SEMIX302KD16S

SEMiX302KD16s Absolute Maximum Ratings Symbol IFAV IFSM i2t Conditions Tc = 85 °C Tc = 100 °C Tj = 25 °C Tj = 130 °C Tj = 25 °C Tj = 130 °C Values 300 240 8500 7500 361000 281000 1700 1600 -40 ... 130 -40 ... 125 Unit A A A A A2s A2s V V °C °C V V Recitifier Diode sin. 180° 10 ms 10 ms SEMiX 2s ® VRSM VRRM Tj Module Rectifier Diode Module SEMiX302KD16s Tstg Visol AC sinus 50Hz 1 min 1s 4000 4800 Features • Terminal height 17 mm • Chips soldered directly to isolated substrate Characteristics Symbol Diode VF V(TO) rT IRD Rth(j-c) Rth(j-c) Module Rth(c-s) Ms Mt a w 250 per chip per module to heat sink (M5) to terminals (M6) 3 2.5 0.045 5 5 5 * 9,81 K/W K/W Nm Nm m/s2 g Tj = 25 °C, IF = 900 A Tj = 130 °C Tj = 130 °C Tj = 130 °C, VRD = VRRM per diode per diode 0.091 1.6 0.85 1.1 15 V V mΩ mA K/W K/W sin. 180 K/W K/W Conditions min. typ. max. Unit Typical Applications* • Input Bridge Rectifier for AC/DC motor control • Power supply KD © by SEMIKRON Rev. 26 – 25.03.2010 1 SEMiX302KD16s Fig. 1L: Power dissipation per thyristor/diode vs. on-state current Fig. 1R: Power dissipation per thyristor/diode vs. ambient temperature Fig. 3L: Power dissipation of two modules vs. direct current Fig. 3R: Power dissipation of two modules vs. case temperature 2 Rev. 26 – 25.03.2010 © by SEMIKRON SEMiX302KD16s Fig. 4L: Power dissipation of three modules vs. direct current Fig. 4R: Power dissipation of three modules vs. case temperature Fig. 6: Transient thermal impedance vs. time Fig. 7: On-state characteristics Fig. 8: Surge overload current vs. time © by SEMIKRON Rev. 26 – 25.03.2010 3 SEMiX302KD16s spring configuration SEMiX 2s This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our personal. 4 Rev. 26 – 25.03.2010 © by SEMIKRON