HFW9N50_HFI9N50
June 2005
BVDSS = 500 V
HFW9N50 / HFI9N50
500V N-Channel MOSFET
FEATURES
Originative New Design Superior Avalanche Rugged Technology Robust Gate Oxide Technology Very Low Intrinsic Capacitances Excellent Switching Characteristics Unrivalled Gate Charge : 35 nC (Typ.) Extended Safe Operating Area Lower RDS(ON) : 0.58 Ω (Typ.) @VGS=10V 100% Avalanche Tested
RDS(on) typ = 0.58 Ω ID = 9.0 A
D2-PAK I2-PAK
HFW9N50
HFI9N50
1.Gate 2. Drain 3. Source
Absolute Maximum Ratings
Symbol VDSS ID IDM VGS EAS IAR EAR dv/dt PD Drain-Source Voltage Drain Current Drain Current Drain Current Gate-Source Voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Power Dissipation (TA = 25℃) *
TC=25℃ unless otherwise specified
Parameter – Continuous (TC = 25℃) – Continuous (TC = 100℃) – Pulsed
(Note 1)
Value 500 9.0 5.7 36 ±30
(Note 2) (Note 1) (Note 1) (Note 3)
Units V A A A V mJ A mJ V/ns W W W/℃ ℃ ℃
360 9.0 14.7 4.5 3.13 147 1.18 -55 to +150 300
Power Dissipation (TC = 25℃) - Derate above 25℃ TJ, TSTG TL Operating and Storage Temperature Range Maximum lead temperature for soldering purposes, 1/8” from case for 5 seconds
Thermal Resistance Characteristics
Symbol RθJC RθJA RθJA Junction-to-Case Junction-to-Ambient* Junction-to-Ambient Parameter Typ. ---Max. 0.85 40 62.5 ℃/W Units
* When mounted on the minimum pad size recommended (PCB Mount)
◎ SEMIHOW REV.A0 June 2005
HFW9N50_HFI9N50
Electrical Characteristics TC=25 °C
Symbol Parameter
unless otherwise specified
Test Conditions
Min
Typ
Max
Units
On Characteristics
VGS RDS(ON) Gate Threshold Voltage Static Drain-Source On-Resistance VDS = VGS, ID = 250 ㎂ VGS = 10 V, ID = 4.5 A 2.5 --0.58 4.5 0.73 V Ω
Off Characteristics
BVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = 250 ㎂ ID = 250 ㎂, Referenced to25℃ VDS = 500 V, VGS = 0 V VDS = 400 V, TC = 125℃ VGS = 30 V, VDS = 0 V VGS = -30 V, VDS = 0 V 500 ------0.55 ------1 10 100 -100 V V/℃ ㎂ ㎂ ㎁ ㎁ ΔBVDSS Breakdown Voltage Temperature Coefficient /ΔTJ IDSS IGSSF IGSSR Zero Gate Voltage Drain Current Gate-Body Leakage Current, Forward Gate-Body Leakage Current, Reverse
Dynamic Characteristics
Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance VDS = 25 V, VGS = 0 V, f = 1.0 MHz ---1300 150 24 1700 195 31 ㎊ ㎊ ㎊
Switching Characteristics
td(on) tr td(off) tf Qg Qgs Qgd Turn-On Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge
(Note 4,5)
VDS = 250 V, ID = 9.0 A, RG = 25 Ω
--------
35 120 70 80 35 7.3 17
70 240 140 160 45 ---
㎱ ㎱ ㎱ ㎱ nC nC nC
VDS = 400V, ID = 9.0 A, VGS = 10 V
(Note 4,5)
Source-Drain Diode Maximum Ratings and Characteristics
IS ISM VSD trr Qrr Continuous Source-Drain Diode Forward Current Pulsed Source-Drain Diode Forward Current Source-Drain Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge IS = 9.0 A, VGS = 0 V IS = 9.0 A, VGS = 0 V diF/dt = 100 A/μs (Note 4) --------320 2.8 9.0 36 1.4 --A V ㎱ μC
Notes ; 1. Repetitive Rating : Pulse width limited by maximum junction temperature 2. L=8mH, IAS=9.0A, VDD=50V, RG=25Ω, Starting TJ =25°C 3. ISD≤9.0A, di/dt≤200A/μs, VDD≤BVDSS , Starting TJ =25 °C 4. Pulse Test : Pulse Width ≤ 300μs, Duty Cycle ≤ 2% 5. Essentially Independent of Operating Temperature
◎ SEMIHOW REV.A0 June 2005
HFW9N50_HFI9N50
Typical Characteristics
101
ID , Drain Current [A]
ID , Drain Current [A]
VGS 15 V 10 V 8.0 V 7.0 V 6.5 V 6.0 V Bottom : 5.5 V Top :
10
1
150 ℃ 25 ℃ 10
0
100
-55 ℃
※ Note 1. VDS = 40V 2. 250μ s Pulse Test
※ Note : 1. 250μ s Pulse Test 2. TC = 25 ℃
10
-1
10
-1
100
101
10
-1
2
4
6
8
10
VDS , Drain-Source Voltage [V]
VGS , Gate-Source Voltage [V]
Figure 1. On Region Characteristics
Figure 2. Transfer Characteristics
1.8 1.6 VGS = 10V 1.4 1.2 1.0 0.8 0.6 0.4 VGS = 20V
IDR , Reverse Drain Current [A]
RDS(on) , [Ω] Drain-Source On-Resistance
10
1
10
0
150 ℃
-1
25 ℃
※ Note : TJ = 25 ℃
※ Note : 1. VGS = 0V 2. 250μ s Pulse Test
0
5
10
15
20
25
30
10
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
ID , Drain Current [A]
VSD , Source-Drain Voltage [V]
Figure 3. On Resistance Variation vs Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage Variation with Source Current and Temperature
12
2400
VGS, Gate-Source Voltage [V]
Ciss
1800
Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd Crss = Cgd
VDS = 100V
10
VDS = 250V VDS = 400V
Capacitances [pF]
8
1200
Coss
6
600
Crss
※ Note ; 1. VGS = 0 V 2. f = 1 MHz
4
2
※ Note : ID = 9.0 A
0 -1 10
0
10
0
10
1
0
5
10
15
20
25
30
35
40
VDS, Drain-Source Voltage [V]
QG, Total Gate Charge [nC]
Figure 5. Capacitance Characteristics
Figure 6. Gate Charge Characteristics
◎ SEMIHOW REV.A0 June 2005
HFW9N50_HFI9N50
Typical Characteristics
1.2
(continued)
3.0
BVDSS, (Normalized) Drain-Source Breakdown Voltage
1.1
RDS(ON), (Normalized) Drain-Source On-Resistance
2.5
2.0
1.0
1.5
1.0
※ Note : 1. VGS = 10 V 2. ID = 4.5 A
0.9
※ Note : 1. VGS = 0 V 2. ID = 250 μ A
0.5
0.8 -100
-50
0
50
100
o
150
200
0.0 -100
-50
0
50
100
o
150
200
TJ, Junction Temperature [ C]
TJ, Junction Temperature [ C]
Figure 7. Breakdown Voltage Variation vs Temperature
Figure 8. On-Resistance Variation vs Temperature
10
10
2
Operation in This Area is Limited by R DS(on)
8
ID, Drain Current [A]
10
1
1 ms 10 ms DC
ID, Drain Current [A]
100 µs 10 µs
6
4
10
0
※ Notes : o 1. TC = 25 C o 2. TJ = 150 C 3. Single Pulse
2
10
-1
10
0
10
1
10
2
10
3
0 25
50
75
100
125
150
VDS, Drain-Source Voltage [V]
TC, Case Temperature [ ℃]
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current vs Case Temperature
10
0
D=0.5
Zθ JC Thermal Response (t),
0.2
10
-1
0.1 0.05 0.02 0.01 single pulse
※ Notes : (t) W 1. Zθ JC = 0.85 ℃/ Max. 2. Duty Factor, D=t1/t2 3. TJM - TC = PDM * Zθ JC (t)
PDM t1
-3
10
-2
t2
10
0
10
-5
10
-4
10
10
-2
10
-1
10
1
t1, Square Wave Pulse Duration [sec]
Figure 11. Transient Thermal Response Curve
◎ SEMIHOW REV.A0 June 2005
HFW9N50_HFI9N50
Fig 12. Gate Charge Test Circuit & Waveform
50KΩ 12V 200nF 300nF
Same Type as DUT VDS
VGS Qg
10V
VGS
Qgs
Qgd
DUT
3mA
Charge
Fig 13. Resistive Switching Test Circuit & Waveforms
VDS RG
RL VDD
( 0.5 rated VDS )
VDS
90%
10V
DUT
Vin
10%
td(on) t on
tr
td(off) t off
tf
Fig 14. Unclamped Inductive Switching Test Circuit & Waveforms
L VDS VDD ID RG DUT VDD BVDSS IAS
BVDSS 1 EAS = ---- LL IAS2 -------------------2 BVDSS -- VDD
ID (t) VDS (t)
tp
10V
Time
◎ SEMIHOW REV.A0 June 2005
HFW9N50_HFI9N50
Fig 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms
DUT + VDS _ IS L Driver RG
Same Type as DUT
VDD
VGS
• dv/dt controlled by RG • IS controlled by pulse period
VGS ( Driver )
Gate Pulse Width D = -------------------------Gate Pulse Period
10V
IFM , Body Diode Forward Current
IS ( DUT ) IRM
di/dt
Body Diode Reverse Current
VDS ( DUT )
Body Diode Recovery dv/dt
Vf
VDD
Body Diode Forward Voltage Drop
◎ SEMIHOW REV.A0 June 2005
HFW9N50_HFI9N50
Package Dimension
◎ SEMIHOW REV.A0 June 2005
HFW9N50_HFI9N50
Package Dimension
◎ SEMIHOW REV.A0 June 2005