SEMIX341D16S

SEMiX341D16s Absolute Maximum Ratings Symbol IFAV IFSM i2t Conditions Tc = 85 °C Tc = 100 °C Tj = 25 °C Tj = 130 °C Tj = 25 °C Tj = 130 °C Values 340 290 2500 2000 31250 20000 1700 1600 -40 ... 130 -40 ... 125 Unit A A A A A2s A2s V V °C °C V V Recitifier Diode sin. 180° 10 ms 10 ms SEMiX 13 ® VRSM VRRM Tj Module Bridge Rectifier Module (uncontrolled) SEMiX341D16s Tstg Visol AC sinus 50Hz 1 min 1s 4000 4800 Characteristics Features • Terminal height 17 mm • Chips soldered directly to isolated substrate Symbol Diode VF V(TO) rT IRD Rth(j-c) Rth(j-c) Module Rth(c-s) Ms Mt a w Conditions Tj = 25 °C, IF = 400 A Tj = 130 °C Tj = 130 °C Tj = 130 °C, VRD = VRRM per diode per diode min. typ. max. 1.75 0.9 2.7 4.5 Unit V V mΩ mA K/W K/W Typical Applications* • Input Bridge Rectifier for AC/DC motor control • power supply sin. 180 0.22 K/W K/W K/W per chip per module to heat sink (M5) to terminals (M6) 3 2.5 350 0.04 5 5 5 * 9,81 K/W Nm Nm m/s2 g D © by SEMIKRON Rev. 66 – 25.03.2010 1 SEMiX341D16s Fig. 4L: Power dissipation per module vs. direct current Fig. 4R: Power dissipation per module vs. case temperature Fig. 6: Transient thermal impedance vs. time Fig. 7: On-state characteristics Fig. 8: Surge overload current vs. time 2 Rev. 66 – 25.03.2010 © by SEMIKRON SEMiX341D16s spring configuration SEMiX 13 This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our personal. © by SEMIKRON Rev. 66 – 25.03.2010 3