMIHOW REV.A0,Sep 2009 HFS10N65S Fig 12. Gate Charge Test Circuit & Waveform 50KΩ 12V 200nF 300nF Same Type as DUT VDS VGS Qg 10V VGS Qgs Qgd DUT 3mA Charge Fig 13. Resistive Switching Test Circuit & Waveforms VDS RG RL VDD ( 0.5 rated VDS ) VDS 90% 10V DUT Vin 10% td(on) t on tr td(off) t off tf Fig 14. Unclamped Inductive Switching Test Circuit & Waveforms L VDS VDD ID RG DUT VDD BVDSS IAS BVDSS 1 EAS = ---- LL IAS2 -------------------2 BVDSS -- VDD ID (t) VDS (t) tp 10V Time ◎ SEMIHOW REV.A0,Sep 2009 HFS10N65S Fig 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms DUT + VDS _ IS L Driver RG Same Type as DUT VDD VGS • dv/dt controlled by RG • IS controlled by pulse period VGS ( Driver ) Gate Pulse Width D = -------------------------Gate Pulse Period 10V IFM , Body Diode Forward Current IS ( DUT ) IRM di/dt Body Diode Reverse Current VDS ( DUT ) Body Diode Recovery dv/dt Vf VDD Body Diode Forward Voltage Drop ◎ SEMIHOW REV.A0,Sep 2009 HFS10N65S Package Dimension TO-220F ±0.20 ± .18 3 0 0.2 ±0.20 2.54±0.20 0.70±0.20 φ 15.87±0.20 3.30±0.20 12.42±0.20 6.68±0.20 2.76±0.20 9.75±0.20 1.47max 0.80±0.20 2.54typ 2.54typ 0.50±0.20 ◎ SEMIHOW REV.A0,Sep 2009