SEMIX302GB176HDS_11

SEMiX302GB176HDs Absolute Maximum Ratings Symbol IGBT VCES IC ICnom ICRM ICRM = 2xICnom VCC = 1000 V VGE ≤ 20 V VCES ≤ 1700 V Tj = 150 °C Tc = 25 °C Tc = 80 °C 1700 308 219 200 400 -20 ... 20 Tj = 125 °C 10 -55 ... 150 Tc = 25 °C Tc = 80 °C 389 262 200 IFRM = 2xIFnom tp = 10 ms, sin 180°, Tj = 25 °C 400 2000 -40 ... 150 Tterminal = 80 °C AC sinus 50Hz, t = 1 min 600 -40 ... 125 4000 V A A A A V µs °C A A A A A °C A °C V Conditions Values Unit SEMiX® 2s Trench IGBT Modules SEMiX302GB176HDs Features • Homogeneous Si • Trench = Trenchgate technology • VCE(sat) with positive temperature coefficient • UL recognised file no. E63532 VGES tpsc Tj IF IFnom IFRM IFSM Tj Module It(RMS) Tstg Visol Inverse diode Tj = 150 °C Typical Applications* • AC inverter drives • UPS • Electronic welders Characteristics Symbol IGBT VCE(sat) VCE0 rCE VGE(th) ICES Cies Coes Cres QG RGint td(on) tr Eon td(off) tf Eoff Rth(j-c) per IGBT Conditions IC = 200 A VGE = 15 V chiplevel Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C VGE = 15 V VGE=VCE, IC = 8 mA VGE = 0 V VCE = 1700 V VCE = 25 V VGE = 0 V VGE = - 8 V...+ 15 V Tj = 25 °C VCC = 1200 V IC = 200 A VGE = ±15 V RG on = 6.5  RG off = 6.5  Tj = 125 °C Tj = 125 °C Tj = 125 °C Tj = 125 °C Tj = 125 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C f = 1 MHz f = 1 MHz f = 1 MHz Tj = 25 °C Tj = 125 °C min. typ. 2 2.5 1 0.9 5.0 7.8 max. 2.45 2.9 1.2 1.1 6.3 9.0 6.4 3 Unit V V V V m m V mA mA nF nF nF nC  ns ns mJ ns ns mJ 5.2 5.8 0.1 17.6 0.73 0.58 1866 3.75 225 45 130 665 105 77 0.1 K/W GB © by SEMIKRON Rev. 2 – 23.03.2011 1 SEMiX302GB176HDs Characteristics Symbol Conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C rF Tj = 25 °C Tj = 125 °C IF = 200 A Tj = 125 °C di/dtoff = 3100 A/µs T = 125 °C j VGE = -15 V Tj = 125 °C VCC = 1200 V per diode 0.9 0.7 2.0 2.7 min. typ. 1.5 1.4 1.1 0.9 2.0 2.7 235 77 43 max. 1.70 1.6 1.3 1.1 2.0 2.7 Unit V V V V m m A µC mJ Inverse diode VF = VEC IF = 200 A VGE = 0 V chip VF0 SEMiX® 2s Trench IGBT Modules SEMiX302GB176HDs Features • Homogeneous Si • Trench = Trenchgate technology • VCE(sat) with positive temperature coefficient • UL recognised file no. E63532 IRRM Qrr Err Rth(j-c) Module LCE RCC'+EE' Rth(c-s) Ms Mt w 0.15 18 K/W nH m m K/W res., terminal-chip per module to heat sink (M5) TC = 25 °C TC = 125 °C 3 to terminals (M6) 2.5 0.7 1 0.045 5 5 250 Nm Nm Nm g  K Typical Applications* • AC inverter drives • UPS • Electronic welders Temperatur Sensor R100 B100/125 Tc=100°C (R25=5 k) R(T)=R100exp[B100/125(1/T-1/T100)]; T[K]; 493 ± 5% 3550 ±2% GB 2 Rev. 2 – 23.03.2011 © by SEMIKRON SEMiX302GB176HDs Fig. 1: Typ. output characteristic, inclusive RCC'+ EE' Fig. 2: Rated current vs. temperature IC = f (TC) Fig. 3: Typ. turn-on /-off energy = f (IC) Fig. 4: Typ. turn-on /-off energy = f (RG) Fig. 5: Typ. transfer characteristic Fig. 6: Typ. gate charge characteristic © by SEMIKRON Rev. 2 – 23.03.2011 3 SEMiX302GB176HDs Fig. 7: Typ. switching times vs. IC Fig. 8: Typ. switching times vs. gate resistor RG Fig. 9: Typ. transient thermal impedance Fig. 10: Typ. CAL diode forward charact., incl. RCC'+EE' Fig. 11: Typ. CAL diode peak reverse recovery current Fig. 12: Typ. CAL diode recovery charge 4 Rev. 2 – 23.03.2011 © by SEMIKRON SEMiX302GB176HDs SEMiX 2s spring configuration This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff. © by SEMIKRON Rev. 2 – 23.03.2011 5