SEMIX402GAR066HDS_11

SEMiX402GAR066HDs Absolute Maximum Ratings Symbol IGBT VCES IC ICnom ICRM ICRM = 2xICnom VCC = 360 V VGE ≤ 15 V VCES ≤ 600 V Tj = 175 °C Tc = 25 °C Tc = 80 °C 600 502 379 400 800 -20 ... 20 Tj = 150 °C 6 -40 ... 175 Tc = 25 °C Tc = 80 °C 543 397 400 IFRM = 2xIFnom tp = 10 ms, sin 180°, Tj = 25 °C 800 1800 -40 ... 175 Tc = 25 °C Tc = 80 °C 566 412 400 IFRM = 2xIFnom tp = 10 ms, sin 180°, Tj = 25 °C 800 1800 -40 ... 175 Tterminal = 80 °C AC sinus 50Hz, t = 1 min 600 -40 ... 125 4000 V A A A A V µs °C A A A A A °C A A A A A °C A °C V Conditions Values Unit SEMiX® 2s Trench IGBT Modules SEMiX402GAR066HDs Features • Homogeneous Si • Trench = Trenchgate technology • VCE(sat) with positive temperature coefficient • UL recognised file no. E63532 VGES tpsc Tj IF IFnom IFRM IFSM Tj Inverse diode Tj = 175 °C Freewheeling diode IF IFnom IFRM IFSM Tj Module It(RMS) Tstg Visol Tj = 175 °C Typical Applications* • Matrix Converter • Resonant Inverter • Current Source Inverter Remarks • Case temperature limited to TC=125°C max. • Product reliability results are valid for Tj=150°C • For short circuit: Soft RGoff recommended • Take care of over-voltage caused by stray inductance Characteristics Symbol IGBT VCE(sat) VCE0 rCE VGE(th) ICES Cies Coes Cres QG RGint Conditions IC = 400 A VGE = 15 V chiplevel Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C VGE = 15 V VGE = 0 V VCE = 600 V VCE = 25 V VGE = 0 V VGE = - 8 V...+ 15 V Tj = 25 °C Tj = 25 °C Tj = 150 °C min. typ. 1.45 1.7 0.9 0.85 1.4 2.1 max. 1.85 2.1 1 0.9 2.1 3.0 6.5 0.45 Unit V V V V m m V mA mA nF nF nF nC  VGE=VCE, IC = 6.4 mA Tj = 25 °C Tj = 150 °C f = 1 MHz f = 1 MHz f = 1 MHz 5 5.8 0.15 24.7 1.54 0.73 3200 1.00 GAR © by SEMIKRON Rev. 1 – 23.03.2011 1 SEMiX402GAR066HDs Characteristics Symbol td(on) tr Eon td(off) tf Eoff Rth(j-c) VCC = 300 V IC = 400 A VGE = ±15 V RG on = 4.5  RG off = 4.5  Conditions min. Tj = 150 °C Tj = 150 °C Tj = 150 °C Tj = 150 °C Tj = 150 °C Tj = 150 °C typ. 150 125 22 900 65 24 max. Unit ns ns mJ ns ns mJ SEMiX® 2s Trench IGBT Modules SEMiX402GAR066HDs Features • Homogeneous Si • Trench = Trenchgate technology • VCE(sat) with positive temperature coefficient • UL recognised file no. E63532 per IGBT Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C Tj = 25 °C IF = 400 A Tj = 150 °C di/dtoff = 3700 A/µs T = 150 °C j VGE = -8 V Tj = 150 °C VCC = 300 V per diode Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C IF = 400 A Tj = 150 °C di/dtoff = 3700 A/µs T = 150 °C j VGE = -8 V Tj = 150 °C VCC = 300 V per diode 0.9 0.75 0.7 1.0 Tj = 150 °C 0.9 0.75 0.8 1.1 1.4 1.4 1 0.85 1.0 1.4 250 47 10 0.12 1.60 1.6 1.1 0.95 1.3 1.6 K/W V V V V m m A µC mJ Inverse diode VF = VEC IF = 400 A VGE = 0 V chip VF0 rF IRRM Qrr Err Rth(j-c) 0.15 1.3 1.3 1 0.85 0.9 1.2 250 47 10 0.15 18 1.53 1.5 1.1 0.95 1.1 1.4 K/W V V V V m m A µC mJ K/W nH m m K/W Typical Applications* • Matrix Converter • Resonant Inverter • Current Source Inverter Freewheeling diode VF = VEC IF = 400 A VGE = 0 V chip VF0 rF IRRM Qrr Err Rth(j-c) Module LCE RCC'+EE' Rth(c-s) Ms Mt w Temperatur Sensor R100 B100/125 res., terminal-chip per module to heat sink (M5) Remarks • Case temperature limited to TC=125°C max. • Product reliability results are valid for Tj=150°C • For short circuit: Soft RGoff recommended • Take care of over-voltage caused by stray inductance TC = 25 °C TC = 125 °C 3 to terminals (M6) 2.5 0.7 1 0.045 5 5 250 Nm Nm Nm g  K Tc=100°C (R25=5 k) R(T)=R100exp[B100/125(1/T-1/T100)]; T[K]; 493 ± 5% 3550 ±2% GAR 2 Rev. 1 – 23.03.2011 © by SEMIKRON SEMiX402GAR066HDs Fig. 1: Typ. output characteristic, inclusive RCC'+ EE' Fig. 2: Rated current vs. temperature IC = f (TC) Fig. 3: Typ. turn-on /-off energy = f (IC) Fig. 4: Typ. turn-on /-off energy = f (RG) Fig. 5: Typ. transfer characteristic Fig. 6: Typ. gate charge characteristic © by SEMIKRON Rev. 1 – 23.03.2011 3 SEMiX402GAR066HDs Fig. 7: Typ. switching times vs. IC Fig. 8: Typ. switching times vs. gate resistor RG Fig. 9: Typ. transient thermal impedance Fig. 10: Typ. CAL diode forward charact., incl. RCC'+EE' Fig. 11: Typ. CAL diode peak reverse recovery current Fig. 12: Typ. CAL diode recovery charge 4 Rev. 1 – 23.03.2011 © by SEMIKRON SEMiX402GAR066HDs SEMiX 2s spring configuration This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff. © by SEMIKRON Rev. 1 – 23.03.2011 5