SEMiX303GD12Vc
Absolute Maximum Ratings Symbol
IGBT VCES IC ICnom ICRM ICRM = 3xICnom VCC = 600 V VGE ≤ 15 V VCES ≤ 1200 V Tj = 175 °C Tc = 25 °C Tc = 80 °C 1200 448 342 300 900 -20 ... 20 Tj = 125 °C 10 -40 ... 175 Tc = 25 °C Tc = 80 °C 327 244 300 IFRM = 3xIFnom tp = 10 ms, sin 180°, Tj = 25 °C 900 1485 -40 ... 175 Tterminal = 80 °C AC sinus 50Hz, t = 1 min 600 -40 ... 125 4000 V A A A A V µs °C A A A A A °C A °C V
Conditions
Values
Unit
SEMiX® 33c
VGES tpsc Tj IF IFnom
Inverse diode
SEMiX303GD12Vc Features
• Homogeneous Si • VCE(sat) with positive temperature coefficient • High short circuit capability • UL recognised file no. E63532
Tj = 175 °C
IFRM IFSM Tj Module It(RMS) Tstg Visol
Typical Applications*
• AC inverter drives • UPS • Electronic Welding
Characteristics Symbol
IGBT VCE(sat) VCE0 rCE VGE(th) ICES Cies Coes Cres QG RGint td(on) tr Eon td(off) tf Eoff Rth(j-c)
Remarks
• Case temperature limited to TC=125°C max. • Product reliability results are valid for Tj=150°C • Dynamic values apply to the following combination of resistors: RGon,main = 1,0 RGoff,main = 1,0 RG,X = 2,2 RE,X = 1,0
Conditions
IC = 300 A VGE = 15 V chiplevel Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C VGE = 15 V VGE = 0 V VCE = 1200 V VCE = 25 V VGE = 0 V VGE = - 8 V...+ 15 V Tj = 25 °C VCC = 600 V IC = 300 A VGE = ±15 V RG on = 2.1 RG off = 2.1 di/dton = 4200 A/µs di/dtoff = 2600 A/µs du/dtoff = 6600 V/ µs per IGBT Tj = 150 °C Tj = 150 °C Tj = 150 °C Tj = 150 °C Tj = 150 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C
min.
typ.
1.75 2.2 0.94 0.88 2.7 4.4
max.
2.2 2.5 1.04 0.98 3.9 5.1 6.5 0.3
Unit
V V V V m m V mA mA nF nF nF nC ns ns mJ ns ns mJ
VGE=VCE, IC = 12 mA Tj = 25 °C Tj = 150 °C f = 1 MHz f = 1 MHz f = 1 MHz
5.5
6 0.1 18.0 1.77 1.77 3300 2.50 470 72 26.5 665 109 36.3
0.1
K/W
GD © by SEMIKRON Rev. 2 – 16.02.2011 1
SEMiX303GD12Vc
Characteristics Symbol Conditions
Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C rF Tj = 25 °C Tj = 150 °C IF = 300 A Tj = 150 °C di/dtoff = 4600 A/µs T = 150 °C j VGE = -15 V Tj = 150 °C VCC = 600 V per diode 1.1 0.7 2.7 3.5
min.
typ.
2.2 2.2 1.3 0.9 3.0 4.2 283 52 21.4
max.
2.52 2.5 1.5 1.1 3.4 4.6
Unit
V V V V m m A µC mJ
Inverse diode VF = VEC IF = 300 A VGE = 0 V chip VF0
SEMiX® 33c
IRRM Qrr Err Rth(j-c) Module LCE RCC'+EE'
0.19 20
K/W nH m m K/W
SEMiX303GD12Vc Features
• Homogeneous Si • VCE(sat) with positive temperature coefficient • High short circuit capability • UL recognised file no. E63532
res., terminal-chip per module to heat sink (M5)
TC = 25 °C TC = 125 °C 3 to terminals (M6) 2.5
0.7 1 0.014 5 5 900
Rth(c-s) Ms Mt w
Nm Nm Nm g K
Typical Applications*
• AC inverter drives • UPS • Electronic Welding
Temperatur Sensor R100 B100/125 Tc=100°C (R25=5 k) R(T)=R100exp[B100/125(1/T-1/T100)]; T[K]; 493 ± 5% 3550 ±2%
Remarks
• Case temperature limited to TC=125°C max. • Product reliability results are valid for Tj=150°C • Dynamic values apply to the following combination of resistors: RGon,main = 1,0 RGoff,main = 1,0 RG,X = 2,2 RE,X = 1,0
GD 2 Rev. 2 – 16.02.2011 © by SEMIKRON
SEMiX303GD12Vc
Fig. 1: Typ. output characteristic, inclusive RCC'+ EE'
Fig. 2: Rated current vs. temperature IC = f (TC)
Fig. 3: Typ. turn-on /-off energy = f (IC)
Fig. 4: Typ. turn-on /-off energy = f (RG)
Fig. 5: Typ. transfer characteristic
Fig. 6: Typ. gate charge characteristic
© by SEMIKRON
Rev. 2 – 16.02.2011
3
SEMiX303GD12Vc
Fig. 7: Typ. switching times vs. IC
Fig. 8: Typ. switching times vs. gate resistor RG
Fig. 9: Typ. transient thermal impedance
Fig. 10: Typ. CAL diode forward charact., incl. RCC'+EE'
Fig. 11: Typ. CAL diode peak reverse recovery current
Fig. 12: Typ. CAL diode recovery charge
4
Rev. 2 – 16.02.2011
© by SEMIKRON
SEMiX303GD12Vc
SEMiX 33c
pinout
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff.
© by SEMIKRON
Rev. 2 – 16.02.2011
5
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